IP Library › Granted Patent US 12,346,009
Granted Patent B2
US 12,346,009 · App. 17/877,131 · Granted Jul 1, 2025

Imaging device with heat dissipation mechanism

Inventors: Hiroyuki Kuroki (Osaka, JP); Hikaru Tsuchitani (Osaka, JP); Yuuji Matsuo (Osaka, JP); Norikazu Kaneda (Osaka, JP)
Assignee: Panasonic Intellectual Property Management Co., Ltd.
G03B17/55G03B17/563H04N23/51H04N23/52H04N23/53H05K7/20145H05K7/20154H05K7/2039
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Quick Facts
Patent No.
US 12,346,009
App. No.
17/877,131
Granted
Jul 1, 2025
Kind
B2
Abstract

An imaging device includes: a heat source; a heat dissipation mechanism for dissipating heat of the heat source; and a main body to which the heat source and the heat dissipation mechanism are attached, wherein the heat dissipation mechanism is disposed on an outer peripheral portion of the main body.

Claims (43)

1. An imaging device comprising:

a heat source;

a heat dissipation mechanism for dissipating heat of the heat source;

a main body housing which includes the heat source,

a fan housing provided on the upper portion of the main body housing; and

an intake port for drawing air and an exhaust port for discharging air,

wherein the heat dissipation mechanism includes a heat sink, a fan, and a heat transfer member that transfers heat of the heat source to the heat sink,

wherein the fan housing includes the fan, the intake port, the exhaust port and the heat sink,

wherein the fan housing is a protruding portion having multiple surfaces formed by protruding from the main body housing at the upper portion of the main body housing,

wherein the intake port and the exhaust port are provided on different surfaces among the multiple surfaces,

wherein the multiple surfaces include an upper surface, a lateral surface, and a lower surface, and

wherein the intake port is provided on the lower surface among the multiple surfaces and the exhaust port is provided on the lateral surface among the multiple surfaces.

2. The imaging device according to claim 1 , wherein the heat dissipation mechanism is disposed at a central upper portion of the main body housing.

3. The imaging device according to claim 2 , further comprising an EVF unit,

wherein the heat dissipation mechanism is disposed in front of the EVF unit.

4. The imaging device according to claim 2 , wherein the heat dissipation mechanism is disposed directly above an optical axis.

5. The imaging device according to claim 1 , further comprising a grip provided on a side of the main body housing,

wherein the heat dissipation mechanism is disposed at the central upper portion of the main body housing or on a side opposite to the grip with respect to the main body housing.

6. The imaging device according to claim 1 , wherein

the heat source has a main surface extending in a direction intersecting an optical axis direction, and the heat transfer member extends from the heat source in a direction along the main surface and is connected to the heat sink.

7. The imaging device according to claim 6 , wherein

the heat source includes at least a first heat source and a second heat source, and

the heat transfer member includes a first heat transfer member that transfers heat of the first heat source to the heat sink, and a second heat transfer member that transfers heat of the second heat source to the heat sink.

8. The imaging device according to claim 6 , further comprising a sensor substrate that supports an image sensor as the heat source,

wherein the heat transfer member includes a follower that follows movement of the sensor substrate driven by BIS control, and a sheet attached to the heat sink.

9. The imaging device according to claim 1 , wherein the intake port and the exhaust port are located in a place that is difficult to see in a front view of the fan housing.

10. The imaging device according to claim 1 , wherein the heat sink includes a plurality of fins,

wherein the fan applies air to the fins by blowing the air to the fins.

11. The imaging device according to claim 1 , further comprising a duct that connects the intake port and the exhaust port and passes through the heat sink,

wherein the fan housing includes the duct.

12. An imaging device comprising:

a heat source;

a heat dissipation mechanism for dissipating heat of the heat source;

a main body housing which includes the heat source,

a fan housing provided on the upper portion of the main body housing; and

an intake port for drawing air and an exhaust port for discharging air,

wherein the heat dissipation mechanism includes a heat sink, a fan, and a heat transfer member that transfers heat of the heat source to the heat sink,

wherein the fan housing includes the fan, the intake port, the exhaust port and the heat sink,

wherein the fan housing is a protruding portion having multiple surfaces formed by protruding from the main body housing at the upper part of the main body housing,

wherein the intake port and the exhaust port are provided on different surfaces among the multiple surfaces, and

wherein the intake port takes in air in a first axial direction, and the exhaust port exhausts air in a second axial direction that is 90 degrees different from the first axial direction.

13. The imaging device according to claim 12 ,

wherein a number of the intake port is one, and a number of the exhaust port is two.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 15, 2022
From: KUROKI, HIROYUKI; TSUCHITANI, HIKARU; MATSUO, YUUJI; KANEDA, NORIKAZU
To: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Reel/Frame 061784/0760 →
Priority Claims (1)
JP 2021-126849 · Aug 2, 2021 · national
Continuity (1)
Related Publication 20230035644A1 · Feb 2, 2023
References Cited (55)
US 2272046A · Findley · 1942 [cited by applicant]
US 5300976A · Lim · 1994 [cited by examiner]
US 5332031A · Kiga · 1994 [cited by applicant]
US 5951137A · Bortz · 1999 [cited by examiner]
US 6135714A · Hsu · 2000 [cited by examiner]
US 10462929B1 · Su · 2019 [cited by examiner]
US 10842042B2 · Kim · 2020 [cited by examiner]
US 11852834B1 · Wang · 2023 [cited by examiner]
US 20030184717A1 · Kim · 2003 [cited by examiner]
US 20060290893A1 · Lim · 2006 [cited by examiner]
US 20080074509A1 · Sano · 2008 [cited by applicant]
US 20090016710A1 · Nozaki · 2009 [cited by examiner]
US 20100059211A1 · Li · 2010 [cited by examiner]
US 20140307088A1 · DeJesus · 2014 [cited by examiner]
US 20160295095A1 · Jannard · 2016 [cited by examiner]
US 20170070681A1 · Nattress · 2017 [cited by examiner]
US 20170346996A1 · Kida · 2017 [cited by examiner]
US 20180054542A1 · Petty et al. · 2018 [cited by applicant]
US 20180084194A1 · Woodman · 2018 [cited by examiner]
US 20190239383A1 · Kim · 2019 [cited by examiner]
US 20190335075A1 · Ueda · 2019 [cited by examiner]
US 20200036852A1 · Petty · 2020 [cited by applicant]
US 20200110449A1 · Chang · 2020 [cited by applicant]
US 20200120250A1 · Colin · 2020 [cited by applicant]
US 20200288048A1 · Makara · 2020 [cited by examiner]
US 20200288586A1 · Lu · 2020 [cited by examiner]
US 20200344922A1 · Wada · 2020 [cited by examiner]
US 20210055631A1 · Mano et al. · 2021 [cited by applicant]
US 20210153381A1 · Naito · 2021 [cited by examiner]
US 20210181599A1 · Shum · 2021 [cited by applicant]
US 20210302057A1 · Lozano · 2021 [cited by examiner]
US 20210306538A1 · Solar · 2021 [cited by examiner]
US 20210333847A1 · Yang · 2021 [cited by examiner]
US 20220030150A1 · Obana · 2022 [cited by applicant]
US 20220294954A1 · Ishii · 2022 [cited by examiner]
US 20220294955A1 · Yoshida · 2022 [cited by examiner]
US 20220294956A1 · Tamura · 2022 [cited by examiner]
US 20230035644A1 · Kuroki et al. · 2023 [cited by applicant]
US 20230266645A1 · Ueda · 2023 [cited by applicant]
US 20230320048A1 · Jang · 2023 [cited by examiner]
JP H05292366A · 1993 [cited by applicant]
JP 2006340214A · 2006 [cited by applicant]
JP 2012047798A · 2012 [cited by applicant]
JP 2013175959A · 2013 [cited by applicant]
JP 2014081504A · 2014 [cited by applicant]
JP 2019057887A · 2019 [cited by applicant]
JP 2019179949A · 2019 [cited by applicant]
JP 2019191433A · 2019 [cited by applicant]
WO 2015025687A1 · 2015 [cited by applicant]
Commonly owned, co-pending U.S. Appl. No. 18/074,484, filed Dec. 4, 2022. [cited by applicant]
Office Action for related U.S. Appl. No. 18/074,484 dated Jun. 20, 2024. [cited by applicant]
Office Action for related U.S. Appl. No. 18/074,484 dated Sep. 26, 2024. [cited by applicant]
Notice of Allowance for related U.S. Appl. No. 18/074,484 dated Jan. 17, 2025. [cited by applicant]
Office Action for corresponding Japanese Application No. 2021-126849 dated Jan. 7, 2025 and its English Machine Translation. [cited by applicant]
Office Action for corresponding Japanese Application No. 2021-126849 dated May 27, 2025 and its English Machine Translation. [cited by applicant]
Cited By (1)
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