IP Library › Granted Patent US 12,633,727
Granted Patent B2
US 12,633,727 · App. 17/912,612 · Granted May 19, 2026

Semiconductor optical device

Inventors: Takuro Fujii (Tokyo, JP); Shinji Matsuo (Tokyo, JP); Takuma Tsurugaya (Tokyo, JP)
Assignee: NTT, INC.
H01S5/227H01S5/04256H01S5/12H01S5/2275H01S5/2213H01S5/2224H01S5/3213
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Quick Facts
Patent No.
US 12,633,727
App. No.
17/912,612
Granted
May 19, 2026
Kind
B2
Abstract

There are included: a second semiconductor layer of a second conduction-type formed to be on and in contact with the active layer; and a third semiconductor layer of a second conduction-type formed on the second semiconductor layer, the third semiconductor layer is arranged above a formation region of the active layer, a bottom surface of the third semiconductor layer is arranged in the formation region of the active layer, and a width of the third semiconductor layer, on the active layer side, in a direction perpendicular to a waveguide direction and parallel to a plane of a substrate is set to be smaller than a width of the active layer in the same direction.

Claims (64)

1 . A semiconductor optical device comprising:

a first low refractive index layer on a substrate, the first low refractive index layer having a lower refractive index than a semiconductor;

a first semiconductor layer of a first conduction-type on the first low refractive index layer;

an active layer on the first semiconductor layer;

a second semiconductor layer of a second conduction-type on and in contact with the active layer, the second semiconductor layer forming a first ridge pattern with the active layer;

a third semiconductor layer on the second semiconductor layer and above the active layer, the third semiconductor layer forming a second ridge pattern;

a fourth semiconductor layer on the first semiconductor layer and being in contact with first lateral faces of the first ridge pattern, the fourth semiconductor layer being non-electroconductive;

a fifth semiconductor layer on the first semiconductor layer and in contact with second lateral faces of the first ridge pattern, the fifth semiconductor layer being non-electroconductive;

a second low refractive index layer on the fourth semiconductor layer, the second low refractive index layer having a lower refractive index than a semiconductor and being in contact with first lateral faces of the second ridge pattern;

a third low refractive index layer on the fifth semiconductor layer, the third low refractive index layer having a lower refractive index than a semiconductor and being in contact with second lateral faces of the second ridge pattern;

a first electrode formed directly on the first semiconductor layer and electrically connected to the first semiconductor layer; and

a second electrode electrically connected to the third semiconductor layer, wherein a width of the third semiconductor layer, on the active layer side, in a width direction, which is perpendicular to a waveguide direction and parallel to a plane of the substrate, is smaller than a width of the active layer in the width direction.

2 . The semiconductor optical device according to claim 1 , wherein the fourth semiconductor layer comprises i-type InP.

3 . The semiconductor optical device according to claim 1 , wherein the fourth semiconductor layer comprises InP doped with Fe.

4 . The semiconductor optical device according to claim 1 , wherein the second electrode is disposed on the third semiconductor layer via a contact layer.

5 . The semiconductor optical device according to claim 1 , wherein the active layer and the second semiconductor layer have a same area in a plan view, and wherein the second semiconductor layer overlaps with the active layer in the plan view.

6 . The semiconductor optical device according to claim 1 , wherein a refractive index of the second semiconductor layer is a refractive index between those of the third semiconductor layer and the active layer.

7 . The semiconductor optical device according to claim 1 , further comprising:

a core buried in the first low refractive index layer in a region below the active layer.

8 . The semiconductor optical device according to claim 1 , further comprising:

a diffraction grating buried in the first low refractive index layer in a region below the active layer.

9 . The semiconductor optical device according to claim 1 , wherein the first low refractive index layer is an insulating material.

10 . The semiconductor optical device according to claim 1 , wherein the first low refractive index layer is composed of silicon oxide and/or silicon nitride.

11 . A semiconductor optical device comprising:

a first low refractive index layer on a substrate, the first low refractive index layer having a lower refractive index than a semiconductor;

a first semiconductor layer of a first conduction-type on the first low refractive index layer;

an active layer on the first semiconductor layer;

a second semiconductor layer of a second conduction-type on and in contact with the active layer, the second semiconductor layer forming a first ridge pattern with the active layer;

a third semiconductor layer on the second semiconductor layer and above the active layer, the third semiconductor layer forming a second ridge pattern;

a fourth semiconductor layer on the first semiconductor layer and being in contact with first lateral faces of the first ridge pattern, the fourth semiconductor layer comprising i-type InP or InP doped with Fe;

a fifth semiconductor layer on the first semiconductor layer and in contact with second lateral faces of the first ridge pattern, the fifth semiconductor layer comprising i-type InP or InP doped with Fe;

a second low refractive index layer on the fourth semiconductor layer, the second low refractive index layer having a lower refractive index than a semiconductor and being in contact with first lateral faces of the second ridge pattern;

a third low refractive index layer on the fifth semiconductor layer, the third low refractive index layer having a lower refractive index than a semiconductor and being in contact with second lateral faces of the second ridge pattern;

a first electrode formed directly on the first semiconductor layer and electrically connected to the first semiconductor layer; and

a second electrode electrically connected to the third semiconductor layer, wherein a width of the third semiconductor layer, on the active layer side, in a width direction, which is perpendicular to a waveguide direction and parallel to a plane of the substrate, is smaller than a width of the active layer in the width direction.

12 . The semiconductor optical device according to claim 11 , wherein the second electrode is on the third semiconductor layer via a contact layer.

13 . The semiconductor optical device according to claim 11 , wherein the active layer and the second semiconductor layer have a same area in a plan view, and the second semiconductor layer overlaps with the active layer in the plan view.

14 . The semiconductor optical device according to claim 11 , wherein a refractive index of the second semiconductor layer is a refractive index between those of the third semiconductor layer and the active layer.

15 . The semiconductor optical device according to claim 11 , wherein the first low refractive index layer is an insulating material.

16 . The semiconductor optical device according to claim 11 , wherein the first low refractive index layer is composed of silicon oxide and/or silicon nitride.

17 . A semiconductor optical device comprising:

a first low refractive index layer on a substrate, the first low refractive index layer having a lower refractive index than a semiconductor;

a first semiconductor layer of a first conduction-type on the first low refractive index layer;

an active layer on the first semiconductor layer;

a second semiconductor layer of a second conduction-type on and in contact with the active layer;

a third semiconductor layer on the second semiconductor layer and above the active layer, the third semiconductor layer forming a ridge pattern;

a second low refractive index layer on the second semiconductor layer, the second low refractive index layer having a lower refractive index than a semiconductor and being in contact with first lateral faces of the ridge pattern of the third semiconductor layer;

a third low refractive index layer on the second semiconductor layer, the third low refractive index layer having a lower refractive index than a semiconductor and being in contact with second lateral faces of the ridge pattern of the third semiconductor layer;

a first electrode formed directly on the first semiconductor layer and electrically connected to the first semiconductor layer;

a second electrode electrically connected to the third semiconductor layer; and

a core buried in the first low refractive index layer in a region below the active layer, wherein

a width of the third semiconductor layer, on the active layer side, in a width direction, which is perpendicular to a waveguide direction and parallel to a plane of the substrate, is smaller than a width of the active layer in the width direction.

18 . A semiconductor optical device comprising:

a first low refractive index layer on a substrate, the first low refractive index layer having a lower refractive index than a semiconductor;

a first semiconductor layer of a first conduction-type on the first low refractive index layer;

an active layer on the first semiconductor layer;

a second semiconductor layer of a second conduction-type on and in contact with the active layer;

a third semiconductor layer on the second semiconductor layer and above the active layer, the third semiconductor layer forming a ridge pattern;

a second low refractive index layer on the second semiconductor layer, the second low refractive index layer having a lower refractive index than a semiconductor and being in contact with first lateral faces of the ridge pattern of the third semiconductor layer;

a third low refractive index layer on the second semiconductor layer, the third low refractive index layer having a lower refractive index than a semiconductor and being in contact with second lateral faces of the ridge pattern of the third semiconductor layer;

a first electrode formed directly on the first semiconductor layer and electrically connected to the first semiconductor layer;

a second electrode electrically connected to the third semiconductor layer; and

a diffraction grating buried in the first low refractive index layer in a region below the active layer, wherein

a width of the third semiconductor layer, on the active layer side, in a width direction, which is perpendicular to a waveguide direction and parallel to a plane of the substrate, is smaller than a width of the active layer in the width direction.

Assignments (2)
CHANGE OF NAME Recorded Oct 7, 2025
From: NIPPON TELEGRAPH AN D TELEPHONE CORPORATION
To: NTT, INC.
Reel/Frame 073014/0979 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2022
From: FUJII, TAKURO; MATSUO, SHINJI; TSURUGAYA, TAKUMA
To: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
Reel/Frame 061135/0241 →
Continuity (1)
Related Publication 20230139692A1 · May 4, 2023
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