Granted Patent B2

US 12,306,139 · App. 17/897,451 · Granted May 20, 2025

Inventors: Hidefumi Takamine (Tokyo, JP); Junko Hirokawa (Tokyo, JP); Kazuo Watabe (Yokohama Kanagawa, JP); Tetsuya Kugimiya (Kawasaki Kanagawa, JP); Keisuke Ueno (Kawasaki Kanagawa, JP); Takashi Usui (Saitama, JP); Yongfang Li (Kawasaki Kanagawa, JP); Yuki Ueda (Yokohama Kanagawa, JP)

Assignee: Kabushiki Kaisha Toshiba

G01N29/223G01N29/04G01N29/28

Abstract

Claims (36)

1. A sensor module, comprising:

a sensor;

a sensor holder that holds the sensor and includes a pressing force application portion to apply a pressing force to press the sensor toward a measurement target object side;

an adhesion portion that adheres the sensor holder to the measurement target object by an adhesion force; and

a change mechanism that changes a relative magnitude relationship between the pressing force and the adhesion force.

2. The sensor module according to claim 1 ,

wherein the adhesion portion is an electrically peelable adhesive,

the electrically peelable adhesive includes a sheet portion and an electrode, and

the change mechanism is a voltage application portion that applies a voltage to the electrode to cause a current to flow through the sheet portion so as to lower the adhesion force.

3. A sensor module installation device, comprising:

the sensor module according to claim 1 ; and

a sensor module holding portion that holds the sensor module.

4. The sensor module installation device according to claim 3 , wherein the sensor module holding portion further includes a rod-shaped member that applies the pressing force to press the sensor toward the measurement target object side.

5. The sensor module installation device according to claim 3 , wherein the change mechanism further includes a blade that rotates to be inserted into the adhesion portion to decrease the adhesion force.

6. The sensor module installation device according to claim 3 , further comprises an operation portion that operates the change mechanism.

7. The sensor module installation device according to claim 3 , wherein the sensor module holding portion further includes a rod-shaped member that increases the pressing force.

8. A sensor module installation device, comprising:

a sensor module, comprising:

a sensor;

a sensor holder that holds the sensor and includes a pressing force application portion to apply a pressing force to press the sensor toward a measurement target object side; and

an adhesion portion that adheres the sensor holder to the measurement target object by an adhesion force; and

a sensor module holding portion that holds the sensor module and includes a change mechanism that changes a relative magnitude relationship between the pressing force and the adhesion force.

9. The sensor module installation device according to claim 8 ,

wherein the adhesion portion is an electrically peelable adhesive,

the electrically peelable adhesive includes a sheet portion and an electrode, and

the change mechanism is a voltage application portion that applies a voltage to the electrode to cause a current to flow through the sheet portion so as to lower the adhesion force.

10. The sensor module installation device according to claim 8 ,

wherein the pressing force application portion is a plunger, and

the change mechanism is a plunger holding portion that is connected to the plunger to apply a predetermined torque so as to increase the pressing force.

11. The sensor module installation device according to claim 8 ,

wherein the pressing force application portion includes an elastic body within a gas filled therein, and

the change mechanism is a heater that heats the gas to increase the pressing force.

12. A mounting method of a sensor module for mounting a sensor holder holding a sensor to a measurement target object, comprising:

a step of applying a pressing force to press the sensor to the measurement target object;

a step of adhering the sensor holder to the measurement target object by an adhesion force; and

a step of changing a relative magnitude relationship between the pressing force and the adhesion force.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (13)