Electronic device and manufacturing method of electronic device
Disclosed are an electronic device and a manufacturing method of an electronic device. The manufacturing method includes the following. A first substrate is provided. The first substrate includes a plurality of chips. A second substrate is provided. A transfer process is performed to sequentially transfer a first chip and a second chip among the chips to the second substrate. The second chip is adjacent to the first chip. A first angle is between a first extension direction of a first side of the first chip and an extension direction of a first boundary of the second substrate. A second angle is between a second extension direction of a second side of the second chip and the extension direction of the first boundary of the second substrate. The first angle is different from the second angle.
1. A manufacturing method of an electronic device, comprising:
providing a first substrate comprising a plurality of chips;
providing a second substrate;
performing a transfer process to sequentially transfer a first chip and a second chip among the plurality of chips to the second substrate, wherein the second chip is adjacent to the first chip, a first angle is between a first extension direction of a first side of the first chip and an extension direction of a first boundary of the second substrate, a second angle is between a second extension direction of a second side of the second chip and the extension direction of the first boundary of the second substrate, and the first angle is different from the second angle, wherein the transfer process comprises rotating the first substrate, rotating the second substrate, or rotating a rotary disk of a robot arm;
forming a protective layer on the first chip and the second chip; and
forming a sealing member between a periphery of the second substrate and a periphery of the protective layer.
2. The manufacturing method according to claim 1 , further comprising:
transferring a third chip among the plurality of chips to the second substrate, wherein the third chip is adjacent to the second chip, a third angle is between a third extension direction of a third side of the third chip and the extension direction of the first boundary of the second substrate, and the third angle is different from the first angle and the second angle.
3. The manufacturing method according to claim 1 , wherein a difference between the first angle and the second angle is less than 90 degrees.
4. The manufacturing method according to claim 1 , wherein the transfer process comprises rotating a rotary disk.
5. The manufacturing method according to claim 1 , further comprising:
forming a metal layer and an opening hole, wherein the metal layer is located between the second substrate and one of the first chip and the second chip, and an orthogonal projection of the one of the first chip and the second chip on the second substrate is overlapped with the opening hole.
6. The manufacturing method according to claim 5 , further comprising:
forming a pad between the metal layer and the other one of the first chip and the second chip.
7. The manufacturing method according to claim 6 , further comprising:
electrically connecting the one of the first chip and the second chip to the pad through a solder, and directly disposing the other one of the first chip and the second chip on the pad.
8. The manufacturing method according to claim 1 , further comprising:
providing a release film, wherein the release film is located between the first substrate and the plurality of chips.
9. The manufacturing method according to claim 1 , wherein the second substrate comprises a wafer, a glass substrate, or a polyimide substrate.
10. The manufacturing method according to claim 1 , wherein the first chip and the second chip are in a same shape.
11. The manufacturing method according to claim 1 , wherein the first chip and the second chip are in different shapes.
12. The manufacturing method according to claim 1 , wherein a difference between the first angle and the second angle is less than 45 degrees.
13. The manufacturing method according to claim 1 , wherein a difference between the first angle and the second angle is less than 20 degrees.
14. An electronic device, comprising:
a substrate;
a metal layer disposed on the substrate;
a dielectric layer disposed on the metal layer and having an opening hole;
a pad disposed on the dielectric layer;
a first chip and a second chip disposed on the substrate, wherein an orthogonal projection of the first chip on the substrate is overlapped with the opening hole, the first chip is electrically connected to the metal layer, and the second chip is directly disposed on the pad and electrically connected to the pad;
a protective layer disposed on the first chip and the second chip; and
a sealing member disposed between a periphery of the substrate and a periphery of the protective layer,
wherein the second chip is adjacent to the first chip, a first angle is between a first extension direction of a first side of the first chip and an extension direction of a first boundary of the substrate, a second angle is between a second extension direction of a second side of the second chip and the extension direction of the first boundary of the substrate, and the first angle is different from the second angle.