IP Library Granted Patent US 12,459,076
Granted Patent B2
US 12,459,076 · App. 17/557,461 · Granted Nov 4, 2025

Chemical-mechanical polishing subpad having porogens with polymeric shells

Inventors: Dustin Miller (Beaverton, OR); Paul Andre Lefevre (Portland, OR); Aaron Peterson (Portland, OR); Chen-Chih Tsai (Naperville, IL)
Assignee: CMC MATERIALS LLC
B24B37/24B24D3/32B29C44/02
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,459,076
App. No.
17/557,461
Granted
Nov 4, 2025
Kind
B2
Abstract

A subpad for a chemical-mechanical polishing pad, the subpad having porogens with polymeric shells. Methods of fabricating the subpad and polishing pads with a polishing surface layer bonded to the subpad layer are also described.

Claims (10)

1 . A chemical-mechanical polishing pad comprising:

a subpad supporting a top pad, the subpad comprising a thermoset polyurethane body and a plurality of porogens distributed within the thermoset polyurethane body, the porogens comprising polymeric shells wherein the polymeric shells comprise a material selected from the group consisting of a block copolymer, polyvinylidene chloride, acrylonitrile, and acrylic materials, wherein the subpad has a density of about 150 kg/m 3 to about 900 kg/m 3 and a compression force deflection of about 25% between 5 psi and 200 psi; and

a top pad having a polishing surface, wherein the top pad is adhered to the subpad with an adhesive.

2 . The chemical mechanical polishing pad of claim 1 , wherein the porogens have an average pore size of about 5 micrometers to about 100 micrometers.

3 . The chemical mechanical polishing pad of claim 2 , wherein the porogens have an average pore size of about 15 micrometers to about 50 micrometers.

4 . The subpad of claim 1 , wherein the density of the subpad is about 450 kg/m 3 to about 800 kg/m 3 .

5 . The chemical mechanical polishing pad of claim 1 , wherein the porogens are filled with gas or a mixture of gas and liquid.

6 . The chemical mechanical polishing pad of claim 5 , wherein the porogens are filled with one or more materials selected from the group consisting of n-pentane, iso-pentane, butane, and iso-butane.

7 . The chemical mechanical polishing pad of claim 1 , wherein greater than 99% of the porogens are closed cells.

8 . The chemical mechanical polishing pad of claim 1 , wherein the hardness is about 10 Shore A to about 90 Shore A, the tan delta is between about 0.02 and about 0.5, the elastic modulus (E′) is about 0.1 MPa to about 400 MPa, and/or the thickness is about 0.2 mm to about 5 mm.

Assignments (5)
CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY DATA FROM ENTEGRIS, INC. TO CMC MATERIALS, INC.,870 NORTH COMMONS DRIVE, AURORA, ILLINOIS, 60504 PREVIOUSLY RECORDED ON REEL 066087 FRAME 0202. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jan 26, 2024
From: MILLER, DUSTIN; LEFEVRE, PAUL ANDRE; PETERSON, AARON; TSAI, CHEN-CHIH
To: CMC MATERIALS, INC.
Reel/Frame 066374/0430 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2024
From: MILLER, DUSTIN; MILLER, PAUL ANDRE; PETERSON, AARON; TSAI, CHEN-CHIH
To: ENTEGRIS, INC.
Reel/Frame 066087/0202 →
CHANGE OF NAME Recorded Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →
SECURITY INTEREST Recorded Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
SECURITY INTEREST Recorded Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
Continuity (2)
Provisional Application 63128953 · Dec 22, 2020
Related Publication 20220193860A1 · Jun 23, 2022
References Cited (16)
US 20040144537A1 · Reddy · 2004 [cited by examiner]
US 20050197050A1 · Prasad · 2005 [cited by examiner]
US 20120094586A1 · Huang et al. · 2012 [cited by applicant]
US 20130137349A1 · Lefevre et al. · 2013 [cited by applicant]
US 20130137350A1 · Allison et al. · 2013 [cited by applicant]
US 20140357169A1 · Murnane et al. · 2014 [cited by applicant]
US 20150325451A1 · Mrzyglod · 2015 [cited by examiner]
US 20150367478A1 · Lefevre et al. · 2015 [cited by applicant]
US 20160114458A1 · Bajaj · 2016 [cited by applicant]
US 20160144477A1 · Scott · 2016 [cited by examiner]
JP 2005001059A · 2005 [cited by applicant]
JP 2010082708A · 2010 [cited by applicant]
JP 2016193487A · 2016 [cited by applicant]
JP 6076900B2 · 2017 [cited by applicant]
WO WO2012005778 · 2012 [cited by examiner]
Korean Intellectual Property Office Acting as ISA, Search Report and Written Opinion of the International Searching Authority issued in connection with Application No. PCT/US2021/064547 on Apr. 13, 2022. [cited by applicant]