Low surface roughness thermal interface device based on graphite with branched siloxane having high through-plane thermal conductivity
An anisotropic thermal interface device including plural aligned thermally anisotropic conductive composite layers. Each layer has a first thermal conductivity in a first direction and a second, larger thermal conductivity in a second direction. The aligned thermally anisotropic conductive composite layers extend substantially parallel to each other in the first direction and include 45-95 weight percent graphite flakes aligned in the second direction. The thermally anisotropic conductive composite layers have a binder including a branched siloxane. The thermally anisotropic conductive composite layers are adhered to adjacent thermally anisotropic conductive composite. The thermally anisotropic conductive composite layers have a second thermal conductivity of 25 to 45 W/mK. The anisotropic thermal interface device has an arithmetic average surface roughness of 5 to 20 μm and a tensile strength of 50 to 130 KPa.
1. A low surface roughness anisotropic thermal interface device comprising:
plural aligned thermally anisotropic conductive composite layers having a first thermal conductivity in a first direction and a second, larger thermal conductivity in a second direction, the aligned thermally conductive composite layers extending substantially parallel to each other in the first direction;
each of the thermally anisotropic conductive composite layers including 70-95 weight percent thermal filler, wherein the thermal filler includes macro graphite flakes in an amount from 45-95 weight percent, the graphite flakes having a size of approximately 0.5 mm to 1.0 mm, the graphite flakes being aligned in the second direction approximately perpendicular to the first direction such that x-y planes of the flakes align in the second direction having the second, larger thermal conductivity, the thermally anisotropic conductive composite layers having a binder including a linear siloxane and a branched siloxane, the binder having a total weight percent of approximately 5 to approximately 25 weight percent;
the thermally anisotropic conductive composite layers being adhered to adjacent thermally anisotropic conductive composite layers to create a laminated anisotropic composite thermal interface device;
the anisotropic thermal interface device having an arithmetic average surface roughness of approximately 5 to 20 μm and a tensile strength of approximately 50 to 130 KPa and a thermal conductivity of 25 to 45 W/mK.
2. The anisotropic thermal interface device of claim 1 , wherein the thermally anisotropic conductive composite layers have 0.05 to 0.2 weight percent of the branched siloxane.
3. The anisotropic thermal interface device of claim 1 , wherein the thermally anisotropic conductive composite layers further include 50 weight percent or less of thermally conductive filler.
4. The anisotropic thermal interface device of claim 3 , wherein the thermally conductive filler is one or more of boron nitride, silicon nitride, aluminum nitride, titanium nitride, aluminum oxide, beryllia, zirconia, silicon carbide, boron carbide, magnesium hydroxide, magnesium oxide, or aluminum hydroxide.
5. The anisotropic thermal interface device of claim 3 , wherein the thermally conductive filler incudes particles having a sphere, rod or irregular shape.
6. The anisotropic thermal interface device of claim 5 , wherein the thermally conductive filler particles have first and second size distributions with the first size distribution having a median particle size between 2 and 5 microns, and the second size distribution having a median particle size of between 0.5 μm and 1.5 microns.
7. The anisotropic thermal interface device of claim 6 , wherein the ratio of particles having the first size distribution to the ratio of particles having the second size distribution is approximately 2:1 to 8:1.
8. The anisotropic thermal interface device of claim 1 , wherein each of the thermally anisotropic conductive composite layers has a thickness of 0.1 to 0.6 mm.
9. The anisotropic thermal interface device of claim 1 , wherein the device has a Shore C hardness of 30 to 70.
10. A method of making the anisotropic thermal interface device of claim 1 , comprising:
hot pressing or roll pressing a mixture of 70-95 weight percent thermal filler including 45-95 weight percent macro graphite flakes having a size of approximately 0.5 mm to 1.0 mm with a binder including a linear siloxane and a branched siloxane the binder having a total weight percent of approximately 5 to approximately 25 weight percent to create an aligned thermally anisotropic conductive composite layer having a first thermal conductivity in a first direction and a second, larger thermal conductivity in a second direction;
laminating a plurality of the composite layers to one another to create a stacked composite layer;
slicing the stacked composite laminated layer in a direction perpendicular to a direction of stacking to create the anisotropic thermal interface device with plural anisotropic conductive composite layers extending substantially parallel to each other in the first direction; and
polishing the sliced thermal interface device to obtain low roughness on both a top and a bottom surface.
11. The method of claim 10 , wherein the slicing is performed using an ultrasonic cutter.
12. The method of claim 10 , wherein the method is hot pressing and the hot pressing is performed at 90-150° C.
13. The method of claim 10 wherein the method is roll pressing and the stacked composite layer is further heated and pressed following stacking.
14. The method of claim 10 , wherein the polishing is performed using sandpaper, polishing cloth, or polishing wheel.