Heat sink component with land grid array connections
A heat sink component can include a body including a thermally conductive material that is electrically non-conductive. The body can have a top surface, a bottom surface opposite the top surface, and a plurality of side surfaces. The heat sink component also can include a heat source terminal formed over the bottom surface of the body. The heat source terminal can be spaced apart from the plurality of side surfaces. The heat sink component further can include a heat sink terminal formed over the bottom surface of the body. The heat sink terminal can be spaced apart from the plurality of side surfaces.
1 . A heat sink component comprising:
a body comprising a thermally conductive material that is electrically non-conductive, the body having a top surface, a bottom surface opposite the top surface along a Z-axis, and a plurality of side surfaces including a first side surface, a second side surface opposite the first side surface, a first end surface, and a second end surface opposite the first end surface, each of the first side surface, the second side surface, the first end surface, and the second end surface extending between the top surface and the bottom surface, the top surface extending in a single plane bound by the first side surface, the second side surface, the first end surface, and the second end surface;
a first heat source terminal, a second heat source terminal, a third heat source terminal, and a fourth heat source terminal formed over the bottom surface of the body, each of the first heat source terminal, the second heat source terminal, the third heat source terminal, and the fourth heat source terminal spaced apart from the plurality of side surfaces;
a heat sink terminal formed over the bottom surface of the body, the heat sink terminal spaced apart from the plurality of side surfaces;
a first via formed in the body, the first via connected with the first heat source terminal and extending to the top surface of the body;
a second via formed in the body, the second via connected with the second heat source terminal and extending to the top surface of the body;
a third via formed in the body, the third via connected with the third heat source terminal and extending to the top surface of the body;
a fourth via formed in the body, the fourth via connected with the fourth heat source terminal and extending to the top surface of the body;
a thin-film component formed over the top surface of the body and electrically connected between the first via at the top surface and the second via at the top surface such that the thin-film component is electrically connected between the first heat source terminal and the second heat source terminal; and
a conductive trace formed over the top surface of the body and electrically connected between the third via at the top surface and the fourth via at the top surface such that the third heat source terminal is electrically connected with the fourth heat source terminal,
wherein the top surface is free of electrically conductive material aligned with the heat sink terminal along the Z-axis, and
wherein the heat sink terminal is connected with the at least one heat sink terminal of a device at the bottom surface of the heat sink component, the heat sink terminal of the heat sink component configured to conduct heat from the heat sink component to the device through at least one heat sink terminal of the device.
2 . The heat sink component of claim 1 , wherein the plurality of side surfaces is free of electrically conductive material.
3 . The heat sink component of claim 1 , wherein the heat sink component comprises a material having a thermal conductivity from about 150 W/m·° C. to about 300 W/m·° C. at about 22° C.
4 . The heat sink component of claim 1 , wherein the heat sink component comprises aluminum nitride.
5 . The heat sink component of claim 1 , wherein the heat sink component comprises beryllium oxide.
6 . The heat sink component of claim 1 , wherein the thin-film component comprises a capacitor.
7 . The heat sink component of claim 1 , wherein the thin-film component comprises a varistor.
8 . The heat sink component of claim 1 , wherein the thin-film component comprises an inductor.
9 . The heat sink component of claim 1 , wherein the heat sink terminal is free of direct connection with any electrically conductive element of the heat sink component.
10 . The heat sink component of claim 1 , wherein the top surface of the body includes a first portion and a second portion, the first portion co-planar with the second portion, wherein the first via, the second via, the third via, and the fourth via extend to the first portion of the top surface, and wherein the heat sink terminal is formed over the bottom surface of the body opposite the second portion of the top surface.
11 . A component assembly comprising:
a device comprising a top surface, wherein a plurality of heat source terminals and at least one heat sink terminal are exposed on the top surface; and
a heat sink component mounted to the device, the heat sink component comprising:
a body comprising a thermally conductive material that is electrically non-conductive, the body having a top surface, a bottom surface opposite the top surface, and a plurality of side surfaces including a first side surface, a second side surface opposite the first side surface, a first end surface, and a second end surface opposite the first end surface, each of the first side surface, the second side surface, the first end surface, and the second end surface extending between the top surface and the bottom surface, the top surface extending in a single plane bound by the first side surface, the second side surface, the first end surface, and the second end surface,
a first heat source terminal, a second heat source terminal, a third heat source terminal, and a fourth heat source terminal formed over the bottom surface of the body, each of the first heat source terminal, the second heat source terminal, the third heat source terminal, and the fourth heat source terminal spaced apart from the plurality of side surfaces of the body,
a heat sink terminal formed over the bottom surface of the body, the heat sink terminal spaced apart from the plurality of side surfaces,
a first via formed in the body, the first via connected with the first heat source terminal and extending to the top surface of the body,
a second via formed in the body, the second via connected with the second heat source terminal and extending to the top surface of the body,
a third via formed in the body, the third via connected with the third heat source terminal and extending to the top surface of the body,
a fourth via formed in the body, the fourth via connected with the fourth heat source terminal and extending to the top surface of the body,
a thin-film component formed over the top surface of the body and electrically connected between the first via at the top surface and the second via at the top surface such that the thin-film component is electrically connected between the first heat source terminal and the second heat source terminal, and
a conductive trace formed over the top surface of the body and electrically connected between the third via at the top surface and the fourth via at the top surface such that the third heat source terminal is electrically connected with the fourth heat source terminal,
wherein each of the first heat source terminal, the second heat source terminal, the third heat source terminal, and the fourth heat source terminal is connected with a respective one of the plurality of heat source terminals of the device, and
wherein the heat sink terminal is connected with the at least one heat sink terminal of the device at the bottom surface of the heat sink component, the heat sink terminal of the heat sink component configured to conduct heat from the heat sink component to the device through the at least one heat sink terminal of the device.
12 . The component assembly of claim 11 , wherein the device comprises a circuit board.
13 . The component assembly of claim 11 , wherein the device comprises a multilayer ceramic component.
14 . The component assembly of claim 11 , wherein the plurality of side surfaces of the body of the heat sink component are free of electrically conductive material.
15 . The component assembly of claim 11 , wherein the heat sink component comprises a material having a thermal conductivity from about 150 W/m·° C. to about 300 W/m·° C. at about 22° C.
16 . The component assembly of claim 11 , wherein the heat sink component comprises aluminum nitride.
17 . The component assembly of claim 11 , wherein the heat sink component comprises beryllium oxide.
18 . A method of manufacturing a heat sink component, the method comprising:
providing a body comprising a thermally conductive material that is electrically non-conductive, the body having a top surface, a bottom surface opposite the top surface along a Z-axis, and a plurality of side surfaces including a first side surface, a second side surface opposite the first side surface, a first end surface, and a second end surface opposite the first end surface, each of the first side surface, the second side surface, the first end surface, and the second end surface extending between the top surface and the bottom surface, the top surface extending in a single plane bound by the first side surface, the second side surface, the first end surface, and the second end surface;
forming a heat source terminal over the bottom surface of the body, the heat source terminal spaced apart from the plurality of side surfaces;
forming a heat sink terminal over the bottom surface of the body, the heat sink terminal spaced apart from the plurality of side surfaces, the heat sink terminal free of connections with any electrically conductive element of the heat sink component;
forming a second heat source terminal, a third heat source terminal, and a fourth heat source terminal over the bottom surface of the body, each of the second heat source terminal, the third heat source terminal, and the fourth heat source terminal spaced apart from the plurality of side surfaces;
forming a first via in the body, the first via connected with the first heat source terminal and extending to the top surface of the body;
forming a second via in the body, the second via connected with the second heat source terminal and extending to the top surface of the body;
forming a third via in the body, the third via connected with the third heat source terminal and extending to the top surface of the body;
forming a fourth via in the body, the fourth via connected with the fourth heat source terminal and extending to the top surface of the body;
forming a thin-film component over the top surface of the body from the first via to the second via such that the thin-film component is electrically connected between the first heat source terminal and the second heat source terminal; and
forming a conductive trace over the top surface of the body from the third via to the fourth via such that the third heat source terminal is electrically connected with the fourth heat source terminal,
wherein the top surface is free of electrically conductive material aligned with the heat sink terminal along the Z-axis, and
wherein the heat sink terminal is connected with the at least one heat sink terminal of a device at the bottom surface of the heat sink component, the heat sink terminal of the heat sink component configured to conduct heat from the heat sink component to the device through at least one heat sink terminal of the device.