IP Library › Assignment 060592/0260
Patent Assignment
Reel/Frame 060592/0260

RELEASE OF SECURITY INTEREST

Recorded: 2022-07-06 Received: 2022-07-06 Pages: 56
Assignor
JPMORGAN CHASE BANK, N.A.
Executed: 2022-07-06
Assignees
CABOT MICROELECTRONICS CORPORATION
870 N. COMMONS DR., AURORA, IL, 60504, UNITED STATES
QED TECHNOLOGIES INTERNATIONAL, INC.
1040 UNIVERSITY AVENUE, ROCHESTER, NY, 14607, UNITED STATES
FLOWCHEM LLC
43253 OLD HOUSTON HIGHWAY, WALLER, TX, 77484, UNITED STATES
KMG ELECTRONIC CHEMICALS, INC.
300 THROCKMORTON STREET, FORT WORTH, TX, 76102, UNITED STATES
KMG-BERNUTH, INC.
300 THROCKMORTON STREET, FORT WORTH, TX, 76102, UNITED STATES
MPOWER SPECIALTY CHEMICALS LLC
43253 OLD HOUSTON HIGHWAY, WALLER, TX, 77484, UNITED STATES
SEALWELD (USA), INC.
300 THROCKMORTON STREET, FORT WORTH, TX, 76102, UNITED STATES
INTERNATIONAL TEST SOLUTIONS, LLC
870 N. COMMONS DR., AURORA, IL, 60504, UNITED STATES
CMC MATERIALS, INC.
870 N. COMMONS DR., AURORA, IL, 60504, UNITED STATES
Covered Applications (100)
COMPOSITION AND METHOD FOR DIELECTRIC CMP
App. No. 17/077,155
→
COMPOSITION AND METHOD FOR SELECTIVE OXIDE CMP
App. No. 17/077,485
→
POLISHING COMPOSITION AND METHOD WITH HIGH SELECTIVITY FOR SILICON NITRIDE AND POLYSILICON OVER SILICON OXIDE
App. No. 17/076,989
→
COMPOSITION AND METHOD FOR SILICON OXIDE AND CARBON DOPED SILICON OXIDE CMP
App. No. 17/077,295
→
COMPOSITION AND METHOD FOR DIELECTRIC CMP
App. No. 17/077,070
→
SELF-STOPPING POLISHING COMPOSITION AND METHOD
App. No. 17/077,414
→
COMPOSITION AND METHOD FOR POLYSILICON CMP
App. No. 17/009,961
→
POLISHING PAD EMPLOYING POLYAMINE AND CYCLOHEXANEDIMETHANOL CURATIVES
App. No. 16/923,688
→
Wafer Manufacturing Cleaning Apparatus, Process And Method Of Use
App. No. 16/895,106
→
DEVICE AND METHOD FOR THERMAL STABILIZATION OF PROBE ELEMENTS USING A HEAT CONDUCTING WAFER
App. No. 16/872,292
→
CHEMICAL MECHANICAL PLANARIZATION PADS WITH CONSTANT GROOVE VOLUME
App. No. 16/868,755
→
CHEMICAL MECHANICAL PLANARIZATION PADS VIA VAT-BASED PRODUCTION
App. No. 16/868,965
→
SYSTEM AND METHOD FOR CLEANING WIRE BONDING MACHINES USING FUNCTIONALIZED SURFACE MICROFEATURES
App. No. 16/855,841
→
SURFACE COATED ABRASIVE PARTICLES FOR TUNGSTEN BUFF APPLICATIONS
App. No. 16/849,021
→
ADDITIVES TO IMPROVE PARTICLE DISPERSION FOR CMP SLURRY
App. No. 16/826,409
→
SELF-STOPPING POLISHING COMPOSITION AND METHOD FOR BULK OXIDE PLANARIZATION
App. No. 16/797,438
→
PICK AND PLACE MACHINE CLEANING SYSTEM AND METHOD
App. No. 16/794,068
→
DUAL ADDITIVE COMPOSITION FOR POLISHING MEMORY HARD DISKS EXHIBITING EDGE ROLL OFF
App. No. 16/729,905
→
OXIDIZER FREE SLURRY FOR RUTHENIUM CMP
App. No. 16/706,991
→
SYSTEM AND METHOD FOR CLEANING CONTACT ELEMENTS AND SUPPORT HARDWARE USING FUNCTIONALIZED SURFACE MICROFEATURES
App. No. 16/684,453
→
POLISHING COMPOSITION AND METHOD UTILIZING ABRASIVE PARTICLES TREATED WITH AN AMINOSILANE
App. No. 16/664,235
→
METHOD TO INCREASE BARRIER FILM REMOVAL RATE IN BULK TUNGSTEN SLURRY
App. No. 16/513,404
→
PICK AND PLACE MACHINE CLEANING SYSTEM AND METHOD
App. No. 16/460,918
→
PICK AND PLACE MACHINE CLEANING SYSTEM AND METHOD
App. No. 16/460,929
→
PICK AND PLACE MACHINE CLEANING SYSTEM AND METHOD
App. No. 16/460,935
→
PICK AND PLACE MACHINE CLEANING SYSTEM AND METHOD
App. No. 16/460,877
→
COMPOSITION AND METHOD FOR POLISHING SILICON CARBIDE
App. No. 16/389,097
→
WORKING SURFACE CLEANING SYSTEM AND METHOD
App. No. 16/290,789
→
NOVEL MATERIAL AND HARDWARE TO AUTOMATICALLY CLEAN FLEXIBLE ELECTRONIC WEB ROLLS
App. No. 16/283,592
→
NOVEL MATERIAL AND HARDWARE TO AUTOMATICALLY CLEAN FLEXIBLE ELECTRONIC WEB ROLLS
App. No. 16/283,603
→
NOVEL MATERIAL AND HARDWARE TO AUTOMATICALLY CLEAN FLEXIBLE ELECTRONIC WEB ROLLS
App. No. 16/283,613
→
NOVEL MATERIAL AND HARDWARE TO AUTOMATICALLY CLEAN FLEXIBLE ELECTRONIC WEB ROLLS
App. No. 16/283,607
→
SELF-STOPPING POLISHING COMPOSITION AND METHOD FOR BULK OXIDE PLANARIZATION
App. No. 16/271,508
→
COMPOSITION FOR TUNGSTEN CMP
App. No. 16/236,962
→
APPARATUSES, DEVICE, AND METHODS FOR CLEANING TESTER INTERFACE CONTACT ELEMENTS AND SUPPORT HARDWARE
App. No. 16/228,664
→
COMPOSITION AND METHOD FOR SILICON NITRIDE CMP
App. No. 16/208,779
→
COMPOSITION AND METHOD FOR COPPER BARRIER CMP
App. No. 16/208,797
→
COMPOSITION AND METHOD FOR COBALT CMP
App. No. 16/208,703
→
COMPOSITION AND METHOD FOR METAL CMP
App. No. 16/208,742
→
Wafer Manufacturing Cleaning Apparatus, Process And Method Of Use
App. No. 16/136,965
→
COMPOSITION FOR TUNGSTEN CMP
App. No. 16/131,180
→
METHODS AND COMPOSITIONS FOR PROCESSING DIELECTRIC SUBSTRATE
App. No. 16/018,281
→
COMPOSITION AND METHOD FOR POLISHING MEMORY HARD DISKS EXHIBITING REDUCED EDGE ROLL OFF
App. No. 16/000,062
→
CHEMICAL-MECHANICAL PROCESSING SLURRY AND METHODS FOR PROCESSING A NICKEL SUBSTRATE SURFACE
App. No. 15/951,598
→
CHEMICAL-MECHANICAL PROCESSING SLURRY AND METHODS
App. No. 15/951,358
→
SELF-STOPPING POLISHING COMPOSITION AND METHOD FOR BULK OXIDE PLANARIZATION
App. No. 15/934,219
→
CMP COMPOSITIONS CONTAINING POLYMER COMPLEXES AND AGENTS FOR STI APPLICATIONS
App. No. 15/920,813
→
COATED COMPRESSIVE SUBPAD FOR CHEMICAL MECHANICAL POLISHING
App. No. 15/875,773
→
TUNGSTEN BULK POLISHING METHOD WITH IMPROVED TOPOGRAPHY
App. No. 15/866,008
→
TUNGSTEN BUFF POLISHING COMPOSITIONS WITH IMPROVED TOPOGRAPHY
App. No. 15/864,720
→
COMPOSITION AND METHOD FOR REMOVING RESIDUE FROM CHEMICAL-MECHANICAL PLANARIZATION SUBSTRATE
App. No. 15/825,305
→
WORKING SURFACE CLEANING SYSTEM AND METHOD
App. No. 15/818,386
→
COMPOSITION AND METHOD FOR POLISHING MEMORY HARD DISKS EXHIBITING REDUCED SURFACE SCRATCHING
App. No. 15/817,959
→
CMP COMPOSITIONS SELECTIVE FOR OXIDE AND NITRIDE WITH IMPROVED DISHING AND PATTERN SELECTIVITY
App. No. 15/784,949
→
DIAMOND-BASED SLURRIES WITH IMPROVED SAPPHIRE REMOVAL RATE AND SURFACE ROUGHNESS
App. No. 15/564,605
→
SURFACE TREATED ABRASIVE PARTICLES FOR TUNGSTEN BUFF APPLICATIONS
App. No. 15/723,886
→
SEMICONDUCTOR WIRE BONDING MACHINE CLEANING DEVICE AND METHOD
App. No. 15/723,151
→
NITRIDE INHIBITORS FOR HIGH SELECTIVITY OF TiN-SiN CMP APPLICATIONS
App. No. 15/706,192
→
SYSTEMS FOR MIXING A LIQUID AND RELATED METHODS
App. No. 15/684,470
→
ALTERNATIVE OXIDIZING AGENTS FOR COBALT CMP
App. No. 15/649,378
→
POLISHING COMPOSITION COMPRISING AN AMINE-CONTAINING SURFACTANT
App. No. 15/629,487
→
CHEMICAL-MECHANICAL PROCESSING SLURRY AND METHODS FOR PROCESSING A NICKEL SUBSTRATE SURFACE
App. No. 15/615,591
→
COBALT POLISHING ACCELERATORS
App. No. 15/603,634
→
SEMICONDUCTOR WIRE BONDING MACHINE CLEANING DEVICE AND METHOD
App. No. 15/495,873
→
POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS
App. No. 15/479,779
→
METHOD OF POLISHING GROUP III-V MATERIALS
App. No. 15/433,068
→
Wafer Manufacturing Cleaning Apparatus, Process And Method Of Use
App. No. 15/419,840
→
POLISHING COMPOSITION COMPRISING CATIONIC POLYMER ADDITIVE
App. No. 15/414,786
→
CLEANING COMPOSITION FOLLOWING CMP AND METHODS RELATED THERETO
App. No. 15/327,326
→
METHOD OF POLISHING A LOW-K SUBSTRATE
App. No. 15/399,810
→
COMPOSITION AND METHOD FOR POLISHING SILICON CARBIDE
App. No. 15/398,933
→
CMP PROCESSING COMPOSITION COMPRISING ALKYLAMINE AND CYCLODEXTRIN
App. No. 15/394,090
→
POLISHING COMPOSITION AND METHOD UTILIZING ABRASIVE PARTICLES TREATED WITH AN AMINOSILANE
App. No. 15/346,835
→
POLISHING COMPOSITION CONTAINING CERIA ABRASIVE
App. No. 15/338,724
→
CMP POLISHING PAD WITH COLUMNAR STRUCTURE AND METHODS RELATED THERETO
App. No. 15/303,696
→
POLYURETHANE CMP PADS HAVING A HIGH MODULUS RATIO
App. No. 15/273,855
→
METHODS AND COMPOSITIONS FOR PROCESSING DIELECTRIC SUBSTRATE
App. No. 15/252,567
→
METHODS AND COMPOSITIONS FOR PROCESSING DIELECTRIC SUBSTRATE
App. No. 15/207,973
→
CMP COMPOSITION AND METHOD FOR POLISHING RIGID DISKS
App. No. 15/091,275
→
POLISHING COMPOSITION CONTAINING CERIA PARTICLES AND METHOD OF USE
App. No. 15/056,198
→
CUSTOMIZED POLISHING PADS FOR CMP AND METHODS OF FABRICATION AND USE THEREOF
App. No. 15/042,777
→
CLEANING COMPOSITION AND METHOD FOR CLEANING SEMICONDUCTOR WAFERS AFTER CMP
App. No. 14/993,837
→
TUNGSTEN PROCESSING SLURRY WITH CATALYST
App. No. 14/988,891
→
COMPOSITION FOR TUNGSTEN CMP
App. No. 14/965,168
→
POLISHING PAD WITH FOUNDATION LAYER AND WINDOW ATTACHED THERETO
App. No. 14/931,737
→
TUNGSTEN-PROCESSING SLURRY WITH CATIONIC SURFACTANT AND CYCLODEXTRIN
App. No. 14/924,997
→
TUNGSTEN-PROCESSING SLURRY WITH CATIONIC SURFACTANT
App. No. 14/925,054
→
COBALT DISHING CONTROL AGENTS
App. No. 14/919,490
→
CORROSION INHIBITORS AND RELATED COMPOSITIONS AND METHODS
App. No. 14/919,404
→
COBALT POLISHING ACCELERATORS
App. No. 14/919,449
→
COBALT INHIBITOR COMBINATION FOR IMPROVED DISHING
App. No. 14/918,756
→
SLURRY FOR CHEMICAL MECHANICAL POLISHING OF COBALT
App. No. 14/919,526
→
NICKEL PHOSPHOROUS CMP COMPOSITIONS AND METHODS
App. No. 14/881,837
→
POLISHING PAD WITH CONCENTRIC OR APPROXIMATELY CONCENTRIC POLYGON GROOVE PATTERN
App. No. 14/875,513
→
GROOVED CMP PADS
App. No. 14/874,179
→
SELECTIVE NITRIDE SLURRIES WITH IMPROVED STABILITY AND IMPROVED POLISHING CHARACTERISTICS
App. No. 14/849,066
→
COMPOSITION AND METHOD FOR POLISHING A SAPPHIRE SURFACE
App. No. 14/838,460
→
SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE
App. No. 14/823,956
→
TUNGSTEN CHEMICAL-MECHANICAL POLISHING COMPOSITION
App. No. 14/750,204
→
COLLOIDAL SILICA CHEMICAL-MECHANICAL POLISHING CONCENTRATE
App. No. 14/750,107
→