Composition for tungsten CMP
A chemical mechanical polishing composition includes a water based liquid carrier, cationic abrasive particles dispersed in the liquid carrier, a first amino acid compound having an isoelectric point of less than 7 and a second amino acid compound having an isoelectric point of greater than 7. The pH of the composition is in a range from about 1 to about 5. A method for chemical mechanical polishing a substrate including a tungsten layer includes contacting the substrate with the above described polishing composition, moving the polishing composition relative to the substrate, and abrading the substrate to remove a portion of the tungsten from the substrate and thereby polish the substrate.
1. A chemical mechanical polishing composition for polishing a substrate having a tungsten layer, the composition comprising:
a water based liquid carrier;
cationic abrasive particles dispersed in the liquid carrier;
a first amino acid compound having an isoelectric point of less than 7;
a second amino acid compound having an isoelectric point of greater than 7; and
a pH in a range from about 1 to about 5.
2. The composition of claim 1 , having a pH in a range from about 3 to about 5.
3. The composition of claim 1 , wherein the first amino acid compound is selected from the group consisting of alanine, phenylalanine, glycine, leucine, isoleucine, proline, tyrosine, valine, glutamic acid, and mixtures thereof.
4. The composition of claim 1 , wherein the first amino acid compound is selected from glycine, valine, alanine, and mixtures thereof.
5. The composition of claim 1 , wherein the second amino acid compound is selected from the group consisting of histidine, arginine, lysine, and mixtures thereof.
6. The composition of claim 1 , wherein the first amino acid compound is glycine and the second amino acid compound is arginine.
7. The composition of claim 1 comprising:
from about 0.05 to about 1 weight percent of the first amino acid compound; and
from about 0.005 to about 0.2 weight percent of the second amino acid compound.
8. The composition of claim 1 , wherein the cationic abrasive particles have a zeta potential in a range from about 10 mV to about 40 mV in the composition.
9. The composition of claim 1 , wherein:
the cationic abrasive particles comprise colloidal silica abrasive particles having a permanent positive charge;
the colloidal silica abrasive particles have a zeta potential in range from about 10 mV to about 40 mV in the composition;
the colloidal silica abrasive particles have an average particle size greater than about 40 nm; and
the composition has a pH in a range from about 3.5 to about 5.
10. The composition of claim 1 , further comprising an iron containing accelerator.
11. The composition of claim 10 , further comprising a stabilizer bound to the iron containing accelerator, the stabilizer being selected from the group consisting of phosphoric acid, phthalic acid, citric acid, adipic acid, oxalic acid, malonic acid, aspartic acid, succinic acid, glutaric acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, maleic acid, glutaconic acid, muconic acid, ethylenediaminetetraacetic acid, propylenediaminetetraacetic acid, and mixtures thereof.
12. The composition of claim 1 , further comprising a hydrogen peroxide oxidizer.
13. A chemical mechanical polishing composition for polishing a substrate having a tungsten layer, the composition comprising:
a water based liquid carrier;
colloidal silica abrasive particles having a permanent positive charge and an average particle size greater than about 40 nm dispersed in the liquid carrier;
the colloidal silica abrasive particles having a zeta potential in a range from about 10 mV to about 40 mV in the composition;
a first amino acid compound having an isoelectric point less than about 7;
a second amino acid compound having an isoelectric greater than about 7; and
a pH in a range from about 3.5 to about 5.
14. The composition of claim 13 , wherein the first amino acid compound is selected from the group consisting of glycine, valine, alanine, and mixtures thereof and the second amino acid compound is selected from the group consisting of histidine, arginine, lysine and mixtures thereof.
15. The composition of claim 14 , comprising:
from about 0.05 to about 1 weight percent of the first amino acid compound; and
from about 0.005 to about 0.2 weight percent of the second amino acid compound.
16. The composition of claim 13 , further comprising an iron containing accelerator and a stabilizer bound to the iron containing accelerator, the stabilizer being selected from the group consisting of phosphoric acid, phthalic acid, citric acid, adipic acid, oxalic acid, malonic acid, aspartic acid, succinic acid, glutaric acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, maleic acid, glutaconic acid, muconic acid, ethylenediaminetetraacetic acid, propylenediaminetetraacetic acid, and mixtures thereof.
17. The composition of claim 13 , further comprising a hydrogen peroxide oxidizer.
18. A chemical mechanical polishing composition for polishing a substrate having a tungsten layer, the composition comprising:
a water based liquid carrier;
colloidal silica abrasive particles having an average particle size greater than about 90 nm dispersed in the liquid carrier;
a cationic surfactant that imparts a non-permanent positive charge to the colloidal silica abrasive particles;
the colloidal silica abrasive particles having a zeta potential in a range from about 10 mV to about 40 mV in the composition;
a first amino acid compound having an isoelectric point less than about 7;
a second amino acid compound having an isoelectric greater than about 7; and
a pH in a range from about 3 to about 4.5.
19. The composition of claim 18 , wherein the first amino acid compound is selected from the group consisting of glycine, valine, alanine, and mixtures thereof and the second amino acid compound is selected from the group consisting of histidine, arginine, lysine and mixtures thereof.
20. The composition of claim 19 , comprising:
from about 0.05 to about 1 weight percent of the first amino acid compound; and
from about 0.005 to about 0.2 weight percent of the second amino acid compound.
21. The composition of claim 19 , wherein the cationic surfactant comprises one or a combination of tetrabutylammonium, tetrapentylammonium, tetrabutylphosphonium, tributylmethylphosphonium, tributyloctylphosphonium, and benzyltributylammonium.
22. The composition of claim 19 , further comprising an iron containing accelerator and a stabilizer bound to the iron containing accelerator, the stabilizer being selected from the group consisting of phosphoric acid, phthalic acid, citric acid, adipic acid, oxalic acid, malonic acid, aspartic acid, succinic acid, glutaric acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, maleic acid, glutaconic acid, muconic acid, ethylenediaminetetraacetic acid, propylenediaminetetraacetic acid, and mixtures thereof.
23. The composition of claim 19 , further comprising a hydrogen peroxide oxidizer.
24. A method of chemical mechanical polishing a substrate including a tungsten layer, the method comprising:
(a) contacting the substrate with a polishing composition comprising:
(i) a water based liquid carrier;
(ii) cationic abrasive particles dispersed in the liquid carrier;
(iii) a first amino acid compound having an isoelectric point less than about 7;
(iv) a second amino acid compound having an isoelectric point greater than about 7; and
(v) a pH in a range from about 1 to about 5,
(b) moving the polishing composition relative to the substrate; and
(c) abrading the substrate to remove a portion of the tungsten from the substrate and thereby polish the substrate.
25. The method of claim 24 , wherein the first amino acid compound is selected from the group consisting of glycine, valine, alanine, and mixtures thereof and the second amino acid compound is selected from the group consisting of histidine, arginine, lysine and mixtures thereof.
26. The method of claim 25 , wherein the polishing composition comprises:
from about 0.05 to about 1 weight percent of the first amino acid compound; and
from about 0.005 to about 0.2 weight percent of the second amino acid compound.
27. The method of claim 24 , wherein:
the cationic abrasive particles comprise colloidal silica abrasive particles having a permanent positive charge;
the colloidal silica abrasive particles have a zeta potential in range from about 10 mV to about 40 mV in the composition;
the colloidal silica abrasive particles have an average particle size greater than about 40 nm; and
the composition has a pH in a range from about 3.5 to about 5.
28. The method of claim 24 , wherein:
the cationic abrasive particles comprise colloidal silica abrasive particles;
the composition further comprises a cationic surfactant that imparts a non-permanent positive charge to the colloidal silica abrasive particles;
the colloidal silica abrasive particles have a zeta potential in range from about 10 mV to about 40 mV in the composition;
the colloidal silica abrasive particles have an average particle size greater than about 90 nm; and
the composition has a pH in a range from about 3.0 to about 4.5.
29. The method of claim 24 , wherein the composition further comprises
an iron containing accelerator;
a stabilizer bound to the iron containing accelerator, the stabilizer being selected from the group consisting of phosphoric acid, phthalic acid, citric acid, adipic acid, oxalic acid, malonic acid, aspartic acid, succinic acid, glutaric acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, maleic acid, glutaconic acid, muconic acid, ethylenediaminetetraacetic acid, propylenediaminetetraacetic acid, and mixtures thereof; and
a hydrogen peroxide oxidizer.