Micro LED transfer head
The present invention relates generally to a micro LED transfer head transferring a micro light-emitting diode (micro LED) from a first substrate to a second substrate. More particularly, the present invention relates to a micro LED transfer head holding and transferring a micro LED in which holding portions and surrounding areas of the holding portions are configured of different materials.
1. A micro LED transfer head, comprising:
a head unit including a plurality of through-holes formed by passing therethrough from top to bottom; and
a plurality of thermo-deformable materials each provided in each of the through-holes,
wherein micro LEDs are held onto surfaces of the thermo-deformable materials,
wherein the head unit and the thermo-deformable materials have different coefficients of thermal expansion.
2. The micro LED transfer head of claim 1 , wherein a support part of the head unit is configured of at least one anodic oxide sheet.
3. The micro LED transfer head of claim 1 , wherein the thermo-deformable materials provided in the respective through-holes are supported by a support part of the head unit, the support part surrounding the thermo-deformable materials.
4. The micro LED transfer head of claim 1 , wherein a temperature control means is provided at an upper portion of the head unit.
5. The micro LED transfer head of claim 4 , wherein the temperature control means is a fluid, and
when the thermo-deformable materials are expanded by temperature control of the fluid, the micro LEDs are held onto the surfaces of the expanded thermo-deformable materials, and when the thermo-deformable materials are contracted by temperature control of the fluid, the micro LEDs are detached from the surfaces of the contracted thermo-deformable materials.
6. The micro LED transfer head of claim 4 , wherein the temperature control means is a thermo-conductive film, and
when the thermo-deformable materials are expanded by the thermo-conductive film, the thermo-deformable materials hold the micro LEDs, and when the thermo-deformable materials are contracted by the thermo-conductive film, the thermo-deformable materials detach the micro LEDs.
7. The micro LED transfer head of claim 1 , wherein the thermo-deformable materials are polydimethylsiloxane (PDMS).
8. A micro LED transfer head, comprising:
a head unit including a plurality of through-holes passing therethrough from top to bottom;
a plurality of pressure-deformable materials each provided in each of the through-holes; and
a pressurizing member provided at an upper portion of the head unit and including a plurality of protrusions protruding from a lower surface of the pressurizing member,
wherein each the plurality of protrusions is provided at a position corresponding to each of the through-holes, and
wherein the pressure-deformable materials provided in the respective through-holes are deformed by the plurality of protrusions being inserted into the plurality of through-holes.
9. A micro LED transfer head, comprising:
a head unit including a plurality of through-holes passing therethrough from top to bottom;
a plurality of pressure-deformable materials each provided in each of the through-holes; and
a chamber provided at an upper portion of the head unit and in which pressure is controlled,
wherein when the pressure in the chamber is controlled to a high-pressure state, the pressure-deformable materials provided in the respective through-holes are more expanded than the head unit and the micro LEDs are held onto surfaces of the expanded pressure-deformable materials, and
wherein when the pressure in the chamber is controlled to a low-pressure state, the pressure-deformable materials are more contracted than the head unit and the micro LEDs are detached from the surfaces of the contracted pressure-deformable materials.
10. The micro LED transfer head of claim 9 , wherein the pressure-deformable materials expand to protrude from a lower surface of the head unit when the pressure in the chamber is controlled to the high-pressure state, and
wherein the pressure-deformable materials move into the through-holes when the pressure in the chamber is controlled to the low-pressure state.