IP Library › Granted Patent US 12,451,469
Granted Patent B2
US 12,451,469 · App. 17/939,636 · Granted Oct 21, 2025

Display module and display apparatus including the same

Inventors: Kwangjae Lee (Suwon-si, KR); Sungsoo Jung (Suwon-si, KR); Seonghwan Shin (Suwon-si, KR); Pilyong Oh (Suwon-si, KR); Jeongin Han (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
H01L25/0753H10H20/857
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Quick Facts
Patent No.
US 12,451,469
App. No.
17/939,636
Granted
Oct 21, 2025
Kind
B2
Abstract

A display module includes a substrate included a mounting surface on which a plurality of inorganic light emitting devices is mounted and a rear surface opposite the mounting surface, a metal plate facing the rear surface, and an adhesive layer provided between the rear surface of the substrate and the metal plate. An area of the substrate is equal to or greater than an area of the metal plate, the adhesive layer has an area corresponding to an area in which the metal plate faces the substrate, a coefficient of thermal expansion of the substrate is less than a coefficient of thermal expansion of the metal plate, and a ductility of the adhesive layer is greater than a ductility of the substrate and a ductility of the metal plate.

Claims (39)

1. A display module comprising:

a substrate comprising a mounting surface on which a plurality of inorganic light emitting devices is mounted and a rear surface opposite the mounting surface;

a metal plate facing the rear surface;

an adhesive layer provided between the rear surface of the substrate and the metal plate;

a driving circuit board provided at the rear of the metal plate in a direction in which the rear surface faces; and

a flexible film penetrating the metal plate and connecting the substrate to the driving circuit board,

wherein an area of the substrate is equal to or greater than an area of the metal plate,

wherein the adhesive layer has an area corresponding to an area in which the metal plate faces the substrate,

wherein a coefficient of thermal expansion of the substrate is less than a coefficient of thermal expansion of the metal plate, and

wherein a ductility of the adhesive layer is greater than a ductility of the substrate and a ductility of the metal plate.

2. The display module of claim 1 ,

wherein the flexible film comprises a first end connected to the substrate and a second end connected to the driving circuit board such that the flexible film electrically connects the plurality of inorganic light emitting devices and the driving circuit board.

3. The display module of claim 2 , wherein the metal plate comprises a metal plate cutout portion through which the flexible film to penetrates the metal plate.

4. The display module of claim 3 , wherein the substrate further comprises a connection pad provided on the rear surface of the substrate to connect the plurality of inorganic light emitting devices and the first end of the flexible film, and

wherein the metal plate cutout portion is formed at a position where the connection pad and the first end of the flexible film are connected in the direction in which the rear surface faces.

5. The display module of claim 4 , wherein the metal plate cutout portion comprises a passing hole configured to allow the flexible film to penetrate the metal plate.

6. The display module of claim 3 , wherein the adhesive layer comprises an adhesive layer cutout portion configured to allow the flexible film to penetrate the adhesive layer.

7. The display module of claim 6 , wherein the substrate further comprises a connection pad provided on the rear surface and configured to connect the plurality of inorganic light emitting devices and the first end of the flexible film, and

wherein the adhesive layer cutout portion comprises a passing hole formed at a position where the connection pad and the first end of the flexible film are connected.

8. The display module of claim 3 , wherein the adhesive layer comprises an adhesive layer cutout portion configured to allow the flexible film to penetrate the adhesive layer, and

wherein the adhesive layer cutout portion is provided at a position corresponding to a position of the metal plate cutout portion.

9. The display module of claim 8 , wherein the metal plate cutout portion has a shape corresponding to a shape of the adhesive layer cutout portion.

10. The display module of claim 1 , wherein the adhesive layer comprises an inorganic adhesive tape comprising a first surface adhered to the rear surface and a second surface adhered to the metal plate.

11. The display module of claim 10 , wherein the adhesive layer is formed by mixing a first material comprising an adhesiveness and a second material having a higher heat dissipation performance than the first material.

12. The display module of claim 2 , wherein the metal plate comprises a first surface facing the adhesive layer and a second surface opposite side the first surface, and

wherein the driving circuit board is provided on the second surface of the metal plate.

13. The display module of claim 2 , wherein the metal plate is provided on the rear surface at a position that is more inside with respect to a center of the substrate than a position where the first end of the flexible film is connected to the substrate.

14. A display apparatus comprising a display module array comprising a plurality of display modules horizontally arranged in an M*N matrix, wherein each of the plurality of display modules comprises:

a substrate comprising a mounting surface on which a plurality of inorganic light emitting devices is mounted and a rear surface opposite the mounting surface;

a metal plate facing the rear surface of the substrate and configured to dissipate heat generated from the substrate;

an adhesive layer provided between the rear surface of the substrate and the metal plate;

a driving circuit board provided at the rear of the metal plate in a direction in which the rear surface faces; and

a flexible film penetrating the metal plate and connecting the substrate to the driving circuit board,

wherein an area of the substrate is equal to or greater than an area of the metal plate,

wherein the adhesive layer has an area corresponding to an area of the metal plate,

wherein a coefficient of thermal expansion of the substrate is less than a coefficient of thermal expansion of the metal plate, and

wherein a ductility of the adhesive layer is greater than a ductility of the substrate and a ductility of the metal plate.

15. The display apparatus of claim 14 , further comprising a chassis on which the display modules are supported,

wherein each of the display modules further comprises a coupling member comprising a first surface adhered to each of the plurality of display modules and a second surface adhered to the chassis such that the chassis and each of the plurality of display modules are coupled.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 7, 2022
From: LEE, KWANGJAE; JUNG, SUNGSOO; SHIN, SEONGHWAN; OH, PILYONG; HAN, JEONGIN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 061017/0410 →
Priority Claims (1)
KR 10-2020-0050278 · Apr 24, 2020 · national
Continuity (2)
Continuation PCTKR2021004620 · Apr 13, 2021
Related Publication 20220415865A1 · Dec 29, 2022
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