IP Library Granted Patent US 12,217,994
Granted Patent B2
US 12,217,994 · App. 17/911,440 · Granted Feb 4, 2025

Electrostatic chuck device and sleeve for electrostatic chuck device

Inventor: Nobuyoshi Yamazaki (Shizuoka, JP)
Assignee: TOMOEGAWA CORPORATION
H01L21/6833
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,217,994
App. No.
17/911,440
Granted
Feb 4, 2025
Kind
B2
Abstract

An electrostatic chuck device containing a substrate, a stack stacked on an upper surface of the substrate in the thickness direction, and a ceramic layer stacked on an upper surface of the stack in the thickness direction. A sleeve formed from an insulating material is inserted into a through-hole that penetrates through the substrate and the stack in the thickness direction. The upper surface of the sleeve in the thickness direction has a two-level structure including a first upper surface positioned on the same plane as an upper surface of the substrate in the thickness direction, and a second upper surface positioned above the first upper surface in the thickness direction of the sleeve and disposed proximate to the ceramic layer. In a plan view, an edge portion of the stack is disposed on top of the first upper surface.

Claims (10)

1. An electrostatic chuck device comprising:

a substrate,

a stack containing at least an internal electrode stacked on top of the substrate,

a ceramic layer stacked on an upper surface of the stack in a thickness direction,

a through-hole penetrating through the substrate and the stack in the thickness direction,

a sleeve formed from an insulating material and inserted in the through-hole, an upper surface of the sleeve in the thickness direction including a two-level structure having a first upper surface positioned coplanar with an upper surface of the substrate in the thickness direction, and a second upper surface positioned above the first upper surface in the thickness direction and disposed proximate to the ceramic layer, an edge portion of the stack in a plan view being disposed on top of the first upper surface,

wherein a space between an outside surface of the edge portion and an outside surface between the first upper surface and the second upper surface is either (i) filled with a filler or (ii) left as a void.

2. The electrostatic chuck device according to claim 1 , wherein the ceramic layer has a base layer, and a surface layer having unevenness formed on an upper surface of the base layer in a thickness direction.

3. The electrostatic chuck device according to claim 1 , wherein the edge portion defines a length in a horizontal direction between 10% and 90% of a distance from the outside surface between the first upper surface and the second upper surface to an outside edge of the first upper surface.

4. The electrostatic chuck device according to claim 1 , wherein the edge portion defines a length in a horizontal direction between 35% and 75% of a distance from the outside surface between the first upper surface and the second upper surface to an outside edge of the first upper surface.

Assignments (2)
CHANGE OF NAME Recorded Oct 29, 2024
From: TOMOEGAWA CO., LTD
To: TOMOEGAWA CORPORATION
Reel/Frame 069274/0178 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2022
From: YAMAZAKI, NOBUYOSHI
To: TOMOEGAWA CO., LTD.
Reel/Frame 061086/0011 →
Priority Claims (1)
JP 2020-055844 · Mar 26, 2020 · national
Continuity (1)
Related Publication 20230115256A1 · Apr 13, 2023
References Cited (19)
US 20060175772A1 · Nozawa · 2006 [cited by applicant]
US 20130265690A1 · Maeta · 2013 [cited by examiner]
US 20140008880A1 · Miura · 2014 [cited by examiner]
US 20180025933A1 · Ishimura · 2018 [cited by examiner]
US 20190385883A1 · Yoshikawa et al. · 2019 [cited by applicant]
JP H10233434A · 1998 [cited by applicant]
JP 2004127956A · 2004 [cited by applicant]
JP 2006344766A · 2006 [cited by applicant]
JP 3128562U · 2007 [cited by applicant]
JP 2016143744A · 2016 [cited by applicant]
JP 2019220503A · 2019 [cited by applicant]
TW 200703545A · 2007 [cited by applicant]
TW 201921485A · 2019 [cited by applicant]
WO 2004084298A1 · 2004 [cited by applicant]
WO 2007131057A2 · 2007 [cited by applicant]
Notification (information statement) issued Feb. 14, 2023 in JP Application No. 2022509496. [cited by applicant]
Int'l Search Report issued Jun. 8, 2021 in Int'l Application No. PCT/JP2021/008815. [cited by applicant]
Office Action issued Feb. 26, 2024 in TW Application No. 110108734 (English translation attached). [cited by applicant]
Office Action issued Feb. 6, 2023 in JP Application No. 2022509496. [cited by applicant]