IP Library › Granted Patent US 12,227,673
Granted Patent B2
US 12,227,673 · App. 16/208,779 · Granted Feb 18, 2025

Composition and method for silicon nitride CMP

Inventors: Fernando Hung Low (Aurora, IL); Steven Kraft (Plainfield, IL); Roman A. Ivanov (Aurora, IL)
Assignee: CMC MATERIALS LLC
C09G1/02H01L21/31055C09K3/1409
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Quick Facts
Patent No.
US 12,227,673
App. No.
16/208,779
Granted
Feb 18, 2025
Kind
B2
Abstract

The invention provides a chemical-mechanical polishing composition for polishing a silicon nitride containing substrate. The composition includes an aqueous carrier; cationic silica particles dispersed in the aqueous carrier, the cationic silica abrasive particles having a zeta potential of at least 10 mV in the polishing composition; a polishing additive selected from the group consisting of a polyether amine, a polysilamine, a polyvinylimidazole, and a combination thereof, wherein the polyether amine and the polysilamine have corresponding weight average molecular weights of about 1,000 g/mol or less. The composition has a pH of greater than about 6. A method for polishing a silicon nitride containing substrate is also provided.

Claims (10)

1. A chemical-mechanical polishing composition for polishing a silicon nitride containing substrate, the polishing composition comprising:

an aqueous carrier;

cationic silica particles dispersed in the aqueous carrier, the cationic silica abrasive particles having a zeta potential of at least 10 mV in the polishing composition;

a polishing additive comprising polyether amine having a weight average molecular weight of about 500 g/mol or less, wherein the polyether amine is of Formula (I):

wherein R is a C 1 -C 6 alkyl group and x, y, and z independently are integers from 0 to 15, wherein the polishing additive is present in the polishing composition at a concentration in a range from about 0.07 mM to about 0.25 mM; and

wherein the polishing composition has a pH of about 6 to about 8.

2. The polishing composition of claim 1 , wherein the cationic silica abrasive particles have a surface which has been treated with a quaternary aminosilane, dipodal aminosilane, or combinations thereof.

3. The polishing composition of claim 1 , wherein the cationic silica abrasive particles comprise colloidal silica particles having a permanent positive charge of at least 20 mV at a pH of greater than about 6.

4. The polishing composition of claim 3 , wherein the polishing composition has a pH of about 7.

5. The polishing composition of claim 1 , wherein the cationic silica abrasive particles have a mean particle size of about 20 nm to about 80 nm.

Assignments (8)
CHANGE OF NAME Recorded Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →
SECURITY INTEREST Recorded Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
SECURITY INTEREST Recorded Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.; KMG-BERNUTH, INC.; MPOWER SPECIALTY CHEMICALS LLC; SEALWELD (USA), INC.; INTERNATIONAL TEST SOLUTIONS, LLC; CMC MATERIALS, INC.
Reel/Frame 060592/0260 →
SECURITY AGREEMENT Recorded Jul 2, 2021
From: CMC MATERIALS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 056752/0645 →
CHANGE OF NAME Recorded Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 18, 2019
From: HUNG LOW, FERNANDO; KRAFT, STEVEN; IVANOV, ROMAN A.
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 051033/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 4, 2018
From: HUNG LOW, FERNANDO; KRAFT, STEVEN; IVANOV, ROMAN A.
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 047666/0161 →
Continuity (1)
Related Publication 20200172761A1 · Jun 4, 2020
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