IP Library › Granted Patent US 12,256,190
Granted Patent B2
US 12,256,190 · App. 17/891,993 · Granted Mar 18, 2025

Speaker module and electronic device including the same

Inventors: Seongkwan Yang (Suwon-si, KR); Kiwon Kim (Suwon-si, KR); Choonghyo Park (Suwon-si, KR); Jihoon Song (Suwon-si, KR); Peng Zhang (Shandong, CN); Guodong Zhao (Shandong, CN); Kyudong Kim (Incheon, KR); Byounghee Lee (Suwon-si, KR); Hochul Hwang (Suwon-si, KR)
Assignees: SAMSUNG ELECTRONICS CO., LTD.; GOERTEK INC
H04R1/288G06F1/1633H04R1/2811H04R2499/11
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Quick Facts
Patent No.
US 12,256,190
App. No.
17/891,993
Granted
Mar 18, 2025
Kind
B2
Abstract

An example speaker module includes a speaker housing including a conduit extending to an internal space; a speaker component positioned in a first area of the internal space adjacent to the conduit; a vent hole spaced apart from the speaker component and passing through at least part of the speaker housing; a sound absorbing material disposed in a second area of the internal space to be positioned adjacent to the speaker component to absorb a sound generated from the speaker component; and a guide structure disposed to surround the vent hole and including at least one protrusion protruding towards the internal space.

Claims (34)

1. A speaker module, comprising:

a speaker housing including an internal space and a conduit adjacent to the internal space and extending to the internal space, and the internal space including a first region and a second region partitioned from the first region;

a speaker component positioned in the first region;

a vent hole spaced apart from the speaker component and passing through at least part of the speaker housing corresponding to the second region of the internal space;

a sound absorbing material disposed in the second region to be positioned adjacent to the speaker component; and

a guide structure disposed to surround the vent hole and including at least one protrusion protruding towards the internal space,

wherein the guide structure includes a plurality of openings formed in a front surface of the guide structure and a side surface of the guide structure and extending to the vent hole.

2. The speaker module of claim 1 , wherein the sound absorbing material comprises a plurality of particles and is prevented from contacting the vent hole by the guide structure formed around the vent hole.

3. The speaker module of claim 2 , wherein the guide structure includes a first protrusion and a second protrusion spaced apart from each other, and wherein a distance between the first protrusion and the second protrusion crossing a central axis of the vent hole is smaller than a particle diameter of the sound absorbing material.

4. The speaker module of claim 2 , wherein the guide structure includes a first protrusion and a second protrusion disposed adjacent to and apart from each other,

wherein a first side surface edge of the first protrusion faces a second side surface edge of the second protrusion, and wherein a minimum distance between the first side surface and the second side surface is smaller than a particle diameter of the sound absorbing material.

5. The speaker module of claim 2 , wherein the guide structure includes a first protrusion, and wherein a thickness of the first protrusion is larger than a half of a particle diameter of the sound absorbing material.

6. The speaker module of claim 3 , wherein the guide structure further includes a third protrusion disposed between the first protrusion and the second protrusion, and

wherein the third protrusion has different shape different from the first protrusion and the second protrusion.

7. The speaker module of claim 6 , wherein the guide structure further includes a fourth protrusion disposed between the first protrusion and the second protrusion and facing at least one side surface of the third protrusion with the vent hole disposed therebetween.

8. The speaker module of claim 7 , wherein the first protrusion, second protrusion, third protrusion, and fourth protrusion of the guide structure have shapes corresponding to each other.

9. The speaker module of claim 7 , wherein at least one of the first protrusion, second protrusion, third protrusion, or fourth protrusion of the guide structure have a shape different from the other protrusions.

10. The speaker module of claim 3 , wherein the first protrusion or second protrusion of the guide structure is disposed in contact with a bottom surface facing in a first direction of the speaker housing and an inner side surface facing in a second direction perpendicular to the first direction.

11. The speaker module of claim 1 , wherein the guide structure further includes a blocking member disposed on a front surface of the at least one protrusion and including a plurality of through holes, and

wherein the plurality of through holes of the blocking member face in a direction perpendicular to or parallel with the vent hole, and wherein at least some of the plurality of through holes are connected together and provide an air ventilation path towards the vent hole.

12. An electronic device, comprising:

a device housing including a front plate, a back plate, and a side surface member surrounding a first space between the front plate and the back plate and including a first conduit extending to an outside;

a display configured to output a screen via the front plate;

a battery disposed between the display and the back plate;

a speaker module disposed in the first space and including a second conduit in communication with the first conduit; and

a printed circuit board (PCB) disposed adjacent to the speaker module and electrically connected with the speaker module, wherein the speaker module includes:

a speaker housing forming a second space partitioned from the first space, wherein the second space includes a first region and a second region partitioned from the first region;

a speaker component positioned adjacent to the second conduit, in the first region;

a vent hole spaced apart from the speaker component and passing through at least part of the speaker housing corresponding to the second region to the first space of the housing;

a sound absorbing material disposed in the second region to be positioned adjacent to the speaker component; and

a guide structure disposed to at least partially surround the vent hole and including at least one protrusion protruding towards the second space,

wherein the guide structure includes a plurality of openings formed in a front surface of the guide structure and a side surface of the guide structure and extending to the vent hole.

13. The electronic device of claim 12 , wherein the sound absorbing material comprises a plurality of particles and is prevented from contacting the vent hole by the guide structure formed around the vent hole.

14. The electronic device of claim 13 , wherein the guide structure is integrally formed with the speaker housing.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE OMISSION SECOND ASSIGNEE'S NAME PREVIOUSLY RECORDED AT REEL: 61295 FRAME: 175. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT . Recorded Oct 28, 2024
From: YANG, SEONGKWAN; KIM, KIWON; PARK, CHOONGHYO; SONG, JIHOON; ZHAO, GUODONG GUO; KIM, KYUDONG; LEE, BYOUNGHEE; HWANG, HOCHUL
To: SAMSUNG ELECTRONICS CO., LTD.; GOERTEK INC
Reel/Frame 069275/0026 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 19, 2022
From: YANG, SEONGKWAN; KIM, KIWON; PARK, CHOONGHYO; SONG, JIHOON; ZHANG, PENG; ZHAO, GUODONG; KIM, KYUDONG; LEE, BYOUNGHEE; HWANG, HOCHUL
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 061295/0175 →
Continuity (2)
Continuation PCTCN2020076244 · Feb 21, 2020
Related Publication 20220394375A1 · Dec 8, 2022
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