Patent Assignment
Reel/Frame 065518/0102
Assignment of Assignor's Interest
Recorded: 2023-11-10
Pages: 4
Assignor
KASAMA, HIROYUKI
Executed: 2023-11-01
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Wire Bonding System, Inspection Device, Wire Bonding Method, and Recording Medium
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.