Temperature-sensor assembly and method for producing a temperature sensor assembly
A temperature-sensor assembly comprising at least one temperature sensor and at least one supply line, wherein the temperature sensor has at least one electrically insulating substrate with an upper side and an underside, wherein a temperature-sensor structure with at least one sensor-contact surface is formed at least on parts of the upper side, wherein the supply line has at least one supply-line contact surface, wherein the supply-line contact surface is connected to the sensor-contact surface at least in part by means of a first sinter layer.
1 . A temperature-sensor assembly, comprising at least one temperature sensor and at least one supply line, wherein the at least one temperature sensor comprises at least one electrically insulating substrate with an upper side and an underside, wherein a temperature-sensor structure with at least one sensor-contact surface is formed at least on parts of the upper side, wherein the at least one supply line comprises at least one supply-line contact surface, wherein the at least one supply-line contact surface is connected to the at least one sensor-contact surface at least in part by means of a first sinter layer, wherein the first sinter layer is formed from a first pre-applied sinter-paste layer, which is applied to the supply-line contact surface or the sensor-contact surface.
2 . The temperature-sensor assembly according to claim 1 , wherein the supply line is flexible.
3 . The temperature-sensor assembly according to claim 1 , wherein the supply line is formed from a metal strip or a metal wire with at least one flattened end or a metal-coated polymer substrate or a metal sheet.
4 . The temperature-sensor assembly according to claim 1 , wherein the temperature-sensor structure is formed as a resistance element.
5 . The temperature-sensor assembly according to claim 1 , wherein the temperature-sensor structure and/or the sensor-contact surface comprises platinum material.
6 . The temperature-sensor assembly according to claim 1 , wherein at least one passivation layer which is formed at least on parts of the temperature-sensor structure or, on the upper side of the substrate.
7 . The temperature-sensor assembly according to claim 6 , wherein the passivation layer comprises a polyimide material and/or a glass material and/or a ceramic material and/or a glass-ceramic material.
8 . The temperature-sensor assembly according to claim 1 , wherein the substrate comprises a ceramic insulating material.
9 . The temperature-sensor assembly according to claim 1 , wherein a metallization layer is formed on the underside of the substrate.
10 . The temperature-sensor assembly according to claim 9 , wherein a second sinter layer and/or a second sinter-paste layer is formed on the underside of the substrate or on the metallization layer.
11 . The temperature-sensor assembly according to claim 10 , wherein the second sinter layer is formed from a second pre-applied sinter-paste layer.
12 . The temperature-sensor assembly according to claim 1 , wherein the first sinter layer or the second sinter layer or the first pre-applied sinter-paste layer or the second pre-applied sinter-paste layer comprise(s) metal particles.
13 . A method for producing a temperature-sensor assembly according to claim 1 , comprising at least one temperature sensor and at least one supply line, the method comprising the steps of:
providing a temperature sensor comprising at least one electrically insulating substrate with an upper side and an underside, wherein a temperature-sensor structure with at least one sensor-contact surface is formed at least on parts of the upper side;
providing a supply line comprising at least one supply-line contact surface;
applying a sinter paste to the sensor-contact surface and/or the supply-line contact surface;
forming at least a first pre-applied sinter-paste layer; and,
connecting the supply line to the temperature sensor by forming a sinter layer through a sintering process.
14 . The method according to claim 13 , wherein:
applying a sinter paste at least to parts of the underside of the substrate or of a metallization layer of the substrate;
forming a second pre-applied sinter-paste layer; and,
connecting the temperature sensor by means of pressure sintering with the second pre-applied sinter-paste layer to a further component.