IP Library Granted Patent US 12,135,173
Granted Patent B2
US 12,135,173 · App. 17/925,010 · Granted Nov 5, 2024

Heat exchanger

Inventors: Koji Minamitani (Isehara, JP); Terutoshi Kumaki (Isehara, JP)
Assignee: Resonac Packaging Corporation
F28F21/065B32B1/00B32B7/12B32B15/08B32B37/12F28F3/12B32B2037/1253H01M10/613H01M10/625H01M10/6568H01M2220/20
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Quick Facts
Patent No.
US 12,135,173
App. No.
17/925,010
Granted
Nov 5, 2024
Kind
B2
Abstract

A heat exchanger includes an outer packaging member. The outer packaging member is configured to allow a heat transfer medium flowed to an inside of the outer packaging member from a heat transfer medium inlet to pass through the inside and flow out from a heat transfer medium outlet. The outer packaging member is made of outer packaging laminate materials each including a metal heat transfer layer and a resin thermal fusion layer provided on one surface of the heat transfer layer. The outer packaging laminate materials are superimposed one on the other. The thermal fusion layers are integrally bonded along peripheral edge portions of the outer packaging laminate materials. The heat transfer layer and the thermal fusion layer of the outer packaging laminate material are laminated via an inner adhesive agent layer made of an acid-modified polyolefin-based adhesive agent containing an acid-modified polyolefin-based resin.

Claims (16)

1. A heat exchanger comprising:

an outer packaging member provided with a heat transfer medium inlet and a heat transfer medium outlet, the outer packaging member being configured to allow a heat transfer medium flowed to an inside of the outer packaging member from the heat transfer medium inlet to pass through the inside and flow out from the heat transfer medium outlet,

wherein the outer packaging member is made of outer packaging laminate materials each including a metal heat transfer layer and a resin thermal fusion layer provided on one surface of the heat transfer layer, the outer packaging laminate materials being superimposed one on the other, the thermal fusion layers being integrally bonded along peripheral edge portions of the outer packaging laminate materials,

wherein the heat transfer layer and the thermal fusion layer of the outer packaging laminate material are laminated via an inner adhesive agent layer made of an acid-modified polyolefin-based adhesive agent containing an acid-modified polyolefin-based resin, and

wherein the acid-modified polyolefin-based adhesive agent comprises a polyolefin resin having a carboxyl group as a main agent and a polyfunctional isocyanate compound as a curing agent.

2. The heat exchanger as recited in claim 1 , wherein a ratio of the number of isocyanato groups contained in the polyfunctional isocyanate compound to the number of carboxyl groups contained in the polyolefin resin is 1 to 20.

3. The heat exchanger as recited in claim 1 , wherein the polyfunctional isocyanate compound comprises aliphatic isocyanate and aromatic isocyanate.

4. The heat exchanger as recited in claim 1 ,

wherein the inner adhesive agent layer contains one or more metal salts composed of at least one kind of metal of Groups 7, 12, and 14.

5. The heat exchanger as recited in claim 1 ,

wherein a protective layer is laminated on the other surface of the heat transfer layer of the outer packaging member.

6. The heat exchanger as recited in claim 1 , further comprising:

an inner core member arranged inside the outer packaging member,

wherein the inner core member is composed of an inner core laminate material including a metal heat transfer layer and a resin thermal fusion layer provided on both sides of the heat transfer layer, the inner core member having a concave-convex portion,

wherein the thermal fusion layers of a concave bottom surface and a convex top surface of the inner core member and the thermal fusion layer of the outer packaging member are integrally bonded, and

wherein the thermal fusion layer of the outer packaging member and the thermal fusion layer of the inner core member are composed of the same kind of resin.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2024
From: MINAMITANI, KOJI; KUMAKI, TERUTOSHI
To: RESONAC PACKAGING CORPORATION
Reel/Frame 066923/0636 →
CHANGE OF NAME Recorded Sep 11, 2023
From: SHOWA DENKO PACKAGING CO., LTD.
To: RESONAC PACKAGING CORPORATION
Reel/Frame 064854/0084 →
Priority Claims (1)
JP 2020-084937 · May 14, 2020 · national
Continuity (1)
Related Publication 20230243606A1 · Aug 3, 2023
Cited By (1)
US 12,571,599