IP Library Granted Patent US 12,428,580
Granted Patent B2
US 12,428,580 · App. 17/895,967 · Granted Sep 30, 2025

CMP composition including an anionic abrasive

Inventors: Yang-Yao Lee (Tainan, TW); Hsin-Yen Wu (Kaohsiung, TW); Kevin P. Dockery (Aurora, IL); Na Zhang (Naperville, IL); Chi-Rung Shie (Kaohsiung, TW)
Assignee: CMC Materials LLC
C09G1/02C09K3/1454H01L21/3212
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Quick Facts
Patent No.
US 12,428,580
App. No.
17/895,967
Granted
Sep 30, 2025
Kind
B2
Abstract

A chemical mechanical polishing composition comprises, consists of, or consists essentially of a liquid carrier, anionic particles dispersed in the liquid carrier, an anionic polymer or surfactant, and a cationic polymer.

Claims (57)

1. A chemical mechanical polishing composition comprising:

a liquid carrier;

anionic particles dispersed in the liquid carrier;

a cationic polymer; and

an anionic polymer, further comprising:

an iron-containing accelerator; and

a stabilizer bound to the iron-containing accelerator.

2. The composition of claim 1 , wherein the anionic particles comprise anionic silica, anionic alumina, or a mixture thereof.

3. The composition of claim 1 , further comprising hydrogen peroxide.

4. The composition of claim 1 , wherein a ratio of a total number of negative charges on the anionic polymer to a total number of positive charges on the cationic polymer at a pH of the composition is greater than about 1:1.

5. The composition of claim 1 , wherein a ratio of a total number of negative charges on the anionic polymer to a total number of positive charges on the cationic polymer is in a range from about 1:1 to about 10:1.

6. The composition of claim 1 , wherein:

the anionic particles comprise anionic colloidal silica particles; and

a ratio of a total number of negative charges on the anionic polymer to a total number of positive charges on the cationic polymer at a pH of the composition is greater than about 1:1.

7. The composition of claim 1 , wherein:

the anionic particles comprise anionic alpha alumina particles; and

a ratio of a total number of negative charges on the anionic polymer to a total number of positive charges on the cationic polymer at a pH of the composition is greater than about 3.5.

8. The composition of claim 1 , wherein the anionic polymer comprises a polysulfonic acid polymer.

9. The composition of claim 1 , wherein the anionic polymer is a polysulfonic acid polymer comprising sulfonic acid monomer units, the polysulfonic acid polymer selected from the group consisting of polyvinylsulfonic acid, polystyrenesulfonic acid, poly (2-acrylamido-2-methylpropane sulfonic acid), poly (styrenesulfonic acid-co-maleic acid), and mixtures thereof.

10. The composition of claim 1 , wherein the anionic polymer comprises polyvinylsulfonic acid, polystyrenesulfonic acid, or a mixture thereof.

11. The composition of claim 1 , wherein the cationic polymer comprises a polyamino acid.

12. The composition of claim 1 , wherein the cationic polymer comprises polylysine.

13. The composition of claim 1 , wherein the cationic polymer comprises a monomer including a quaternary amine group.

14. The composition of claim 1 , wherein the cationic polymer comprises poly(diallyldimethylammonium).

15. The composition of claim 1 , wherein the anionic particles comprises anionic silica; the anionic polymer comprises of a polysulfonic acid polymer; and the cationic polymer comprises a polyamino acid.

16. The composition of claim 15 , wherein the cationic polymer comprises polylysine; and a ratio of a total number of negative charges on the anionic polymer to a total number of positive charges on the cationic polymer is in a range from about 1:1 to about 20:1.

17. The composition of claim 16 , wherein:

the composition comprises from about 20 to about 2000 ppm by weight of polystyrenesulfonic acid at point of use; and

the composition comprises from about 2 to about 50 ppm by weight of the polylysine at point of use.

18. The composition of claim 1 , wherein the anionic particles comprise anionic alpha alumina; the anionic polymer comprises a polysulfonic acid polymer; and the cationic polymer comprises a monomer including a quaternary amine group.

19. The composition of claim 18 , wherein the cationic polymer comprises poly(diallyldimethylammonium); and a ratio of a total number of negative charges on the anionic polymer to a total number of positive charges on the cationic polymer is in a range from about 3.5:1 to about 20:1.

20. The composition of claim 19 , wherein:

the composition comprises from about 20 to about 2000 ppm by weight of polystyrenesulfonic acid at point of use; and

the composition comprises from about 20 to about 200 ppm by weight of the poly(diallyldimethylammonium) at point of use.

21. The composition of claim 1 , wherein the anionic particles have a negative charge of at least 10 mV in the polishing composition.

22. The composition of claim 1 , comprising less than about 1 weight percent of the anionic particles at point of use.

23. The composition of claim 1 , having a pH in a range from about 2 to about 5.

24. A method of chemical mechanical polishing a substrate having a tungsten layer or a molybdenum layer, the method comprising:

(a) contacting the substrate with a polishing composition of claim 1 ;

(b) moving the polishing composition relative to the substrate; and

(c) abrading the substrate to remove a portion of the tungsten layer or the molybdenum layer from the substrate and thereby polish the substrate.

25. The method of claim 24 , wherein:

the anionic particles comprise anionic silica;

the anionic polymer comprises a polysulfonic acid polymer; and

the cationic polymer comprises a polyamino acid.

26. The method of claim 25 , wherein

the polishing composition further comprises an iron-containing accelerator and a stabilizer bound to the iron-containing accelerator;

the cationic polymer comprises polylysine and

a ratio of a total number of negative charges on the anionic polymer to a total number of positive charges on the cationic polymer is in a range from about 1:1 to about 20:1.

27. The method of claim 24 , wherein:

the anionic particles comprise anionic alpha alumina;

the anionic polymer comprises a polysulfonic acid polymer; and

the cationic polymer comprises a monomer including a quaternary amine group.

28. The method of claim 27 , wherein

the polishing composition further comprises an iron-containing accelerator and a stabilizer bound to the iron-containing accelerator;

the cationic polymer comprises poly(diallyldimethylammonium); and

a ratio of a total number of negative charges on the anionic polymer to a total number of positive charges on the cationic polymer is in a range from about 3.5:1 to about 20:1.

Assignments (2)
CHANGE OF NAME Recorded Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →
SECURITY INTEREST Recorded Jun 2, 2023
From: ENTEGRIS, INC.; CMC MATERIALS LLC
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 063857/0199 →
Continuity (2)
Provisional Application 63237095 · Aug 25, 2021
Related Publication 20230070776A1 · Mar 9, 2023
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