IP Library › Granted Patent US 12,612,494
Granted Patent B2
US 12,612,494 · App. 17/911,882 · Granted Apr 28, 2026

Organopolysiloxane composition for use in release paper or release film

Inventors: Toshiaki Ihara (Annaka, JP); Ataru Kobayashi (Annaka, JP); Tsuneo Kimura (Annaka, JP)
Assignee: SHIN-ETSU CHEMICAL CO., LTD.
C08J5/18C08G77/08C08G77/12C08G77/20C09D183/04D21H19/32D21H27/001C08J2383/05C08J2383/07
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Quick Facts
Patent No.
US 12,612,494
App. No.
17/911,882
Granted
Apr 28, 2026
Kind
B2
Abstract

This organopolysiloxane composition for use in release paper or release film, said organopolysiloxane composition containing (A) an organopolysiloxane having two or more silicon atom-bonded alkenyl groups in each molecule, (B) an organohydrogen polysiloxane having two or more silicon atom-bonded hydrogen atoms (Si—H groups) on average in each molecule, (C) an organic peroxide and (D) a specific amount of a platinum group metal-based catalyst, is capable of undergoing an addition reaction with a smaller amount of the platinum group metal-based catalyst in comparison to the prior art, thereby being capable of forming a cured coating film which has a release strength equivalent to that of the prior art even in cases where a component that inhibits the catalytic activity of the platinum group metal-based catalyst is contained in the composition. In addition, this organopolysiloxane composition is capable of forming a cured coating film by means of an addition reaction even on a base material containing a catalyst poison component, on said base material conventional compositions being not able to be cured.

Claims (15)

1 . An organopolysiloxane composition for release paper or release film, comprising at least the following components (A) to (D):

(A) 100 parts by weight of an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule and a structure of the following formula (1):

M a M vi b D c D vi d T e T vi f Q g   (1)

wherein M is R 3 SiO 1/2 , M vi is R 2 PSiO 1/2 , D is R 2 SiO 2/2 , D vi is RPSiO 2/2 , T is RSiO 3/2 , T vi is PSiO 3/2 , Q is SiO 4/2 , R is each independently a C 1 -C 12 substituted or unsubstituted monovalent hydrocarbon group free of aliphatic unsaturation, P is an alkenyl group of the formula: —(CH 2 ) n —CH═CH 2 wherein n is an integer of 0 to 6, a is 0, b, d and f are each independently 0 or a positive number, not all b, d and f are 0 at the same time, 2≤b+d+f≤500, c is a positive number of 10 to 27,000, e is 0 or a positive number of up to 200, and g is 0 or a positive number of up to 1,000,

(B) an organohydrogenpolysiloxane having on the average at least two silicon-bonded hydrogen atoms (or Si—H groups) per molecule in an amount to give 1 to 5 moles of Si—H groups per mole of alkenyl groups in component (A),

(C) an organic peroxide in an amount of 0.01 to 5 parts by weight per 100 parts by weight of component (A), and

(D) a platinum group metal base catalyst in an amount to give 1 to 500 ppm of platinum group metal based on the total weight of components (A), (B), (C) and (D).

2 . The organopolysiloxane composition of claim 1 , further comprising (E) an addition reaction inhibitor in an amount of 0.01 to 5 parts by weight per 100 parts by weight of component (A).

3 . The organopolysiloxane composition of claim 1 wherein component (C) is a polyfunctional organic peroxide having at least two peroxy bonds in the molecule.

4 . The organopolysiloxane composition of claim 1 wherein component (C) has a 10-hour half-life temperature of 70° C. to 120° C.

5 . The organopolysiloxane composition of claim 1 wherein the organic peroxide component (C) is a peroxyketal.

6 . The organopolysiloxane composition of claim 1 wherein the organic peroxide as component (C) has a heat generation starting temperature of at least 100° C. as analyzed by DSC.

7 . The organopolysiloxane composition of claim 1 , having a flash point of at least 250° C.

8 . The organopolysiloxane composition of claim 1 , wherein d and f are each independently 0 in the formula (1).

9 . A release paper or release film containing a sheet shaped substrate and a cured silicone film on the surface of the sheet shaped substrate, wherein the cured silicone film is formed on the sheet shaped substrate by heating the composition of claim 1 at 80 to 200° C. for 1 to 60 seconds.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 15, 2022
From: IHARA, TOSHIAKI; KOBAYASHI, ATARU; KIMURA, TSUNEO
To: SHIN-ETSU CHEMICAL CO., LTD.
Reel/Frame 061112/0799 →
Priority Claims (1)
JP 2020-044865 · Mar 16, 2020 · national
Continuity (1)
Related Publication 20230144102A1 · May 11, 2023
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