Manufacturing apparatus of semiconductor device and manufacturing method of semiconductor device
A manufacturing apparatus of a semiconductor device includes: multiple processing heads provided apart from each other in order to perform predetermined processing in different positions on a common lead frame, the processing heads respectively including cameras; and a controller controlling driving of the processing heads, the controller positioning each of the processing heads at a position where at least an optical offset is canceled out. The controller takes an image of a paste of one island by the cameras and acquires optical inspection images respectively corresponding to the processing heads before the positioning, and calculates, as the optical offset, an amount of difference between the processing heads in a relative positional relationship between the island and the paste shown in the optical inspection images.
1 . A manufacturing apparatus of a semiconductor device, comprising:
a plurality of processing heads provided apart from each other in order to perform predetermined processing in different positions on a common substrate, wherein each of the plurality of processing heads comprises a camera taking an image of the substrate; and
a controller controlling driving of the plurality of processing heads and conveyance of the substrate, wherein the controller positions each of the plurality of processing heads with respect to the substrate at a position where at least an optical offset due to a variation in optical characteristics between the plurality of cameras in the plurality of processing heads is canceled out, wherein
the controller, before the positioning,
takes an image of one optical inspection part comprising a reference and an object located apart from the reference by the camera of each of the plurality of processing heads and acquires an optical inspection image corresponding to each of the plurality of processing heads, and
calculates, as the optical offset, an amount of difference between the processing heads in a relative positional relationship between the reference and the object shown in the optical inspection image.
2 . The manufacturing apparatus of a semiconductor device according to claim 1 , wherein
the predetermined processing comprises processing for mounting the object on the substrate;
the reference is a shape feature of a surface of the substrate;
the controller
before acquisition of the optical inspection image, causes one of the plurality of processing heads to execute the predetermined processing on a portion of the substrate, and
causes an image to be taken of a part of the substrate where the object is mounted by the predetermined processing as the optical inspection part by the camera of each of the plurality of processing heads.
3 . The manufacturing apparatus of a semiconductor device according to claim 1 , wherein
in the positioning, the controller positions each of the plurality of processing heads at a position where the optical offset and a machine offset are canceled out, and
the controller, before the positioning,
causes each of the plurality of processing heads to execute the predetermined processing in a corresponding area on the substrate,
takes an image of the corresponding area on the substrate by the camera of each of the plurality of processing heads, and acquires a mechanical inspection image corresponding to each of the plurality of processing heads, and
calculates the machine offset for each of the plurality of processing heads based on a relative positional relationship between the reference and the object shown in the mechanical inspection image.
4 . The manufacturing apparatus of a semiconductor device according to claim 1 , wherein
the predetermined processing is processing for coating a paste as the object on the substrate.
5 . A manufacturing method of a semiconductor device, comprising:
acquiring an optical offset due to a variation in optical characteristics between each of a plurality of cameras corresponding to each of a plurality of processing heads provided apart from each other in order to perform predetermined processing in different positions on a common substrate; and
positioning each of the plurality of processing heads with respect to the substrate at a position where at least the optical offset is canceled out, and causing each of the plurality of processing heads to execute the predetermined processing in a corresponding position on the substrate;
wherein the acquiring comprises:
taking an image of one optical inspection part comprising a reference and an object located apart from the reference by a camera provided on each of the plurality of processing heads and acquiring an optical inspection image corresponding to each of the plurality of processing heads; and
calculating, as the optical offset, an amount of difference between the processing heads in a relative positional relationship between the reference and the object shown in the optical inspection image.
6 . The manufacturing apparatus of a semiconductor device according to claim 2 , wherein
in the positioning, the controller positions each of the plurality of processing heads at a position where the optical offset and a machine offset are canceled out, and
the controller, before the positioning,
causes each of the plurality of processing heads to execute the predetermined processing in a corresponding area on the substrate,
takes an image of the corresponding area on the substrate by the camera of each of the plurality of processing heads, and acquires a mechanical inspection image corresponding to each of the plurality of processing heads, and
calculates the machine offset for each of the plurality of processing heads based on a relative positional relationship between the reference and the object shown in the mechanical inspection image.