Stress and warpage improvements for stiffener ring package with exposed die(s)
A package, and method for building the package is disclosed. The package includes a substrate having a first surface. The package further includes a die having opposing first and second surfaces, and a lateral surface, with the second surface of the die coupled to the first surface of the substrate. The package further includes a stiffener element having a first surface and a lateral surface, with the first surface of the stiffener element coupled to the first surface of the substrate. The package further includes molding material disposed on the first surface of the substrate and the lateral surface of the die. The coefficient of thermal expansion (CTE) value of the molding material is greater than a CTE value of the die. The first molding surface of the molding material is coplanar with the first surface of the die.
1. A system comprising:
a package comprising:
a substrate having a first surface;
a die having a first surface, a second surface and a lateral surface, wherein the first surface and the second surface are opposed to each other, and the second surface of the die is coupled to the first surface of the substrate;
a stiffener element having a first surface, wherein the first surface of the stiffener element is coupled to the first surface of the substrate via a first interface; and
molding material having a first molding surface disposed onto the first surface of the substrate and onto the lateral surface of the die, wherein a coefficient of thermal expansion (CTE) value of the molding material is greater than a CTE value of the die;
wherein the molding material is further disposed onto a lateral side of the stiffener element, the CTE value of the molding material is less than a CTE value of the stiffener element.
2. The system of claim 1 , wherein the first molding surface of the molding material is coplanar with the first surface of the die.
3. The system of claim 2 , further including a heat sink coupled to the first surface of the die and the first molding surface.
4. The system of claim 1 , wherein the stiffener element further comprises a top stiffener surface, wherein the first molding surface covers at least a portion of the top stiffener surface.
5. The system of claim 4 , wherein the first molding surface covers an entirety of the top stiffener surface.
6. The system of claim 1 , wherein the molding material comprises a plurality of molding portions, wherein the plurality of molding portions comprises a first molding portion having a first molding portion CTE value, and a second molding portion having a second molding portion CTE value, wherein the first molding portion CTE value is greater than the second molding portion CTE value.
7. The system of claim 6 , wherein the first molding portion is in contact with the lateral surface of the stiffener element, wherein the second molding portion is in contact with a lateral surface of the die.
8. The system of claim 6 , wherein the first molding portion is formed upon the first surface of the substrate, wherein the second molding portion is formed upon the first molding portion.
9. The system of claim 1 , wherein the stiffener element is shaped as a ring.
10. The system of claim 1 , wherein the stiffener element is shaped as at least one of a cross or a bar.
11. The system of claim 1 , wherein the die is configured as a chip-on-wafer-on-substrate (CoWoS).
12. The system of claim 1 wherein the system includes a circuit board operatively coupled to the substrate.
13. The system of claim 1 , further comprising a plurality of dies, wherein the molding material, the stiffener element, and the plurality of dies cover greater than 90% of the first surface of the substrate.
14. The system of claim 1 , wherein a perimeter of the substrate is not covered by the molding material.
15. The system of claim 1 , wherein the substrate has a dimension equal to or greater than 45 mm.
16. The system of claim 1 , wherein the substrate has a dimension equal to or greater than 65 mm.
17. A method comprising:
providing a die having a first surface and a second surface opposite to the first surface;
coupling the second surface of the die to a first surface of a substrate;
coupling a first surface of a stiffener element to the first surface of the substrate; and
disposing molding material on:
the first surface of the substrate;
at least one lateral side of the stiffener element; and
at least one lateral surface of the die, wherein a first molding surface of the molding material is coplanar with the first surface of the die.
18. The method of claim 17 , further comprising coupling a heat sink to the first surface of the die and the first molding surface.
19. A system comprising:
a package comprising:
a substrate having a first surface and having a dimension equal to or greater than 45 mm;
a die having a first surface, a second surface and a lateral surface, wherein the first surface and the second surface are opposed to each other, and the second surface of the die is coupled to the first surface of the substrate;
a stiffener element having a first surface, wherein the first surface of the stiffener element is coupled to the first surface of the substrate via a first interface; and molding material having a first molding surface disposed onto the first surface of the substrate and onto the lateral surface of the die, wherein a coefficient of thermal expansion (CTE) value of the molding material is greater than a CTE value of the die.
20. The system of claim 19 , wherein the molding material comprises a plurality of molding portions, wherein the plurality of molding portions comprises a first molding portion having a first molding portion CTE value, and a second molding portion having a second molding portion CTE value, wherein the first molding portion CTE value is greater than the second molding portion CTE value.