IP Library › Granted Patent US 12,187,094
Granted Patent B2
US 12,187,094 · App. 17/898,660 · Granted Jan 7, 2025

Thermal management system

Inventors: Tomohiro Hayase (Kariya, JP); Nobuharu Kakehashi (Kariya, JP)
Assignee: DENSO CORPORATION
B60H1/00271B60H1/00885B60H2001/00307B60L58/24
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Quick Facts
Patent No.
US 12,187,094
App. No.
17/898,660
Granted
Jan 7, 2025
Kind
B2
Abstract

A thermal management system includes a high-temperature side heating medium circuit, a low-temperature side heating medium circuit, a device heating medium circuit, a circuit connection portion and a circuit switch unit. The circuit switch unit switches between an operation mode in which a heating medium that passed through the low-temperature side heating medium circuit is circulated through any one of the high-temperature side heating medium circuit and the device heating medium circuit via the circuit connection portion and an operation mode in which the high-temperature side heating medium circuit, the low-temperature side heating medium circuit, and the device heating medium circuit are connected via the circuit connection portion, and the heating medium is circulated through a heat generation device, a device heat exchange unit, a heating unit, and a heater core.

Claims (38)

1. A thermal management system comprising:

a high-temperature side heating medium circuit in which a heating unit heats a heating medium, a heater core that radiates heat of the heating medium to air blown to a space to be air-conditioned, and a first heating medium pump that pumps the heating medium are connected so that the heating medium is allowed to circulate therethrough;

a low-temperature side heating medium circuit in which a radiator that radiates heat of the heating medium to outside air, a heat generation device generates heat in accordance with an operation and whose temperature is adjusted by heat of the heating medium, and a second heating medium pump that pumps the heating medium are connected so that the heating medium is allowed to circulate therethrough;

a device heating medium circuit in which a device heat exchange unit exchanges heat between a target device to be subjected to temperature adjustment and the heating medium, the device heat exchange unit being connected so that the heating medium is allowed to flow in and out, and a third heating medium pump that pumps the heating medium are connected so that the heating medium is allowed to circulate therethrough;

a circuit connection portion that connects the high-temperature side heating medium circuit, the low-temperature side heating medium circuit, and the device heating medium circuit so that the heating medium is allowed to flow in and out; and

a circuit switch unit switches a flow of the heating medium in the high-temperature side heating medium circuit, the low-temperature side heating medium circuit, the device heating medium circuit, and the circuit connection portion, wherein

the circuit switch unit switches between

an operation mode in which the heating medium that passed through the low-temperature side heating medium circuit is circulated through any one of the high-temperature side heating medium circuit and the device heating medium circuit via the circuit connection portion and

an operation mode in which the high-temperature side heating medium circuit, the low-temperature side heating medium circuit, and the device heating medium circuit are connected via the circuit connection portion, and the heating medium is circulated through the heat generation device, the device heat exchange unit, the heating unit, and the heater core, and

a circulation path of the heating medium in the operation mode in which the high-temperature side heating medium circuit, the low-temperature side heating medium circuit, and the device heating medium circuit are connected via the circuit connection portion, and the heating medium is circulated through the heat generation device, the device heat exchange unit, the heating unit, and the heater core is configured so that any one of the first heating medium pump, the second heating medium pump, and the third heating medium pump is disengaged.

2. The thermal management system according to claim 1 , wherein the circuit switch unit switches to an operation mode in which the heating medium is independently circulated through the high-temperature side heating medium circuit, the low-temperature side heating medium circuit, and the device heating medium circuit.

3. The thermal management system according to claim 1 , wherein in an operation mode in which the heating medium that passed through the low-temperature side heating medium circuit is circulated through the high-temperature side heating medium circuit via the circuit connection portion, the circuit switch unit switches so that the heating medium is circulated through the heat generation device, the heating unit, and the heater core.

4. The thermal management system according to claim 1 , wherein in the operation mode in which the heating medium that passed through the low-temperature side heating medium circuit is circulated through the device heating medium circuit via the circuit connection portion, the circuit switch unit switches so that the heating medium is circulated through the heat generation device and the device heat exchange unit.

5. The thermal management system according to claim 1 , wherein when the heating medium that passed through the high-temperature side heating medium circuit circulates through the device heating medium circuit via the circuit connection portion, the circuit switch unit switches to an operation mode in which the heating medium is circulated through the heating unit, the heater core, and the device heat exchange unit.

6. The thermal management system according to claim 1 , wherein

the circuit switch unit includes

a first heating medium three-way valve that switches between a state where the heating medium is circulated in the high-temperature side heating medium circuit and a state where the heating medium is allowed to flow in and out between the high-temperature side heating medium circuit and the low-temperature side heating medium circuit,

a second heating medium three-way valve that switches between a state where the heating medium is circulated in the high-temperature side heating medium circuit and a state where the heating medium is allowed to flow in and out between the high-temperature side heating medium circuit and the device heating medium circuit,

a first heating medium on-off valve that switches a flow of the heating medium in the low-temperature side heating medium circuit, and

a second heating medium on-off valve that switches a flow of the heating medium in the device heating medium circuit.

7. The thermal management system according to claim 1 , wherein

the heating unit includes at least one of a heat exchanger or an electric heater.

8. The thermal management system according to claim 1 , wherein

the heat generation device is one of a motor generator, a power control unit and a control device for an advanced drive assistance system.

9. The thermal management system according to claim 1 , wherein

the device heat exchange unit includes a heating medium passage.

10. The thermal management system according to claim 6 , further comprising:

a processor and a memory configured to control the first heating medium three-way valve, the second heating medium three-way valve, the first heating medium on-off valve, and the second heating medium on-off valve so as to change the operation modes.

11. A thermal management system comprising:

a high-temperature side heating medium circuit in which a first heater heats a heating medium, a heater core that radiates heat of the heating medium to air blown to a space to be air-conditioned, and a first heating medium pump that pumps the heating medium are connected so that the heating medium is allowed to circulate therethrough;

a low-temperature side heating medium circuit in which a radiator that radiates heat of the heating medium to outside air, a second heater generates heat in accordance with an operation and whose temperature is adjusted by heat of the heating medium, and a second heating medium pump that pumps the heating medium are connected so that the heating medium is allowed to circulate therethrough;

a device heating medium circuit in which a device heat exchanger exchanges heat between a target device to be subjected to temperature adjustment and the heating medium, the device heat exchanger being connected so that the heating medium is allowed to flow in and out, and a third heating medium pump that pumps the heating medium are connected so that the heating medium is allowed to circulate therethrough;

a circuit connection portion that connects the high-temperature side heating medium circuit, the low-temperature side heating medium circuit, and the device heating medium circuit so that the heating medium is allowed to flow in and out; and

a circuit switch switches a flow of the heating medium in the high-temperature side heating medium circuit, the low-temperature side heating medium circuit, the device heating medium circuit, and the circuit connection portion, wherein

the circuit switch switches between

an operation mode in which the heating medium that passed through the low-temperature side heating medium circuit is circulated through any one of the high-temperature side heating medium circuit and the device heating medium circuit via the circuit connection portion and

an operation mode in which the high-temperature side heating medium circuit, the low-temperature side heating medium circuit, and the device heating medium circuit are connected via the circuit connection portion, and the heating medium is circulated through the second heater, the device heat exchanger, the first heater, and the heater core, and

a circulation path of the heating medium in the operation mode in which the high-temperature side heating medium circuit, the low-temperature side heating medium circuit, and the device heating medium circuit are connected via the circuit connection portion, and the heating medium is circulated through the second heater, the device heat exchanger, the first heater, and the heater core is configured so that any one of the first heating medium pump, the second heating medium pump, and the third heating medium pump is disengaged.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 2, 2022
From: HAYASE, TOMOHIRO; KAKEHASHI, NOBUHARU
To: DENSO CORPORATION
Reel/Frame 060974/0017 →
Priority Claims (1)
JP 2020-035754 · Mar 3, 2020 · national
Continuity (2)
Continuation PCTJP2021000643 · Jan 12, 2021
Related Publication 20220410652A1 · Dec 29, 2022
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