IP Library › Assignment 072291/0409
Patent Assignment
Reel/Frame 072291/0409

Merger

Recorded: 2025-09-18 Pages: 17
Assignor
SHINKAWA LTD.
Executed: 2025-07-01
Assignee
YAMAHA ROBOTICS CO., LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, JAPAN
Covered Properties (5)
Manufacturing Apparatus and Manufacturing Method of Semiconductor Device
Application: 17/626,810 →
Publication: US 2022/0359240
Semiconductor Device Manufacturing Device and Manufacturing Method
Application: 17/642,951 →
Publication: US 2022/0336256
Manufacturing Apparatus of Semiconductor Device and Manufacturing Method of Semiconductor Device
Application: 17/919,522 →
Publication: US 2024/0127423
Measurement Device, Measurement Method, and Bonding System
Application: 18/032,564 →
Publication: US 2023/0392921
Wire Bonding System, Inspection Device, Wire Bonding Method, and Recording Medium
Application: 18/559,342 →
Publication: US 2024/0242984
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 16, 2022
From: TAKAHASHI, MAKOTO
To: SHINKAWA LTD.
Reel/Frame 058667/0834 →
Assignment of Assignor's Interest Mar 17, 2022
From: TAKAHASHI, MAKOTO
To: SHINKAWA LTD.
Reel/Frame 059300/0182 →
Assignment of Assignor's Interest Oct 19, 2022
From: OGATA, YOSHIYUKI
To: SHINKAWA LTD.
Reel/Frame 061475/0691 →
Assignment of Assignor's Interest Nov 10, 2023
From: KASAMA, HIROYUKI
To: SHINKAWA LTD.
Reel/Frame 065518/0102 →
Assignment of Assignor's Interest Jun 13, 2025
From: YOSHIDA, SHINICHI
To: SHINKAWA LTD.
Reel/Frame 071404/0863 →