IP Library Assignment 056752/0645
Patent Assignment
Reel/Frame 056752/0645

Security Agreement

Recorded: 2021-07-02 Pages: 8
Assignor
CMC MATERIALS, INC.
Executed: 2021-07-02
Assignee
JPMORGAN CHASE BANK, N.A.
10 SOUTH DEARBORN STREET, FLOOR L2, CHICAGO, ILLINOIS, 60603
Covered Properties (25)
Polishing Composition and Method Utilizing Abrasive Particles Treated with an Aminosilane
Application: 16/664,235 →
Publication: US US20200056069A1
Polishing Composition and Method with High Selectivity for Silicon Nitride and Polysilicon Over Silicon Oxide
Application: 17/076,989 →
Publication: US US20210115297A1
Composition and Method for Dielectric Cmp
Application: 17/077,070 →
Publication: US US20210115298A1
Composition and Method for Dielectric Cmp
Application: 17/077,155 →
Publication: US US20210115299A1
Composition and Method for Silicon Oxide and Carbon Doped Silicon Oxide Cmp
Application: 17/077,295 →
Publication: US US20210115300A1
Self-Stopping Polishing Composition and Method
Application: 17/077,414 →
Publication: US US20210115301A1
Composition and Method for Selective Oxide Cmp
Application: 17/077,485 →
Publication: US US20210115302A1
Composition and Method for Polysilicon Cmp
Application: 17/009,961 →
Publication: US US20210062043A1
Method to Increase Barrier Film Removal Rate in Bulk Tungsten Slurry
Application: 16/513,404 →
Publication: US US20210017421A1
Polishing Pad Employing Polyamine and Cyclohexanedimethanol Curatives
Application: 16/923,688 →
Publication: US US20210008687A1
Chemical Mechanical Planarization Pads with Constant Groove Volume
Application: 16/868,755 →
Publication: US US20200353588A1
Chemical Mechanical Planarization Pads via Vat-Based Production
Application: 16/868,965 →
Publication: US US20200353586A1
Surface Coated Abrasive Particles for Tungsten Buff Applications
Application: 16/849,021 →
Publication: US US20200332150A1
Additives to Improve Particle Dispersion for Cmp Slurry
Application: 16/826,409 →
Publication: US US20200308451A1
Dual Additive Composition for Polishing Memory Hard Disks Exhibiting Edge Roll Off
Application: 16/729,905 →
Publication: US US20200224057A1
Oxidizer Free Slurry for Ruthenium Cmp
Application: 16/706,991 →
Publication: US US20200181454A1
Composition and Method for Silicon Nitride Cmp
Application: 16/208,779 →
Publication: US US20200172761A1
Composition and Method for Cobalt Cmp
Application: 16/208,703 →
Publication: US US20200172759A1
Composition and Method for Polishing Silicon Carbide
Application: 16/389,097 →
Publication: US US20190241783A1
Composition and Method for Copper Barrier Cmp
Application: 16/208,797 →
Publication: US US20200172762A1
Composition and Method for Metal Cmp
Application: 16/208,742 →
Publication: US US20200172760A1
Self-Stopping Polishing Composition and Method for Bulk Oxide Planarization
Application: 16/797,438 →
Publication: US US20200190361A1
Self-Stopping Polishing Composition and Method for Bulk Oxide Planarization
Application: 16/271,508 →
Publication: US US20190185716A1
Composition for Tungsten Cmp
Application: 16/236,962 →
Publication: US US20200208014A1
Safety Closures and Pumping Systems
Application: 14/577,453 →
Publication: US US20150184784A1
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 4, 2018
From: HUNG LOW, FERNANDO; KRAFT, STEVEN; IVANOV, ROMAN A.
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 047666/0161 →
Assignment of Assignor's Interest Dec 4, 2018
From: HUNG LOW, FERNANDO; KRAFT, STEVEN; IVANOV, ROMAN A.; GRUMBINE, STEVEN
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 047665/0536 →
Assignment of Assignor's Interest Dec 4, 2018
From: KRAFT, STEVEN; HUNG LOW, FERNANDO; IVANOV, ROMAN A.; GRUMBINE, STEVEN
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 047666/0421 →
Assignment of Assignor's Interest Apr 19, 2019
From: IVANOV, ROMAN; HUNG LOW, FERNANDO; KO, CHENG-YUAN; WHITENER, GLENN
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 048936/0116 →
Assignment of Assignor's Interest Jul 16, 2019
From: WARD, WILLIAM J.; CARNES, MATTHEW E.; CUI, JI; HUANG, HELIN
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 049768/0972 →
Assignment of Assignor's Interest Oct 25, 2019
From: GRUMBINE, STEVEN; LI, SHOUTIAN; WARD, WILLIAM; SINGH, PANKAJ
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 050833/0017 →
Assignment of Assignor's Interest Nov 17, 2019
From: HUNG LOW, FERNANDO; KRAFT, STEVEN; IVANOV, ROMAN A.; GRUMBINE, STEVEN
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 051031/0108 →
Assignment of Assignor's Interest Nov 18, 2019
From: KRAFT, STEVEN; HUNG LOW, FERNANDO; IVANOV, ROMAN A.; GRUMBINE, STEVEN
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 051033/0186 →
Assignment of Assignor's Interest Nov 18, 2019
From: HUNG LOW, FERNANDO; KRAFT, STEVEN; IVANOV, ROMAN A.
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 051033/0058 →
Assignment of Assignor's Interest Dec 9, 2019
From: KO, CHENG-YUAN; HUANG, HUNG-TSUNG; CARTER, TYLER J.
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 051214/0505 →
Assignment of Assignor's Interest Dec 30, 2019
From: LI, TONG
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 051385/0823 →
Assignment of Assignor's Interest Mar 23, 2020
From: LEE, YANG-YAO; WU, HSIN-YEN; KO, CHENG -YUAN; LU, LUNG-TAI
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 052191/0335 →
Assignment of Assignor's Interest Apr 15, 2020
From: CHIEN, CHIH-HSIEN; LU, LUNG-TAI; HUANG, HUNG-TSUNG; HUANG, HELIN
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 052402/0275 →
Assignment of Assignor's Interest May 7, 2020
From: LEFEVRE, PAUL ANDRE; SCHMITT, DEVIN; LEE, JAESEOK; MOYER, ERIC S.
To: CABOT MICROELECTRONICS
Reel/Frame 052599/0098 →
Assignment of Assignor's Interest Jul 8, 2020
From: MA, RUI; FU, LIN; TSAI, CHEN-CHIH; LEE, JAESEOK
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 053152/0657 →
Assignment of Assignor's Interest Sep 2, 2020
From: BROSNAN, SARAH; REISS, BRIAN
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 053669/0957 →
Assignment of Assignor's Interest Nov 18, 2020
From: MOYER, ERIC S.; FU, LIN; SPITZIG, WILLIAM MICHAEL; TSAI, CHEN-CHIH
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 054408/0673 →
Change of Name Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
Assignment of Assignor's Interest Feb 11, 2021
From: KRAFT, STEVEN; HUNG LOW, FERNANDO; PALLIKKARA KUTTIATOOR, SUDEEP; BROSNAN, SARAH
To: CMC MATERIALS, INC.
Reel/Frame 055237/0738 →
Assignment of Assignor's Interest Feb 11, 2021
From: BROSNAN, SARAH; KRAFT, STEVEN; HUNG LOW, FERNANDO; PETRO, BENJAMIN
To: CMC MATERIALS, INC.
Reel/Frame 055237/0062 →
Assignment of Assignor's Interest Feb 11, 2021
From: BROSNAN, SARAH; KRAFT, STEVEN; HUNG LOW, FERNANDO; PETRO, BENJAMIN
To: CMC MATERIALS, INC.
Reel/Frame 055236/0919 →
Assignment of Assignor's Interest Feb 11, 2021
From: PETRO, BENJAMIN; JOHNSON, BRITTANY; CHANG, JUYEON
To: CMC MATERIALS, INC.
Reel/Frame 055236/0776 →
Assignment of Assignor's Interest May 13, 2021
From: JOHNSON, BRITTANY; HAINS, ALEXANDER W.; BROSNAN, SARAH; KRAFT, STEVEN
To: CMC MATERIALS, INC.
Reel/Frame 056234/0318 →
Assignment of Assignor's Interest May 13, 2021
From: CHANG, JUYEON; BROSNAN, SARAH; JOHNSON, BRITTANY; WANG, JINFENG
To: CABOT MICROELECTRONICS CORPORATION
Reel/Frame 056233/0803 →
Change of Name May 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 056238/0523 →