IP Library › Granted Patent US 12,221,557
Granted Patent B2
US 12,221,557 · App. 17/679,415 · Granted Feb 11, 2025

Polishing composition and polishing method

Inventors: Daiki Ito (Kiyosu, JP); Toshio Shinoda (Kiyosu, JP)
Assignee: FUJIMI INCORPORATED
C09G1/02C09G1/18H01L21/30625
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Quick Facts
Patent No.
US 12,221,557
App. No.
17/679,415
Granted
Feb 11, 2025
Kind
B2
Abstract

There is provided a polishing composition capable of improving the polishing removal rate of silicon nitride to polish silicon oxide and silicon nitride at the same polishing removal rate and polishing silicon nitride with a small number of defects. A polishing composition contains: abrasives having a positive zeta potential; and a cyclic compound having a mother nucleus with a ring structure and two or more anionic functional groups bonded to the mother nucleus, in which the abrasives contain silica. This polishing composition is used for polishing objects to be polished containing silicon oxide and silicon nitride.

Claims (24)

1. A polishing composition comprising:

abrasives having a positive zeta potential; and

a cyclic compound having a mother nucleus with a ring structure and three or more anionic functional groups bonded to the mother nucleus, wherein

the abrasives contain silica.

2. The polishing composition according to claim 1 , wherein at least one of the anionic functional groups is at least one of a carboxy group and a sulfo group.

3. The polishing composition according to claim 1 , wherein a pH is less than 7.

4. The polishing composition according to claim 1 , wherein the abrasives contain colloidal silica.

5. The polishing composition according to claim 2 , wherein a pH is less than 7.

6. The polishing composition according to claim 2 , wherein the abrasives contain colloidal silica.

7. The polishing composition according to claim 3 , wherein the abrasives contain colloidal silica.

8. A polishing method comprising:

polishing an object to be polished containing silicon nitride using the polishing composition according to claim 1 .

9. A polishing method comprising:

polishing an object to be polished containing silicon oxide and silicon nitride using the polishing composition according to claim 1 .

10. A polishing method comprising:

polishing an object to be polished containing silicon nitride using the polishing composition according to claim 2 .

11. A polishing method comprising:

polishing an object to be polished containing silicon oxide and silicon nitride using the polishing composition according to claim 2 .

12. A polishing method comprising:

polishing an object to be polished containing silicon nitride using the polishing composition according to claim 3 .

13. A polishing method comprising:

polishing an object to be polished containing silicon oxide and silicon nitride using the polishing composition according to claim 3 .

14. A polishing method comprising:

polishing an object to be polished containing silicon nitride using the polishing composition according to claim 4 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2022
From: ITO, DAIKI; SHINODA, TOSHIO
To: FUJIMI INCORPORATED
Reel/Frame 059089/0466 →
Priority Claims (1)
JP 2021-30021 · Feb 26, 2021 · national
Continuity (1)
Related Publication 20220275246A1 · Sep 1, 2022
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