Electronic device with shape memory resin
According to one embodiment, an electronic device, wherein a insulating base and a wiring line are located between a first resin layer and a second resin layer, the insulating base includes a plurality of line portions in which the wiring line is located, and a plurality of island-shaped portions connected to the plurality of line portions, the second resin layer includes a first portion overlapping the plurality of line portions and the plurality of island-shaped portions, and a second portion located between the plurality of line portions, the second portion is in contact with the first resin layer, and at least one of the first resin layer, the first portion and the second portion is a shape memory resin layer.
1. An electronic device comprising:
a plurality of scanning lines extending along a first direction;
a plurality of signal lines extending along a second direction intersecting the first direction;
a plurality of electrical elements each being located at an intersection of each of the scanning lines and each of the signal lines, and being electrically connected to each of the scanning lines and each of the signal lines;
a first shape memory resin layer;
a flexible insulating base disposed on the first shape memory resin layer;
a wiring line disposed on the insulating base; and
a second shape memory resin layer covering the insulating base and the wiring line,
wherein
the plurality of the scanning lines and the plurality of the signal lines have wavy shape,
the insulating base and the wiring line are located between the first shape memory resin layer and the second shape memory resin layer,
the insulating base includes a plurality of line portions in which the wiring line is located, and a plurality of island-shaped portions connected to the plurality of line portions,
the second shape memory resin layer includes a first portion overlapping the plurality of line portions and the plurality of island-shaped portions, and a second portion located between the plurality of line portions,
the second portion is in contact with the first shape memory resin layer, and
the first portion and the second portion are formed of a same material to be integrated into one body, and
the plurality of the scanning lines and the plurality of the signal lines include the wiring line.
2. The electronic device according to claim 1 , wherein
a thickness of the first portion is less than a thickness of the second portion.
3. An electronic device comprising:
a plurality of scanning lines extending along a first direction;
a plurality of signal lines extending along a second direction intersecting the first direction;
a plurality of electrical elements each being located at an intersection of each of the scanning lines and each of the signal lines, and being electrically connected to each of the scanning lines and each of the signal lines;
a first shape memory resin layer;
a second shape memory resin layer;
an insulating base located between the first shape memory resin layer and the second shape memory resin layer;
a flexible resin section overlapping the first shape memory resin layer; and
a wiring line located between the insulating base and the flexible resin section,
wherein
the plurality of the scanning lines and the plurality of the signal lines have wavy shape,
the insulating base includes a plurality of line portions in which the wiring line is located, and a plurality of island-shaped portions connected to the plurality of line portions,
the flexible resin section overlaps the plurality of line portions and the plurality of island-shaped portions,
the second shape memory resin layer is located between the plurality of line portions,
the flexible resin section is formed of a material different from that of the second shape memory resin layer,
the second shape memory resin layer is in contact with the first shape memory resin layer, and
the plurality of the scanning lines and the plurality of the signal lines include the wiring line.
4. The electronic device according to claim 3 , wherein
the flexible resin section is formed in a same layer as that of the second shape memory resin layer.