IP Library › Granted Patent US 12,052,482
Granted Patent B2
US 12,052,482 · App. 17/906,325 · Granted Jul 30, 2024

Camera module

Inventor: Toshihiro Tokito (Kanagawa, JP)
Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
H04N23/51G03B17/12
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,052,482
App. No.
17/906,325
Granted
Jul 30, 2024
Kind
B2
Abstract

A camera module according to an embodiment of the present technology includes a housing that includes a first case that includes an opening at one of ends of the first case, and a second case that is joined to another of the ends of the first case; a barrel member that is arranged in the housing and includes a barrel that is fitted into the opening in an optical-axis direction; a sensor board that is arranged in the housing and includes an imaging device that faces the barrel; and a support that includes a peripheral wall portion and a control portion, and is arranged between the barrel member and the second case, the peripheral wall portion including a first end and a second end and covering around the imaging device, the first end supporting the barrel member, and the second end being brought into elastic contact with the second case.

Claims (25)

1. A camera module, comprising:

a housing that includes a first case that includes an opening at one of ends of the first case, and a second case that is joined to another of the ends of the first case;

a barrel member that is arranged in the housing and includes a barrel that is fitted into the opening in an optical-axis direction;

a sensor board that is arranged in the housing and includes an imaging device that faces the barrel; and

a support that includes a peripheral wall portion and a control portion, and is arranged between the barrel member and the second case, the peripheral wall portion including a first end and a second end and covering around the imaging device, the first end supporting the barrel member, the second end being brought into elastic contact with the second case, the control portion being arranged between the peripheral wall portion and an inner peripheral surface of the first case and controlling approach of the barrel member to the second case.

2. The camera module according to claim 1 , wherein

the control portion is an elastic part that is formed of a portion of the peripheral wall portion and presses the inner peripheral surface of the first case.

3. The camera module according to claim 2 , wherein

the elastic part is a plate member that extends toward the second case from the peripheral wall portion and is inclined with respect to the optical-axis direction.

4. The camera module according to claim 2 , wherein

the inner peripheral surface of the first case includes an engagement concave portion that is locally formed at a position, in the inner peripheral surface, that is brought into contact with the elastic part, the engagement concave portion being engaged with an end of the elastic part.

5. The camera module according to claim 4 , wherein

the first case is made of a synthetic resin material that has absorptive properties with respect to laser light of a specified wavelength, and

the second case is made of a synthetic resin material that has transmissive properties with respect to the laser light.

6. The camera module according to claim 5 , wherein

the first case further includes an elongated protrusion that is provided to the inner peripheral surface of the first case, the elongated protrusion including the engagement concave portion, and

the elongated protrusion includes a light entrance surface that faces the second case such that there is a gap between the light entrance surface and the second case, the light entrance surface being capable of receiving irradiation of the laser light.

7. The camera module according to claim 6 , wherein

the elongated protrusion further includes a gap portion that is formed between the light entrance surface and a lateral surface portion of the first case.

8. The camera module according to claim 1 , wherein

the control portion is provided to locations that are included in a plurality of locations in the peripheral wall portion and situated across the sensor board from each other.

9. The camera module according to claim 1 , further comprising

an external connector that is provided to the second case and electrically connected to the sensor board.

10. The camera module according to claim 1 , wherein

the camera module is attachable to a vehicle.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2022
From: TOKITO, TOSHIHIRO
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 061095/0812 →
Priority Claims (1)
JP 2020-065049 · Mar 31, 2020 · national
Continuity (1)
Related Publication 20230100251A1 · Mar 30, 2023