Patent Assignment
Reel/Frame 047875/0997
Assignment of Assignor's Interest
Recorded: 2018-12-31
Pages: 3
Assignors
ZHANG, NA
Executed: 2018-12-21
DOCKERY, KEVIN P.
Executed: 2018-12-21
LIU, ZHAO
Executed: 2018-12-21
IVANOV, ROMAN A.
Executed: 2018-12-28
Assignee
CABOT MICROELECTRONICS CORPORATION
870 NORTH COMMONS DRIVE, AURORA, ILLINOIS, 60504
Covered Property
(1)
Composition for Tungsten Cmp
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jan 13, 2021
From: CABOT MICROELECTRONICS CORPORATION
To: CMC MATERIALS, INC.
Reel/Frame 054980/0681 →
Security Agreement
Jul 2, 2021
From: CMC MATERIALS, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 056752/0645 →
Release of Security Interest
Jul 6, 2022
From: JPMORGAN CHASE BANK, N.A.
To: CABOT MICROELECTRONICS CORPORATION; QED TECHNOLOGIES INTERNATIONAL, INC.; FLOWCHEM LLC; KMG ELECTRONIC CHEMICALS, INC.
Reel/Frame 060592/0260 →
Security Interest
Jul 8, 2022
From: ENTEGRIS, INC.; ENTEGRIS GP, INC.; POCO GRAPHITE, INC.; CMC MATERIALS, INC.
To: TRUIST BANK, AS NOTES COLLATERAL AGENT
Reel/Frame 060613/0072 →
Security Interest
Jul 8, 2022
From: CMC MATERIALS, INC.; INTERNATIONAL TEST SOLUTIONS, LLC; QED TECHNOLOGIES INTERNATIONAL, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 060615/0001 →
Change of Name
Nov 8, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065517/0783 →
Change of Name
Nov 22, 2023
From: CMC MATERIALS, INC.
To: CMC MATERIALS LLC
Reel/Frame 065663/0466 →