IP Library › Granted Patent US 10,301,508
Granted Patent B2
US 10,301,508 · App. 15/414,786 · Granted May 28, 2019

Polishing composition comprising cationic polymer additive

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Quick Facts
Patent No.
US 10,301,508
App. No.
15/414,786
Granted
May 28, 2019
Kind
B2
Abstract

The invention provides a chemical-mechanical polishing composition comprising (a) wet-process ceria, (b) a water-soluble cationic polymer or copolymer, (c) an aromatic carboxylic acid or heteroaromatic carboxylic acid, and (d) water, wherein the polishing composition has a pH of about 3 to about 6. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate contains silicon oxide.

Claims (11)

1. A chemical-mechanical polishing composition comprising:

(a) wet-process ceria,

(b) a water-soluble cationic polymer or copolymer, wherein the water-soluble cationic polymer is a cross-linked cationic copolymer prepared from the polymerization of melamine or a halogenated derivative thereof and an aldehyde,

(c) an aromatic carboxylic acid or heteroaromatic carboxylic acid, and

(d) water,

wherein the polishing composition has a pH of about 3 to about 6.

2. The polishing composition of claim 1 , wherein the polishing composition comprises about 0.05 wt. % to about 2 wt. % of wet-process ceria.

3. The polishing composition of claim 1 , wherein the water-soluble cationic polymer is a melamine-formaldehyde copolymer.

4. The polishing composition of claim 3 , wherein the melamine-formaldehyde copolymer is a methylated melamine-formaldehyde copolymer.

5. The polishing composition of claim 1 , wherein the polishing composition comprises about 50 ppm to about 200 ppm of the water-soluble cationic polymer or copolymer.

6. The polishing composition of claim 1 , wherein the aromatic carboxylic acid or heteroaromatic carboxylic acid is picolinic acid or dipicolinic acid.

Assignments (8)
CHANGE OF NAME Recorded Nov 22, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065663/0466 →
CHANGE OF NAME Recorded Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →
SECURITY INTEREST Recorded Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
SECURITY INTEREST Recorded Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
RELEASE OF SECURITY INTEREST Recorded Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; KMG-BERNUTH, INC.; MPOWER SPECIALTY CHEMICALS LLC; SEALWELD (USA), INC.; INTERNATIONAL TEST SOLUTIONS, LLC; CMC MATERIALS, INC.
Reel/Frame 060592/0260 →
CHANGE OF NAME Recorded Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 17, 2019
From: LAM, VIET; LI, TINA
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 048050/0321 →
SECURITY AGREEMENT Recorded Nov 16, 2018
From: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; MPOWER SPECIALTY CHEMICALS LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047588/0263 →