Hermetically sealed glass package
A package for encapsulating a functional area against an environment includes a base substrate and a cover substrate, the base substrate together with the cover substrate defining at least part of the package or defining the package, and furthermore including the at least one functional area provided in the package, and a blocking way for reducing permeation between the environment and the functional area. The package may include at least one laser bonding line, and the substrates of the package can be hermetically joined to one another by the at least one laser bonding line, and the laser bonding line has a height (HL) perpendicular to its bonding plane.
1 . A package for encapsulating at least one functional area against an environment, the package comprising:
a base substrate;
a cover substrate, the base substrate together with the cover substrate defining at least a part of the package or defining the package, the at least one functional area being provided inside the package;
at least one blocking way configured for reducing a permeation between the environment and the at least one functional area; and
at least one laser bonding line for hermetically joining two adjacent substrates of the package, wherein the at least one laser bonding line comprises mixed melted material from said two adjacent substrates, wherein the at least one laser bonding line has a height (HL) perpendicular to a bonding plane of the at least one laser bonding line, the at least one laser bonding line extending into the two adjacent substrates joined by said at least one laser bonding line.
2 . The package of claim 1 , wherein at least one of: (a) the package further comprising at least one intermediate substrate disposed between the base substrate and the cover substrate; and (b) the at least one functional area comprising at least one of at least one cavity and at least one functional layer.
3 . The package of claim 1 , wherein the at least one blocking way comprises or is formed as a barrier layer, which at least partially encloses the at least one functional area.
4 . The package of claim 3 , further comprising at least one intermediate substrate disposed between the base substrate and the cover substrate, wherein at least one of:
the barrier layer is disposed (a) on at least one of the base substrate, the cover substrate, and the at least one intermediate substrate, or (b) on an inner side, of at least one of the base substrate, the cover substrate, and the at least one intermediate substrate, facing the at least one functional area; and
the barrier layer (a) directly encloses the at least one functional area, against at least one of the base substrate, the cover substrate, and the at least one intermediate substrate, or (b) completely encloses the at least one functional area.
5 . The package of claim 1 , wherein the cover substrate comprises a material which has a higher permeability than the base substrate.
6 . The package of claim 1 , wherein at least one of:
the at least one blocking way comprises SiO 2 , Si 3 N 4 , Al 2 O 3 , or AlN;
the at least one blocking way comprises a metallic material;
the at least one blocking way comprises SiO x N y or AlO x N y ; and
the at least one blocking way comprises SiAl x N y , SiAl x O y , or SiAl x O y N z .
7 . The package of claim 1 , wherein the at least one blocking way has a thickness of 1 μm or less.
8 . The package of claim 1 , wherein the at least one blocking way is configured to reduce a permeability to substances between the at least one functional area and the environment by at least 30%.
9 . The package of claim 1 , wherein the at least one blocking way reduces a permeability for water and hydrogen.
10 . The package of claim 1 , further comprising at least one intermediate substrate disposed between the base substrate and the cover substrate, the package further comprising two directions of penetration, wherein the at least one blocking way reduces a permeability in the two directions of penetration through the at least one blocking way and through the base substrate, the cover substrate, and the at least one intermediate substrate of the package.
11 . The package of claim 1 , wherein the at least one blocking way comprises a first barrier layer and a second barrier layer; and wherein the at least one functional area is arranged between the first barrier layer and the second barrier layer.
12 . The package of claim 1 , further comprising at least one intermediate substrate disposed between the base substrate and the cover substrate, wherein at least one of the base substrate, the at least one intermediate substrate, and the cover substrate comprises a vitreous material, a polycrystalline material, a glass, a glass ceramic, silicon, aluminum oxide, sapphire, aluminum nitride, or a combination thereof.
13 . The package of claim 1 , further comprising at least one laser bonding line, the base substrate and the cover substrate being hermetically joined to one another by the at least one laser bonding line, wherein the at least one laser bonding line circumferentially surrounds the at least one functional area at a distance (DF) therefrom.
14 . The package of claim 1 , wherein the at least one functional area is configured for accommodating at least one accommodation item so that the at least one accommodation item is disposed inside the package.
15 . The package of claim 14 , wherein the at least one accommodation item comprises a power semiconductor chip, which is selected from the group consisting of a GaN LED, a SiC power transistor, a GaAs power transistor, and a GaN power transistor.
16 . The package of claim 14 , wherein the at least one functional area comprises at least one cavity, wherein at least one of:
the at least one accommodation item is disposed in the at least one cavity; and
the at least one cavity comprises a plurality of cavities configured for accommodating at least one accommodation item in each respective one of the plurality of cavities.
17 . The package of claim 1 , further comprising at least one intermediate substrate disposed between the base substrate and the cover substrate, wherein at least one first laser bonding line joins the cover substrate and the intermediate substrate and at least one second laser bonding line joins the intermediate substrate and the base substrate.
18 . The package of claim 1 , wherein the package is transparent for a range of wavelengths at least partially and/or in portions thereof.
19 . The package of claim 1 , wherein the at least one functional area of the package is adapted for accommodating at least one accommodation item having a size of 10 mm×10 mm or less.
20 . The package of claim 1 , further comprising at least one intermediate substrate disposed between the base substrate and the cover substrate, wherein the base substrate, the cover substrate, and the intermediate substrate of the package are hermetically joined together by anodic bonding, bonding with an organic adhesive, glass frit bonding, or fusing using a CO 2 laser.
21 . A method for providing the package of claim 1 , the method comprising the steps of:
providing the base substrate and the cover substrate, the cover substrate being transparent for at least one range of wavelengths at least partially or in portions thereof and therefore being a transparent cover substrate;
arranging the cover substrate on the base substrate and above the at least one functional area thereby creating at least one contact area between the base substrate and the cover substrate, so that the package has at least one contact area;
hermetically sealing the at least one functional area including at least one cavity by forming at least one laser bonding line along the at least one contact area of the package; and
arranging the at least one blocking way at least one of between the at least one functional area and the cover substrate and between the at least one functional area and the base substrate.
22 . The method of claim 21 , further comprising, prior to the step of arranging the cover substrate on the base substrate, a step of arranging the blocking way at least one of on the cover substrate, on the at least one functional area, and on the base substrate.
23 . The method of claim 21 , wherein at least one of:
the step of providing the cover substrate comprises providing the cover substrate already equipped with the blocking way; and
the step of providing the base substrate comprises providing the base substrate already equipped with the blocking way.
24 . The method of claim 21 , wherein a laser beam is directed around the at least one functional area to form the at least one laser bonding line so that the at least one functional area is hermetically sealed circumferentially along the at least one contact area; wherein at least one of (a) the laser beam is directed circumferentially around a plurality of times, and (b) a plurality of the laser bonding line is formed.
25 . A package, comprising:
at least one cavity which is at least one hermetically sealed accommodation cavity, the package being produced by a method, wherein the package encloses at least one functional area including the at least one cavity, the method comprising the steps of:
providing a base substrate and a cover substrate, the cover substrate being transparent for at least one range of wavelengths at least partially or in portions thereof and therefore being a transparent cover substrate;
arranging the cover substrate on the base substrate and above the at least one functional area thereby creating at least one contact area between the base substrate and the cover substrate, so that the package has at least one contact area;
hermetically sealing the at least one functional area including the at least one cavity by forming at least one laser bonding line along the at least one contact area of the package, wherein the at least one laser bonding line comprises mixed melted material from the two adjacent substrates, wherein the at least one laser bonding line has a height (HL) perpendicular to a bonding plane of the at least one laser bonding line, the at least one laser bonding line extending into the two adjacent substrates joined by said at least one laser bonding line; and
arranging a blocking way at least one of between the at least one functional area and the cover substrate and between the at least one functional area and the base substrate.
26 . A method of using the package of claim 1 , with at least one cavity enclosed therein, the at least one cavity being formed as at least one hermetically sealed accommodation cavity, the method comprising the steps of:
providing that the package encloses the at least one functional area including the at least one cavity;
producing the package by a method of production, comprising the steps of:
providing the base substrate and the cover substrate, the cover substrate being transparent for at least one range of wavelengths at least partially or in portions thereof and therefore being a transparent cover substrate;
arranging the cover substrate on the base substrate and above the at least one functional area thereby creating at least one contact area between the base substrate and the cover substrate, so that the package has at least one contact area;
hermetically sealing the at least one functional area including the at least one cavity by forming at least one laser bonding line along the at least one contact area of the package; and
arranging the at least one blocking way at least one of between the at least one functional area and the cover substrate and between the at least one functional area and the base substrate; and
using the package as a medical implant or as a sensor.
27 . The package of claim 5 , wherein the at least one blocking way is disposed between the at least one functional area and the cover substrate without being disposed between the at least one functional area and the base substrate.