Patent Assignment
Reel/Frame 052191/0335
Assignment of Assignor's Interest
Recorded: 2020-03-23
Pages: 4
Assignors
LEE, YANG-YAO
Executed: 2019-04-12
WU, HSIN-YEN
Executed: 2019-04-12
KO, CHENG -YUAN
Executed: 2019-04-12
LU, LUNG-TAI
Executed: 2019-04-12
HUANG, HUNG-TSUNG
Executed: 2019-04-12
Assignee
CABOT MICROELECTRONICS CORPORATION
870 NORTH COMMONS DRIVE, AURORA, 60504
Covered Property
(1)
Additives to Improve Particle Dispersion for Cmp Slurry
Application:
16/826,409 →
Publication:
US 2020/0308451
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
Security Agreement
Jul 2, 2021
From: CMC MATERIALS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 056752/0645 →
Release of Security Interest
Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
Reel/Frame 060592/0260 →
Security Interest
Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
Security Interest
Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
Change of Name
Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →