IP Library › Granted Patent US 12,635,389
Granted Patent B2
US 12,635,389 · App. 17/914,575 · Granted May 19, 2026

Manufacturing method for display panel, display panel, and display device

Inventors: Le Peng (Beijing, CN); Yunte Chen (Beijing, CN); Yingxi Cui (Beijing, CN); Xuepei Cheng (Beijing, CN); Lubiao Sun (Beijing, CN); Huina Qiao (Beijing, CN); Zhengde Liu (Beijing, CN); Qiang Guo (Beijing, CN); Xuelin Zou (Beijing, CN); Mengxin Xian (Beijing, CN)
Assignees: MIANYANG BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
H10K59/8731H10K59/1201H10K59/40
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Quick Facts
Patent No.
US 12,635,389
App. No.
17/914,575
Granted
May 19, 2026
Kind
B2
Abstract

A manufacturing method for a display panel, the display panel, and a display device are provided. The manufacturing method includes: providing a driving backplane; forming an inorganic encapsulation layer on the driving backplane using a vapor deposition method, so that the inorganic encapsulation layer includes a main encapsulation layer covering the display area and a part of the peripheral area and an infiltration layer extending from the main encapsulation layer towards a direction away from the display area; forming an inorganic layer on a side of the inorganic encapsulation layer away from the driving backplane, so that the inorganic layer includes a first inorganic layer covering the main encapsulation layer and a second inorganic layer extending from the first inorganic layer towards the direction away from the display area; and simultaneously etching the second inorganic layer and the infiltration layer using a same mask to remove them.

Claims (58)

1 . A manufacturing method for manufacturing a display panel, the display panel comprising a display area and a peripheral area surrounding the display area, wherein the manufacturing method comprises:

providing a driving backplane;

forming an inorganic encapsulation layer on the driving backplane by a mask using a vapor deposition method, so that the inorganic encapsulation layer comprises a main encapsulation layer which covers the display area and a part of the peripheral area and an infiltration layer which extends from the main encapsulation layer towards a direction away from the display area, wherein the infiltration layer is formed by infiltrating of an inorganic material, which is used for forming the main encapsulation layer, between the mask and the driving backplane, and a part of the inorganic encapsulation layer covering the display area and a barrier dam is the main encapsulation layer;

forming an inorganic layer on a side of the inorganic encapsulation layer away from the driving backplane, so that the inorganic layer comprises a first inorganic layer which covers the main encapsulation layer and a second inorganic layer which extends from the first inorganic layer towards the direction away from the display area; and

simultaneously etching the second inorganic layer and the infiltration layer using a same mask to remove the second inorganic layer and the infiltration layer at an outside of the barrier dam.

2 . The manufacturing method for manufacturing the display panel according to claim 1 , wherein the inorganic layer is a buffer layer in a touch function layer;

wherein forming the inorganic layer comprises:

forming the buffer layer on a side of the inorganic encapsulation layer away from the driving backplane, so that the buffer layer comprises a first buffer layer which covers the main encapsulation layer and a second buffer layer which extends from the first buffer layer towards the direction away from the display area, wherein the first buffer layer is the first inorganic layer, and the second buffer layer is the second inorganic layer;

wherein etching of the second inorganic layer and the infiltration layer comprises:

simultaneously etching the second buffer layer and the infiltration layer using the same mask to remove the second buffer layer and the infiltration layer.

3 . The manufacturing method for manufacturing the display panel according to claim 1 , wherein the inorganic layer is a touch insulating layer in the touch functional layer;

wherein forming the inorganic layer comprises:

forming the touch insulating layer on a side of the inorganic encapsulation layer away from the driving backplane, so that the touch insulating layer comprises a first insulating layer which covers the main encapsulation layer and a second insulating layer which extends from the first insulating layer towards the direction away from the display area, wherein the first insulating layer is the first inorganic layer, and the second insulating layer is the second inorganic layer;

wherein etching of the second inorganic layer and the infiltration layer comprises:

simultaneously etching the second insulating layer and the infiltration layer using the same mask to remove the second insulating layer and the infiltration layer;

wherein the manufacturing method further comprises:

forming a first touch electrode layer between the inorganic encapsulation layer and the touch insulating layer, so that a projection of the first touch electrode layer on the driving backplane is located within a projection of the main encapsulation layer.

4 . The manufacturing method for manufacturing the display panel according to claim 3 , further comprising:

forming a buffer layer between the inorganic encapsulation layer and the first touch electrode layer, so that the buffer layer comprises a first buffer layer which covers the main encapsulation layer and a second buffer layer which extends from the first buffer layer towards the direction away from the display area;

wherein when the second insulating layer and the infiltration layer are simultaneously etched and removed using the same mask, the second buffer layer is also etched and removed at the same time.

5 . The manufacturing method for manufacturing the display panel according to claim 1 , further comprising:

forming, on the driving backplane, the barrier dam in the peripheral area and surrounding the display area;

wherein when the inorganic encapsulation layer is formed, the main encapsulation layer is made to cover the display area and the barrier dam.

6 . The manufacturing method for manufacturing the display panel according to claim 1 , wherein forming the inorganic encapsulation layer comprises:

forming a first inorganic encapsulation layer on the driving backplane by the vapor deposition method, wherein the first inorganic encapsulation layer comprises a first main encapsulation layer which covers the display area and the barrier dam and a first infiltration layer which extends from the first main encapsulation layer towards the direction away from the display area;

forming a second inorganic encapsulation layer which covers the first inorganic encapsulation layer by the vapor deposition method, wherein the second inorganic encapsulation layer comprises a second main encapsulation layer which covers the display area and the barrier dam and a second infiltration layer which extends from the second main encapsulation layer towards the direction away from the display area, the second main encapsulation layer covers the first main encapsulation layer, and the second infiltration layer covers the first infiltration layer;

wherein etching of the infiltration layer to remove the infiltration layer comprises simultaneously etching the first infiltration layer and the second infiltration layer to remove the first infiltration layer and the second infiltration layer.

7 . A display panel, wherein the display panel is divided into a display area and a peripheral area surrounding the display area, and the display panel comprises:

a driving backplane;

an inorganic encapsulation layer arranged on the driving backplane and covering the display area and a part of the peripheral area, wherein the inorganic encapsulation layer is formed on the driving backplane by a mask using a vapor deposition method, so that the inorganic encapsulation layer comprises a main encapsulation layer which covers the display area and a part of the peripheral area and an infiltration layer which extends from the main encapsulation layer towards a direction away from the display area; and

an inorganic layer arranged on a side of the inorganic encapsulation layer away from the driving backplane, wherein an edge of the inorganic layer and an edge of the inorganic encapsulation layer are flush in a thickness direction of the display panel, and both the edge of the inorganic layer and the edge of the inorganic encapsulation layer are located in the peripheral area;

wherein the infiltration layer which is formed by infiltrating of an inorganic material, which is used for forming the main encapsulation layer, between the mask and the driving backplane and is at an outside of a barrier dam in the display panel, is removed.

8 . The display panel according to claim 7 , wherein the inorganic layer is a buffer layer in a touch function layer, and an edge of the buffer layer and the edge of the inorganic encapsulation layer are flush in the thickness direction of the display panel.

9 . The display panel according to claim 7 , wherein the inorganic layer is a touch insulating layer in a touch functional layer, and an edge of the touch insulating layer and the edge of the inorganic encapsulation layer are flush in the thickness direction of the display panel;

wherein the display panel further comprises a first touch electrode layer arranged between the inorganic encapsulation layer and the touch insulating layer, and a projection of the first touch electrode layer on the driving backplane is located within a projection of the inorganic encapsulation layer.

10 . The display panel according to claim 9 , further comprising:

a buffer layer in the touch function layer, wherein the buffer layer is arranged between the inorganic encapsulation layer and the first touch electrode layer, and an edge of the buffer layer and edges of the touch insulating layer and the inorganic encapsulation layer are flush in the thickness direction of the display panel.

11 . The display panel according to claim 7 , further comprising:

the barrier dam arranged in the peripheral area and around the display area;

wherein the inorganic encapsulation layer covers the display area and the barrier dam, and the edge of the inorganic layer and the edge of the inorganic encapsulation layer are both located on a side of the barrier dam away from the display area.

12 . The display panel according to claim 7 , wherein the inorganic encapsulation layer comprises a first inorganic encapsulation layer and a second inorganic encapsulation layer which are stacked;

wherein the edge of the inorganic layer and edges of the first inorganic encapsulation layer and the second inorganic encapsulation layer are flush in the thickness direction of the display panel.

13 . A display device comprising a display panel;

wherein the display panel is divided into a display area and a peripheral area surrounding the display area, and the display panel comprises:

a driving backplane;

an inorganic encapsulation layer arranged on the driving backplane and covering the display area and a part of the peripheral area, wherein the inorganic encapsulation layer is formed on the driving backplane by a mask using a vapor deposition method, so that the inorganic encapsulation layer comprises a main encapsulation layer which covers the display area and a part of the peripheral area and an infiltration layer which extends from the main encapsulation layer towards a direction away from the display area; and

an inorganic layer arranged on a side of the inorganic encapsulation layer away from the driving backplane, wherein an edge of the inorganic layer and an edge of the inorganic encapsulation layer are flush in a thickness direction of the display panel, and both the edge of the inorganic layer and the edge of the inorganic encapsulation layer are located in the peripheral area;

wherein the infiltration layer which is formed by infiltrating of an inorganic material, which is used for forming the main encapsulation layer, between the mask and the driving backplane and is at an outside of a barrier dam in the display panel, is removed.

14 . The display device according to claim 13 , wherein the inorganic layer is a buffer layer in a touch function layer, and an edge of the buffer layer and the edge of the inorganic encapsulation layer are flush in the thickness direction of the display panel.

15 . The display device according to claim 13 , wherein the inorganic layer is a touch insulating layer in a touch functional layer, and an edge of the touch insulating layer and the edge of the inorganic encapsulation layer are flush in the thickness direction of the display panel;

wherein the display panel further comprises a first touch electrode layer arranged between the inorganic encapsulation layer and the touch insulating layer, and a projection of the first touch electrode layer on the driving backplane is located within a projection of the inorganic encapsulation layer.

16 . The display device according to claim 15 , further comprising:

a buffer layer in the touch function layer, wherein the buffer layer is arranged between the inorganic encapsulation layer and the first touch electrode layer, and an edge of the buffer layer and edges of the touch insulating layer and the inorganic encapsulation layer are flush in the thickness direction of the display panel.

17 . The display panel according to claim 13 , further comprising:

the barrier dam arranged in the peripheral area and around the display area;

wherein the inorganic encapsulation layer covers the display area and the barrier dam, and the edge of the inorganic layer and the edge of the inorganic encapsulation layer are both located on a side of the barrier dam away from the display area.

18 . The display panel according to claim 13 , wherein the inorganic encapsulation layer comprises a first inorganic encapsulation layer and a second inorganic encapsulation layer which are stacked;

wherein the edge of the inorganic layer and edges of the first inorganic encapsulation layer and the second inorganic encapsulation layer are flush in the thickness direction of the display panel.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 26, 2022
From: PENG, LE; CHEN, YUNTE; CUI, YINGXI; CHENG, XUEPEI; SUN, LUBIAO; QIAO, HUINA; LIU, ZHENGDE; GUO, QIANG; ZOU, XUELIN; XIAN, MENGXIN
To: MIANYANG BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.; BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 061214/0603 →
Priority Claims (1)
CN 202011339383.7 · Nov 25, 2020 · national
Continuity (1)
Related Publication 20230209974A1 · Jun 29, 2023
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