Patent Assignment
Reel/Frame 065517/0783
CHANGE OF NAME
Recorded: 2023-11-08
Received: 2023-11-08
Pages: 14
Assignor
CMC MATERIALS, INC.
Executed: 2023-02-27
Assignee
CMC MATERIALS LLC
1209 ORANGE STREET, WILMINGTON, DE, 19801, UNITED STATES
Covered Applications
(100)
DUAL-CURE RESIN FOR PREPARING CHEMICAL MECHANICAL POLISHING PADS
App. No. 18/210,422
→
DUAL ADDITIVE POLISHING COMPOSITION FOR GLASS SUBSTRATES
App. No. 18/110,633
→
ENDPOINT WINDOW WITH CONTROLLED TEXTURE SURFACE
App. No. 18/103,135
→
COMPOSITION AND METHOD FOR COBALT CMP
App. No. 17/972,509
→
SILICA-BASED SLURRY COMPOSITIONS CONTAINING HIGH MOLECULAR WEIGHT POLYMERS FOR USE IN CMP OF DIELECTRICS
App. No. 17/951,288
→
TEXTURED CMP PAD COMPRISING POLYMER PARTICLES
App. No. 17/902,210
→
CMP COMPOSITION INCLUDING AN ANIONIC ABRASIVE
App. No. 17/895,967
→
SILICON CARBONITRIDE POLISHING COMPOSITION AND METHOD
App. No. 17/592,612
→
CERIA-BASED SLURRY COMPOSITIONS FOR SELECTIVE AND NONSELECTIVE CMP OF SILICON OXIDE, SILICON NITRIDE, AND POLYSILICON
App. No. 17/592,294
→
CERIA-BASED SLURRY COMPOSITIONS FOR SELECTIVE AND NONSELECTIVE CMP OF SILICON OXIDE, SILICON NITRIDE, AND POLYSILICON
App. No. 17/592,279
→
COMPOSITION AND METHOD FOR POLISHING BORON DOPED POLYSILICON
App. No. 17/584,532
→
ENDPOINT WINDOW WITH CONTROLLED TEXTURE SURFACE
App. No. 17/582,667
→
CHEMICAL-MECHANICAL POLISHING SUBPAD HAVING POROGENS WITH POLYMERIC SHELLS
App. No. 17/557,461
→
SELF-STOPPING POLISHING COMPOSITION AND METHOD FOR HIGH TOPOLOGICAL SELECTIVITY
App. No. 17/557,412
→
CHEMICAL-MECHANICAL POLISHING PAD WITH TEXTURED PLATEN ADHESIVE
App. No. 17/607,743
→
UV-CURABLE RESINS USED FOR CHEMICAL MECHANICAL POLISHING PADS
App. No. 17/503,422
→
CHEMICAL MECHANICAL PLANARIZATION PAD WITH A RELEASE LINER COMPRISING A PULL TAB
App. No. 17/478,690
→
SILICA-BASED SLURRY FOR SELECTIVE POLISHING OF CARBON-BASED FILMS
App. No. 17/474,543
→
TITANIUM DIOXIDE CONTAINING RUTHENIUM CHEMICAL MECHANICAL POLISHING SLURRY
App. No. 17/391,674
→
CMP COMPOSITION INCLUDING ANIONIC AND CATIONIC INHIBITORS
App. No. 17/384,940
→
SILICON WAFER POLISHING COMPOSITION AND METHOD
App. No. 17/379,279
→
CMP COMPOSITION INCLUDING A NOVEL ABRASIVE
App. No. 17/217,097
→
DERIVATIZED POLYAMINO ACIDS
App. No. 17/123,295
→
COMPOSITION AND METHOD FOR DIELECTRIC CMP
App. No. 17/077,155
→
COMPOSITION AND METHOD FOR SELECTIVE OXIDE CMP
App. No. 17/077,485
→
POLISHING COMPOSITION AND METHOD WITH HIGH SELECTIVITY FOR SILICON NITRIDE AND POLYSILICON OVER SILICON OXIDE
App. No. 17/076,989
→
COMPOSITION AND METHOD FOR SILICON OXIDE AND CARBON DOPED SILICON OXIDE CMP
App. No. 17/077,295
→
COMPOSITION AND METHOD FOR DIELECTRIC CMP
App. No. 17/077,070
→
SELF-STOPPING POLISHING COMPOSITION AND METHOD
App. No. 17/077,414
→
COMPOSITION AND METHOD FOR POLYSILICON CMP
App. No. 17/009,961
→
POLISHING PAD EMPLOYING POLYAMINE AND CYCLOHEXANEDIMETHANOL CURATIVES
App. No. 16/923,688
→
SOLID POLYMER ELECTROLYTE COMPOSITIONS AND METHODS OF PREPARING SAME
App. No. 16/895,714
→
SECONDARY BATTERY CELL WITH SOLID POLYMER ELECTROLYTE
App. No. 16/895,769
→
CHEMICAL MECHANICAL PLANARIZATION PADS WITH CONSTANT GROOVE VOLUME
App. No. 16/868,755
→
CHEMICAL MECHANICAL PLANARIZATION PADS VIA VAT-BASED PRODUCTION
App. No. 16/868,965
→
SURFACE COATED ABRASIVE PARTICLES FOR TUNGSTEN BUFF APPLICATIONS
App. No. 16/849,021
→
ADDITIVES TO IMPROVE PARTICLE DISPERSION FOR CMP SLURRY
App. No. 16/826,409
→
SELF-STOPPING POLISHING COMPOSITION AND METHOD FOR BULK OXIDE PLANARIZATION
App. No. 16/797,438
→
DUAL ADDITIVE COMPOSITION FOR POLISHING MEMORY HARD DISKS EXHIBITING EDGE ROLL OFF
App. No. 16/729,905
→
POLISHING COMPOSITION AND METHOD UTILIZING ABRASIVE PARTICLES TREATED WITH AN AMINOSILANE
App. No. 16/664,235
→
METHOD TO INCREASE BARRIER FILM REMOVAL RATE IN BULK TUNGSTEN SLURRY
App. No. 16/513,404
→
COMPOSITION AND METHOD FOR POLISHING SILICON CARBIDE
App. No. 16/389,097
→
SELF-STOPPING POLISHING COMPOSITION AND METHOD FOR BULK OXIDE PLANARIZATION
App. No. 16/271,508
→
COMPOSITION FOR TUNGSTEN CMP
App. No. 16/236,962
→
COMPOSITION AND METHOD FOR SILICON NITRIDE CMP
App. No. 16/208,779
→
COMPOSITION AND METHOD FOR COPPER BARRIER CMP
App. No. 16/208,797
→
COMPOSITION AND METHOD FOR METAL CMP
App. No. 16/208,742
→
COMPOSITION FOR TUNGSTEN CMP
App. No. 16/131,180
→
METHODS AND COMPOSITIONS FOR PROCESSING DIELECTRIC SUBSTRATE
App. No. 16/018,281
→
COMPOSITION AND METHOD FOR POLISHING MEMORY HARD DISKS EXHIBITING REDUCED EDGE ROLL OFF
App. No. 16/000,062
→
CHEMICAL-MECHANICAL PROCESSING SLURRY AND METHODS FOR PROCESSING A NICKEL SUBSTRATE SURFACE
App. No. 15/951,598
→
CHEMICAL-MECHANICAL PROCESSING SLURRY AND METHODS
App. No. 15/951,358
→
SELF-STOPPING POLISHING COMPOSITION AND METHOD FOR BULK OXIDE PLANARIZATION
App. No. 15/934,219
→
CMP COMPOSITIONS CONTAINING POLYMER COMPLEXES AND AGENTS FOR STI APPLICATIONS
App. No. 15/920,813
→
COATED COMPRESSIVE SUBPAD FOR CHEMICAL MECHANICAL POLISHING
App. No. 15/875,773
→
TUNGSTEN BUFF POLISHING COMPOSITIONS WITH IMPROVED TOPOGRAPHY
App. No. 15/864,720
→
COMPOSITION AND METHOD FOR REMOVING RESIDUE FROM CHEMICAL-MECHANICAL PLANARIZATION SUBSTRATE
App. No. 15/825,305
→
COMPOSITION AND METHOD FOR POLISHING MEMORY HARD DISKS EXHIBITING REDUCED SURFACE SCRATCHING
App. No. 15/817,959
→
CMP COMPOSITIONS SELECTIVE FOR OXIDE AND NITRIDE WITH IMPROVED DISHING AND PATTERN SELECTIVITY
App. No. 15/784,949
→
SURFACE TREATED ABRASIVE PARTICLES FOR TUNGSTEN BUFF APPLICATIONS
App. No. 15/723,886
→
NITRIDE INHIBITORS FOR HIGH SELECTIVITY OF TiN-SiN CMP APPLICATIONS
App. No. 15/706,192
→
SYSTEMS FOR MIXING A LIQUID AND RELATED METHODS
App. No. 15/684,470
→
ALTERNATIVE OXIDIZING AGENTS FOR COBALT CMP
App. No. 15/649,378
→
POLISHING COMPOSITION COMPRISING AN AMINE-CONTAINING SURFACTANT
App. No. 15/629,487
→
CHEMICAL-MECHANICAL PROCESSING SLURRY AND METHODS FOR PROCESSING A NICKEL SUBSTRATE SURFACE
App. No. 15/615,591
→
COBALT POLISHING ACCELERATORS
App. No. 15/603,634
→
POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS
App. No. 15/479,779
→
METHOD OF POLISHING GROUP III-V MATERIALS
App. No. 15/433,068
→
POLISHING COMPOSITION COMPRISING CATIONIC POLYMER ADDITIVE
App. No. 15/414,786
→
CLEANING COMPOSITION FOLLOWING CMP AND METHODS RELATED THERETO
App. No. 15/327,326
→
COMPOSITION AND METHOD FOR POLISHING SILICON CARBIDE
App. No. 15/398,933
→
CMP PROCESSING COMPOSITION COMPRISING ALKYLAMINE AND CYCLODEXTRIN
App. No. 15/394,090
→
POLISHING COMPOSITION AND METHOD UTILIZING ABRASIVE PARTICLES TREATED WITH AN AMINOSILANE
App. No. 15/346,835
→
POLISHING COMPOSITION CONTAINING CERIA ABRASIVE
App. No. 15/338,724
→
POLYURETHANE CMP PADS HAVING A HIGH MODULUS RATIO
App. No. 15/273,855
→
METHODS AND COMPOSITIONS FOR PROCESSING DIELECTRIC SUBSTRATE
App. No. 15/207,973
→
CMP COMPOSITION AND METHOD FOR POLISHING RIGID DISKS
App. No. 15/091,275
→
POLISHING COMPOSITION CONTAINING CERIA PARTICLES AND METHOD OF USE
App. No. 15/056,198
→
CUSTOMIZED POLISHING PADS FOR CMP AND METHODS OF FABRICATION AND USE THEREOF
App. No. 15/042,777
→
CLEANING COMPOSITION AND METHOD FOR CLEANING SEMICONDUCTOR WAFERS AFTER CMP
App. No. 14/993,837
→
TUNGSTEN PROCESSING SLURRY WITH CATALYST
App. No. 14/988,891
→
COMPOSITION FOR TUNGSTEN CMP
App. No. 14/965,168
→
POLISHING PAD WITH FOUNDATION LAYER AND WINDOW ATTACHED THERETO
App. No. 14/931,737
→
TUNGSTEN-PROCESSING SLURRY WITH CATIONIC SURFACTANT AND CYCLODEXTRIN
App. No. 14/924,997
→
TUNGSTEN-PROCESSING SLURRY WITH CATIONIC SURFACTANT
App. No. 14/925,054
→
COBALT DISHING CONTROL AGENTS
App. No. 14/919,490
→
CORROSION INHIBITORS AND RELATED COMPOSITIONS AND METHODS
App. No. 14/919,404
→
COBALT POLISHING ACCELERATORS
App. No. 14/919,449
→
COBALT INHIBITOR COMBINATION FOR IMPROVED DISHING
App. No. 14/918,756
→
SLURRY FOR CHEMICAL MECHANICAL POLISHING OF COBALT
App. No. 14/919,526
→
NICKEL PHOSPHOROUS CMP COMPOSITIONS AND METHODS
App. No. 14/881,837
→
GROOVED CMP PADS
App. No. 14/874,179
→
SELECTIVE NITRIDE SLURRIES WITH IMPROVED STABILITY AND IMPROVED POLISHING CHARACTERISTICS
App. No. 14/849,066
→
TUNGSTEN CHEMICAL-MECHANICAL POLISHING COMPOSITION
App. No. 14/750,204
→
COLLOIDAL SILICA CHEMICAL-MECHANICAL POLISHING CONCENTRATE
App. No. 14/750,107
→
COPPER BARRIER CHEMICAL-MECHANICAL POLISHING COMPOSITION
App. No. 14/750,271
→
COLLOIDAL SILICA CHEMICAL-MECHANICAL POLISHING COMPOSITION
App. No. 14/749,923
→
METHODS FOR FABRICATING A CHEMICAL-MECHANICAL POLISHING COMPOSITION
App. No. 14/750,050
→
COLLOIDAL SILICA CHEMICAL-MECHANICAL POLISHING COMPOSITION
App. No. 14/749,948
→
POLISHING PAD WITH FOUNDATION LAYER AND POLISHING SURFACE LAYER
App. No. 14/732,497
→