Transfer printing stamps and methods of stamp delamination
A stamp for micro-transfer printing includes a support having a support surface and posts disposed on the support surface. Each post has a distal end extending away from the support. The post has a post surface on the distal end. The post surface is a structured surface comprising spatially separated ridges that extend in a ridge direction entirely across the post surface and can be operable to form multiple delamination fronts when a first side of a micro-device is in contact with the post surface, a second side of the micro-device is in contact with a target surface of a target substrate, and the support is moved in a horizontal direction parallel to the target substrate surface. The post surface or ridges can be rectangular or non-rectangular with opposing edges having different lengths.
1. A system for micro-transfer printing, the system comprising:
a motion-control platform;
a stamp comprising
a support having a support surface, and
posts disposed on the support surface, each of the posts comprising a distal end extending away from the support, the post having a post surface on the distal end, wherein the post surface is a structured surface comprising spatially separated ridges that extend in a ridge direction entirely across the post surface; and
components on a component source wafer, each of the components disposed on the source wafer to contact one of the posts such that the spatially separated ridges of the post surface are in contact with the component,
wherein the motion-control platform is operable to move the stamp to adhere the ridges of the posts to the components and to move the stamp horizontally in a direction at least partially orthogonal to the ridge direction, thereby delaminating the ridges from the components during printing of the components to a target substrate.
2. The system of claim 1 , wherein the ridges are separated by grooves that extend in the ridge direction entirely across the post surface.
3. The system of claim 2 , wherein the grooves have a rectangular cross section in a direction that is orthogonal to the ridge direction and to the support surface.
4. The system of claim 2 , wherein the grooves have a triangular cross section in a direction that is orthogonal to the ridge direction and to the support surface.
5. The system of claim 1 , wherein the ridges have a rectangular or trapezoidal cross section in a direction that is orthogonal to the ridge direction and to the support surface.
6. The system of claim 1 , wherein the ridges have a triangular cross section in a direction that is orthogonal to the ridge direction and to the support surface.
7. The system of claim 1 , wherein each of the ridges has a same shape.
8. The system of claim 1 , wherein some of the ridges have a shape different from others of the ridges.
9. The system of claim 1 , wherein a surface of the ridges has a rectangular shape or forms a line.
10. The system of claim 1 , wherein the ridges have a first end and an opposing second end in a direction that is orthogonal to the ridge direction and parallel to the support surface, and the first end has a length that is different from a length of the second end.
11. The system of claim 1 , wherein the support and the posts comprise a polydimethylsiloxane.
12. The system of claim 1 , wherein at least a portion of the support and the posts are a common structure comprising a common material.
13. A method of micro-transfer printing, comprising:
providing a stamp, a source wafer comprising components disposed in an arrangement corresponding to an arrangement of the posts, and a target substrate, wherein the stamp comprises (i) a support having a support surface, and (ii) posts disposed on the support surface, each of the posts comprising a distal end extending away from the support, the post having a post surface on the distal end, wherein the post surface is a structured surface comprising spatially separated ridges that extend in a ridge direction entirely across the post surface;
contacting the ridges of the posts to the components;
removing the components from the source wafer, and contacting the components to a substrate surface of the target substrate,
wherein contacting the components to the substrate surface comprises moving the components toward and in contact with the target substrate, moving the components in a direction parallel to the substrate surface and in a direction at least partially orthogonal to the ridge direction while the components are in contact with the target substrate, and moving the stamp away from the target substrate.
14. A stamp for micro-transfer printing, the stamp comprising:
a support having a support surface;
posts disposed on the support surface, each of the posts comprising a distal end extending in a vertical direction away from the support, the post having a post surface on the distal end; and
a micro-device that is an unpackaged die adhered to the ridges; and
wherein the post surface is a structured surface comprising ridges spatially separated by grooves that extend in a ridge direction entirely across the post surface,
wherein (i) the posts are operable to adhere components to the ridges and (ii) the support is operable to move the posts in a horizontal direction orthogonal to the vertical direction and in a direction at least partially orthogonal to the ridge direction.
15. The stamp of claim 14 , wherein the micro-device comprises an integrated circuit, an active component, a passive component, an electronic component, an optical component, an opto-electronic component, a mechanical component, a seed crystal, a piezoelectric material or device, a light-emitting diode, a transistor, laser, a mechanical device, a photovoltaic device, a sensor device, a photonic device, or a magnetic device.
16. The stamp of claim 14 , wherein the micro-device is partially delaminated from the top surface of the ridges.
17. The stamp of claim 14 , wherein the micro-device comprises at least a portion of a tether.
18. The stamp of claim 14 , comprising a rigid substrate and wherein the support is a mesa disposed on the rigid substrate.
19. The stamp of claim 14 , wherein the posts are disposed in a two-dimensional array.
20. The stamp of claim 14 , wherein the grooves are narrower than the ridge.
21. The stamp of claim 14 , wherein the ridges are separated by grooves that extend in the ridge direction entirely across the post surface and the micro-device is not in contact with the grooves.