Patent Assignment
Reel/Frame 065663/0466
CHANGE OF NAME
Recorded: 2023-11-22
Received: 2023-11-22
Pages: 12
Assignor
CMC MATERIALS, INC.
Executed: 2023-02-27
Assignee
CMC MATERIALS LLC
1209 ORANGE STREET, WILMINGTON, DE, 19801, UNITED STATES
Covered Applications
(100)
SILICA-BASED SLURRY FOR SELECTIVE POLISHING OF CARBON-BASED FILMS
App. No. 17/474,543
→
TITANIUM DIOXIDE CONTAINING RUTHENIUM CHEMICAL MECHANICAL POLISHING SLURRY
App. No. 17/391,674
→
CMP COMPOSITION INCLUDING A NOVEL ABRASIVE
App. No. 17/217,097
→
DERIVATIZED POLYAMINO ACIDS
App. No. 17/123,295
→
SOLID POLYMER ELECTROLYTE COMPOSITIONS AND METHODS OF PREPARING SAME
App. No. 16/895,714
→
Triaxial Accelerometer Mounting Adapter
App. No. 16/867,670
→
SELF-STOPPING POLISHING COMPOSITION AND METHOD FOR BULK OXIDE PLANARIZATION
App. No. 16/797,438
→
POLISHING COMPOSITION AND METHOD UTILIZING ABRASIVE PARTICLES TREATED WITH AN AMINOSILANE
App. No. 16/664,235
→
METHOD TO INCREASE BARRIER FILM REMOVAL RATE IN BULK TUNGSTEN SLURRY
App. No. 16/513,404
→
SELF-STOPPING POLISHING COMPOSITION AND METHOD FOR BULK OXIDE PLANARIZATION
App. No. 16/271,508
→
COMPOSITION FOR TUNGSTEN CMP
App. No. 16/236,962
→
COMPOSITION AND METHOD FOR COPPER BARRIER CMP
App. No. 16/208,797
→
COMPOSITION AND METHOD FOR METAL CMP
App. No. 16/208,742
→
METHODS AND COMPOSITIONS FOR PROCESSING DIELECTRIC SUBSTRATE
App. No. 16/018,281
→
COMPOSITION AND METHOD FOR POLISHING MEMORY HARD DISKS EXHIBITING REDUCED EDGE ROLL OFF
App. No. 16/000,062
→
CHEMICAL-MECHANICAL PROCESSING SLURRY AND METHODS FOR PROCESSING A NICKEL SUBSTRATE SURFACE
App. No. 15/951,598
→
CHEMICAL-MECHANICAL PROCESSING SLURRY AND METHODS
App. No. 15/951,358
→
SELF-STOPPING POLISHING COMPOSITION AND METHOD FOR BULK OXIDE PLANARIZATION
App. No. 15/934,219
→
CMP COMPOSITIONS CONTAINING POLYMER COMPLEXES AND AGENTS FOR STI APPLICATIONS
App. No. 15/920,813
→
COATED COMPRESSIVE SUBPAD FOR CHEMICAL MECHANICAL POLISHING
App. No. 15/875,773
→
TUNGSTEN BUFF POLISHING COMPOSITIONS WITH IMPROVED TOPOGRAPHY
App. No. 15/864,720
→
COMPOSITION AND METHOD FOR REMOVING RESIDUE FROM CHEMICAL-MECHANICAL PLANARIZATION SUBSTRATE
App. No. 15/825,305
→
CMP COMPOSITIONS SELECTIVE FOR OXIDE AND NITRIDE WITH IMPROVED DISHING AND PATTERN SELECTIVITY
App. No. 15/784,949
→
SURFACE TREATED ABRASIVE PARTICLES FOR TUNGSTEN BUFF APPLICATIONS
App. No. 15/723,886
→
SYSTEMS FOR MIXING A LIQUID AND RELATED METHODS
App. No. 15/684,470
→
POLISHING COMPOSITION COMPRISING AN AMINE-CONTAINING SURFACTANT
App. No. 15/629,487
→
CHEMICAL-MECHANICAL PROCESSING SLURRY AND METHODS FOR PROCESSING A NICKEL SUBSTRATE SURFACE
App. No. 15/615,591
→
COBALT POLISHING ACCELERATORS
App. No. 15/603,634
→
POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS
App. No. 15/479,779
→
METHOD OF POLISHING GROUP III-V MATERIALS
App. No. 15/433,068
→
POLISHING COMPOSITION COMPRISING CATIONIC POLYMER ADDITIVE
App. No. 15/414,786
→
CLEANING COMPOSITION FOLLOWING CMP AND METHODS RELATED THERETO
App. No. 15/327,326
→
COMPOSITION AND METHOD FOR POLISHING SILICON CARBIDE
App. No. 15/398,933
→
CMP PROCESSING COMPOSITION COMPRISING ALKYLAMINE AND CYCLODEXTRIN
App. No. 15/394,090
→
POLISHING COMPOSITION AND METHOD UTILIZING ABRASIVE PARTICLES TREATED WITH AN AMINOSILANE
App. No. 15/346,835
→
POLISHING COMPOSITION CONTAINING CERIA ABRASIVE
App. No. 15/338,724
→
POLYURETHANE CMP PADS HAVING A HIGH MODULUS RATIO
App. No. 15/273,855
→
METHODS AND COMPOSITIONS FOR PROCESSING DIELECTRIC SUBSTRATE
App. No. 15/207,973
→
CMP COMPOSITION AND METHOD FOR POLISHING RIGID DISKS
App. No. 15/091,275
→
POLISHING COMPOSITION CONTAINING CERIA PARTICLES AND METHOD OF USE
App. No. 15/056,198
→
CUSTOMIZED POLISHING PADS FOR CMP AND METHODS OF FABRICATION AND USE THEREOF
App. No. 15/042,777
→
CLEANING COMPOSITION AND METHOD FOR CLEANING SEMICONDUCTOR WAFERS AFTER CMP
App. No. 14/993,837
→
TUNGSTEN PROCESSING SLURRY WITH CATALYST
App. No. 14/988,891
→
COMPOSITION FOR TUNGSTEN CMP
App. No. 14/965,168
→
POLISHING PAD WITH FOUNDATION LAYER AND WINDOW ATTACHED THERETO
App. No. 14/931,737
→
TUNGSTEN-PROCESSING SLURRY WITH CATIONIC SURFACTANT AND CYCLODEXTRIN
App. No. 14/924,997
→
TUNGSTEN-PROCESSING SLURRY WITH CATIONIC SURFACTANT
App. No. 14/925,054
→
COBALT DISHING CONTROL AGENTS
App. No. 14/919,490
→
CORROSION INHIBITORS AND RELATED COMPOSITIONS AND METHODS
App. No. 14/919,404
→
COBALT POLISHING ACCELERATORS
App. No. 14/919,449
→
COBALT INHIBITOR COMBINATION FOR IMPROVED DISHING
App. No. 14/918,756
→
SLURRY FOR CHEMICAL MECHANICAL POLISHING OF COBALT
App. No. 14/919,526
→
NICKEL PHOSPHOROUS CMP COMPOSITIONS AND METHODS
App. No. 14/881,837
→
GROOVED CMP PADS
App. No. 14/874,179
→
SELECTIVE NITRIDE SLURRIES WITH IMPROVED STABILITY AND IMPROVED POLISHING CHARACTERISTICS
App. No. 14/849,066
→
TUNGSTEN CHEMICAL-MECHANICAL POLISHING COMPOSITION
App. No. 14/750,204
→
COLLOIDAL SILICA CHEMICAL-MECHANICAL POLISHING CONCENTRATE
App. No. 14/750,107
→
COPPER BARRIER CHEMICAL-MECHANICAL POLISHING COMPOSITION
App. No. 14/750,271
→
COLLOIDAL SILICA CHEMICAL-MECHANICAL POLISHING COMPOSITION
App. No. 14/749,923
→
METHODS FOR FABRICATING A CHEMICAL-MECHANICAL POLISHING COMPOSITION
App. No. 14/750,050
→
COLLOIDAL SILICA CHEMICAL-MECHANICAL POLISHING COMPOSITION
App. No. 14/749,948
→
POLISHING PAD WITH FOUNDATION LAYER AND POLISHING SURFACE LAYER
App. No. 14/732,497
→
POLISHING PAD WITH GROOVED FOUNDATION LAYER AND POLISHING SURFACE LAYER
App. No. 14/727,586
→
POLISHING PAD WITH OFFSET CONCENTRIC GROOVING PATTERN AND METHOD FOR POLISHING A SUBSTRATE THEREWITH
App. No. 14/440,209
→
MULTI-LAYER POLISHING PAD FOR CMP
App. No. 14/700,580
→
POLISHING COMPOSITION AND METHOD UTILIZING ABRASIVE PARTICLES TREATED WITH AN AMINOSILANE
App. No. 14/657,594
→
POLISHING COMPOSITION CONTAINING CATIONIC POLYMER ADDITIVE
App. No. 14/639,598
→
POLISHING COMPOSITION CONTAINING CERIA ABRASIVE
App. No. 14/639,564
→
COMPOSITION AND METHOD FOR POLISHING MEMORY HARD DISKS EXHIBITING REDUCED EDGE ROLL-OFF
App. No. 14/627,081
→
CMP METHOD FOR SUPPRESSION OF TITANIUM NITRIDE AND TITANIUM/TITANIUM NITRIDE REMOVAL
App. No. 14/616,250
→
CMP COMPOSITION FOR SILICON NITRIDE REMOVAL
App. No. 14/612,736
→
LOW DENSITY POLISHING PAD
App. No. 14/611,064
→
POLISHING PAD WITH ALIGNMENT FEATURE
App. No. 14/610,991
→
CMP COMPOSITIONS EXHIBITING REDUCED DISHING IN STI WAFER POLISHING
App. No. 14/568,311
→
METHOD OF FABRICATING A POLISHING
App. No. 14/550,129
→
POLISHING PAD WITH HOMOGENEOUS BODY HAVING DISCRETE PROTRUSIONS THEREON
App. No. 14/530,534
→
POLISHING COMPOSITION AND METHOD FOR NICKEL-PHOSPHOROUS COATED MEMORY DISKS
App. No. 14/515,723
→
CMP POLISHING PAD HAVING EDGE EXCLUSION REGION OF OFFSET CONCENTRIC GROOVE PATTERN
App. No. 14/515,560
→
COMPOSITION AND METHOD FOR POLISHING BULK SILICON
App. No. 14/509,081
→
CUSTOMIZED POLISHING PADS FOR CMP AND METHODS OF FABRICATION AND USE THEREOF
App. No. 14/489,177
→
POLISHING PAD WITH POROUS INTERFACE AND SOLID CORE, AND RELATED APPARATUS AND METHODS
App. No. 14/459,452
→
POLISHING PAD HAVING POROGENS WITH LIQUID FILLER
App. No. 14/307,846
→
CMP COMPOSITIONS SELECTIVE FOR OXIDE OVER POLYSILICON AND NITRIDE WITH HIGH REMOVAL RATE AND LOW DEFECTIVITY
App. No. 14/289,728
→
POLISHING COMPOSITION FOR EDGE ROLL-OFF IMPROVEMENT
App. No. 14/269,622
→
MIXED ABRASIVE TUNGSTEN CMP COMPOSITION
App. No. 14/222,716
→
MIXED ABRASIVE TUNGSTEN CMP COMPOSITION
App. No. 14/222,736
→
COMPOSITION FOR TUNGSTEN BUFFING
App. No. 14/222,086
→
COMPOSITION FOR TUNGSTEN CMP
App. No. 14/203,647
→
COMPOSITION FOR TUNGSTEN CMP
App. No. 14/203,693
→
COMPOSITION FOR TUNGSTEN CMP
App. No. 14/203,621
→
POLISHING PAD WITH MULTI-MODAL DISTRIBUTION OF PORE DIAMETERS
App. No. 14/183,894
→
COMPOSITION AND METHOD FOR POLISHING MEMORY HARD DISKS
App. No. 14/156,201
→
HOMOGENEOUS POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION
App. No. 14/152,792
→
CMP COMPOSITIONS AND METHODS FOR SELECTIVE REMOVAL OF SILICON NITRIDE
App. No. 14/100,339
→
Polishing Pad for Eddy Current End-Point Detection
App. No. 14/099,655
→
CMP COMPOSITIONS AND METHODS FOR POLISHING NICKEL PHOSPHOROUS SURFACES
App. No. 14/094,921
→
WET-PROCESS CERIA COMPOSITIONS FOR POLISHING SUBSTRATES, AND METHODS RELATED THERETO
App. No. 14/050,977
→
MIXED ABRASIVE POLISHING COMPOSITIONS
App. No. 14/051,121
→
WET-PROCESS CERIA COMPOSITIONS FOR POLISHING SUBSTRATES, AND METHODS RELATED THERETO
App. No. 14/050,722
→
CHEMICAL-MECHANICAL PLANARIZATION OF POLYMER FILMS
App. No. 14/035,037
→