Chemical mechanical planarization pads via vat-based production

1. A method of making a chemical mechanical polishing pad, the method comprising:

providing a precursor to a first vat of a first additive manufacturing apparatus; and

preparing at least a portion of the chemical mechanical polishing pad via a layer-by-layer process by exposing the precursor to patterned light, the prepared portion comprising a polymer material with a first elastic modulus, wherein:

the prepared portion is a backing portion of the chemical mechanical polishing pad; and

the method further comprises:

removing the backing portion from the first vat;

affixing the backing portion to a surface within a second vat of a second additive manufacturing apparatus;

providing a second precursor to the second vat of the second additive manufacturing apparatus; and

preparing a polishing portion of the chemical mechanical polishing pad by exposing the second precursor to patterned light, the prepared polishing portion comprising a polymer material with a second elastic modulus, wherein the first elastic modulus is less than the second elastic modulus.

2. The method of claim 1 , wherein the precursor comprises a resin and one or both of a porogen and a crosslinking agent.

3. The method of claim 2 , wherein the resin is one component of a multiple component dual cure resin.

4. The method of claim 2 , wherein a concentration of the porogen is in a range from one to thirty percent by weight.

5. The method of claim 2 , wherein the crosslinking agent is an isocyanate compound.

6. The method of claim 1 , wherein the backing portion comprises at least one of a nonporous layer, a porous layer, or a lattice structure.

7. The method of claim 1 , wherein the polishing portion comprises a polishing surface, the polishing surface comprising at least one of grooves, pores, or a microstructure.

8. The method of claim 1 , wherein a density of the polishing portion is in a range from 0.3 to 0.9 grams per centimeter cubed.