Systems and methods for electrochemical additive manufacturing of parts using multi-purpose build plate
An electrochemical additive manufacturing method includes positioning a build plate into an electrolyte solution. The conductive layer comprises at least one conductive-layer segment forming a pattern corresponding with a component. The method further comprises connecting the at least one conductive-layer segment and one or more deposition anodes to a power source. The one or more deposition anodes correspond with at least a portion of the pattern formed by the at least one conductive-layer segment. The method additionally comprises transmitting electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes corresponding with the at least the portion of the pattern formed by the at least one conductive-layer segment, through the electrolyte solution, and to the at least one conductive-layer segment, such that material is deposited onto the at least one conductive-layer segment and forms at least a portion of the component.
1. An electrochemical additive manufacturing method, comprising steps of:
positioning a build plate into an electrolyte solution such that a conductive surface of a cathode portion of the build plate directly contacts the electrolyte solution;
positioning a deposition anode array, comprising a plurality of deposition anodes, into the electrolyte solution such that a gap is established between the conductive surface of the cathode portion and the deposition anode array;
connecting the cathode portion to a power source;
connecting one or more deposition anodes of the plurality of deposition anodes to the power source;
transmitting electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes, through the electrolyte solution, and to the conductive surface of the cathode portion, such that material is deposited onto the conductive surface of the cathode portion forms at least a portion of a component, wherein:
the component comprises an electronic sensor component;
the cathode portion and the material deposited onto the conductive surface of the cathode portion form the electronic sensor component;
the build plate comprises a thermal feature configured to transfer heat;
the material deposited onto the conductive surface is thermally coupled with the thermal feature to promote heat transfer by or to the thermal feature; and
the material deposited onto the conductive surface forms a heat wicking feature;
positioning a second build plate into the electrolyte solution such that a conductive surface of a cathode portion of the second build plate directly contacts the electrolyte solution;
positioning the deposition anode array into the electrolyte solution such that a gap is established between the conductive surface of the cathode portion of the second build plate and the deposition anode array;
connecting the cathode portion of the second build plate to the power source;
transmitting electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes, through the electrolyte solution, and to the conductive surface of the cathode portion of the second build plate, such that material is deposited onto the conductive surface of the cathode portion of the second build plate forms at least a portion of a second component, wherein:
the second build plate comprises a second thermal feature configured to transfer heat;
the material deposited onto the conductive surface of the cathode portion of the second build plate is thermally coupled with the second thermal feature to promote heat transfer by or to the second thermal feature; and
the material deposited onto the conductive surface of the cathode portion of the second build plate forms a second heat wicking feature; and
sealing together opposing free ends of the first build plate to opposing free ends of the second build plate to define a sealed fluid channel between the first build plate and the second build plate, wherein the heat wicking feature and the second heat wicking feature are located within the sealed fluid channel.
2. The electrochemical additive manufacturing method according to claim 1 , wherein:
the heat wicking feature comprises at least one recess;
the second heat wicking feature comprises at least one protrusion; and
the electrochemical additive manufacturing method further comprises nestably inserting the at least one recess into the at least one protrusion.
3. The electrochemical additive manufacturing method according to claim 1 , wherein the thermal feature comprises at least one fin attached to a surface of the cathode portion of the build plate that is opposite the conductive surface of the cathode portion.
4. The electrochemical additive manufacturing method according to claim 1 , wherein the electronic sensor component comprises a thermocouple.
5. The electrochemical additive manufacturing method according to claim 1 , wherein the electronic sensor component comprises a strain gauge.
6. An electrochemical additive manufacturing method, comprising steps of:
positioning a build plate into an electrolyte solution such that a conductive surface of a cathode portion of the build plate directly contacts the electrolyte solution;
positioning a deposition anode array, comprising a plurality of deposition anodes, into the electrolyte solution such that a gap is established between the conductive surface of the cathode portion and the deposition anode array;
connecting the cathode portion to a power source;
connecting one or more deposition anodes of the plurality of deposition anodes to the Power source;
transmitting electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes, through the electrolyte solution, and to the conductive surface of the cathode portion, such that material is deposited onto the conductive surface of the cathode portion forms at least a portion of a component, wherein:
the component comprises an electronic sensor component;
the cathode portion and the material deposited onto the conductive surface of the cathode portion form the electronic sensor component;
the build plate comprises a thermal feature configured to transfer heat;
the material deposited onto the conductive surface is thermally coupled with the thermal feature to promote heat transfer by or to the thermal feature;
the material deposited onto the conductive surface forms a heat wicking feature; and
the material deposited onto the conductive surface also forms a second heat wicking feature, which is spaced apart from the wicking feature;
folding the build plate back over itself so that the heat wicking feature and the second heat wicking feature face each other; and
sealing together a first free end of the build plate to an opposing second free end of the build plate to define a sealed fluid channel between the first build plate and the second build plate, wherein the heat wicking feature and the second heat wicking feature are located within the sealed fluid channel.
7. The electrochemical additive manufacturing method according to claim 6 , wherein:
the heat wicking feature comprises at least one recess;
the second heat wicking feature comprises at least one protrusion; and
the electrochemical additive manufacturing method further comprises nestably inserting the at least one recess into the at least one protrusion as the build plate is folded back over itself.
8. The electrochemical additive manufacturing method according to claim 6 , wherein the thermal feature comprises at least one fin attached to a surface of the cathode portion of the build plate that is opposite the conductive surface of the cathode portion.
9. The electrochemical additive manufacturing method according to claim 6 , wherein the electronic sensor component comprises a thermocouple.
10. The electrochemical additive manufacturing method according to claim 6 , wherein the electronic sensor component comprises a strain gauge.