IP Library › Granted Patent US 12,557,456
Granted Patent B2
US 12,557,456 · App. 17/885,164 · Granted Feb 17, 2026

Display module and method for repairing display module

Inventors: Byungchul Kim (Suwon-si, KR); Doyoung Kwag (Suwon-si, KR); Sangmoo Park (Suwon-si, KR); Wonsik Choi (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H10H29/03H10H29/012H10W90/00
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,557,456
App. No.
17/885,164
Granted
Feb 17, 2026
Kind
B2
Abstract

A method for repairing a display module and a display module repaired by the method are provided. The method for repairing a display module includes: detecting light-emitting diode (LED) missing positions on a target substrate; loading the target substrate onto a first stage; loading a transfer substrate onto a second stage; arranging the target substrate and the transfer substrate by operating the first stage and the second stage; and transferring a laser consecutively to the LED missing positions by moving the target substrate and the transfer substrate at a constant speed by operating the first stage and the second stage in a row direction or a column direction.

Claims (20)

1 . A method for repairing a display module, the method comprising:

detecting light-emitting diode (LED) missing positions on a target substrate;

loading the target substrate onto a first stage;

loading a transfer substrate onto a second stage;

arranging the target substrate and the transfer substrate by operating the first stage and the second stage; and

transferring LEDs from the transfer substrate to the LED missing positions of the target substrate by irradiating a laser, while operating the first stage and the second stage to move the target substrate and the transfer substrate at a constant speed, such that the transferring is sequentially performed in a row direction or a column direction.

2 . The method of claim 1 , wherein in the transferring, a transfer direction in which the LEDs are transferred is opposite to a movement direction in which the target substrate and the transfer substrate are moved.

3 . The method of claim 2 , wherein in the transferring, the target substrate and the transfer substrate are configured to move in the same movement direction.

4 . The method of claim 3 , wherein the LEDs are transferred to the LED missing positions on the target substrate by radiating a laser beam from the laser onto the transfer substrate based on the LED missing positions of the target substrate reaching a laser beam irradiation position while the target substrate and the transfer substrate are in movement.

5 . The method of claim 1 , wherein in the transferring, a transfer direction of transferring the LEDs is carried out back and forth with respect to one of the row direction or the column direction.

6 . The method of claim 1 , wherein the transferring comprises:

first line transferring of transferring the LEDs from the transfer substrate to the target substrate while moving the target substrate and the transfer substrate in a first straight-line direction;

moving the target substrate and the transfer substrate in an orthogonal direction to the first straight-line direction by a pre-set distance;

second line transferring of transferring the LEDs from the transfer substrate to the target substrate while moving the target substrate and the transfer substrate in a second straight-line direction opposite to the first straight-line direction; and

moving the target substrate and the transfer substrate in the orthogonal direction by a pre-set distance.

7 . The method of claim 1 , wherein the transfer substrate is configured such that a portion of multiple LEDs of the transfer substrate is arrayed to be at a position corresponding to the LEDs transferred to the target substrate.

8 . The method of claim 7 , wherein a size of the transfer substrate is smaller than a size of the target substrate.

9 . The method of claim 8 , wherein the transferring comprises carrying out transfer consecutively for respective virtual zones divided on the target substrate.

10 . The method of claim 7 , wherein the multiple LEDs of the transfer substrate are arrayed to be at a position corresponding to the LEDs transferred to the target substrate.

11 . The method of claim 1 , wherein the transfer substrate is manufactured to comprise multiple LEDs of a single color.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 10, 2022
From: KIM, BYUNGCHUL; KWAG, DOYOUNG; PARK, SANGMOO; CHOI, WONSIK
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 060774/0141 →
Priority Claims (1)
KR 10-2020-0034631 · Mar 20, 2020 · national
Continuity (2)
Continuation PCTKR2021003213 · Mar 16, 2021
Related Publication 20220384675A1 · Dec 1, 2022
References Cited (36)
US 6909111B2 · Yamagata et al. · 2005 [cited by applicant]
US 7744770B2 · Doi · 2010 [cited by examiner]
US 7871930B2 · Yamagata et al. · 2011 [cited by applicant]
US 8361268B2 · Mizuno · 2013 [cited by examiner]
US 8953138B2 · Kang et al. · 2015 [cited by applicant]
US 10007188B2 · Ebihara · 2018 [cited by applicant]
US 10020420B2 · Zou · 2018 [cited by examiner]
US 10153325B2 · Thothadri · 2018 [cited by examiner]
US 10191388B2 · Ebihara · 2019 [cited by applicant]
US 10236447B2 · Danesh et al. · 2019 [cited by applicant]
US 10755958B2 · Arai · 2020 [cited by applicant]
US 11127720B2 · Batres · 2021 [cited by examiner]
US 11337347B2 · Ahn et al. · 2022 [cited by applicant]
US 11437541B2 · Park · 2022 [cited by examiner]
US 20190221466A1 · Arai · 2019 [cited by applicant]
US 20190288245A1 · Lai et al. · 2019 [cited by applicant]
US 20190357395A1 · Ahn et al. · 2019 [cited by applicant]
US 20210272824A1 · An et al. · 2021 [cited by applicant]
US 20220108978A1 · Kajiyama · 2022 [cited by examiner]
JP 4100203B2 · 2008 [cited by applicant]
JP 6006758B2 · 2016 [cited by applicant]
JP 201860993A · 2018 [cited by applicant]
JP 2018176167A · 2018 [cited by applicant]
JP 6512252B2 · 2019 [cited by applicant]
KR 100712289B1 · 2007 [cited by applicant]
KR 101890934B1 · 2018 [cited by applicant]
KR 1020190000886A · 2019 [cited by applicant]
KR 101953645B1 · 2019 [cited by applicant]
KR 101972480B1 · 2019 [cited by applicant]
KR 1020190057054A · 2019 [cited by applicant]
KR 1020190108202A · 2019 [cited by applicant]
KR 1020190131305A · 2019 [cited by applicant]
Office Action issued on Mar. 26, 2024 by the Korean Patent Office for KR Patent Application No. 10-2020-0034631. [cited by applicant]
Notice of Allowance dated Nov. 26, 2024, issued by the Korean Intellectual Property Office in Korean Patent Application No. 10-2020-0034631. [cited by applicant]
International Search Report dated Jun. 16, 2021 issued by the International Searching Authority in International Application No. PCT/KR2021/003213 (PCT/ISA/210). [cited by applicant]
Written Opinion dated Jun. 16, 2021 issued by the International Searching Authority in International Application No. PCT/KR2021/003213 (PCT/ISA/237). [cited by applicant]