Electronic devices having multiple alignment layers
A method for forming an electronic device including two stacked liquid crystal cells is disclosed. A first liquid crystal cell including two substrates is provided. A second liquid crystal cell is formed by disposing another substrate to one of the substrates of the first liquid crystal cell. Subsequently, a cutting step is performed to cut off unnecessary portions of the substrates of the first liquid crystal cell and the second liquid crystal cell. Before bonding the another substrate, a pre-cutting step is performed to form at least a pre-cutting mark on the substrate on which the another substrate is bonded in order to facilitate removal of unnecessary portions of the substrates.
1. A method for forming an electronic device, comprising:
providing a first liquid crystal cell comprising a first substrate with a first conductive layer and a third substrate;
performing a pre-cutting step to form at least a pre-cutting mark on the third substrate;
forming a second liquid crystal cell by disposing a second substrate with a second conductive layer to the third substrate;
performing a cutting step to cut off portions of the first substrate and the second substrate and concurrently removing a portion of the third substrate along the pre-cutting mark to expose a sidewall of the third substrate; and
forming a first conductive adhesive covering a part of the sidewall of the third substrate and directly contacting the first conductive layer and the second conductive layer.
2. The method according to claim 1 , wherein the first liquid crystal cell further comprises:
a first sealant sealing a first space between the first substrate and the third substrate; and
a first dummy sealant between the first substrate and the third substrate and outside the first space; and the method further comprises:
forming the pre-cutting mark between the first sealant and the first dummy sealant.
3. The method according to claim 1 , further comprising:
forming a second sealant on the third substrate; and
disposing the second substrate to the third substrate by the second sealant to seal a second space of the second liquid crystal cell between the second substrate and the third substrate, wherein the pre-cutting mark is outside the second space.
4. The method according to claim 3 , further comprising:
forming a second dummy sealant on the third substrate and at a side of the pre-cutting mark opposite to the second sealant; and
disposing the second substrate to the third substrate by the second sealant and the second dummy sealant.
5. The method according to claim 1 , further comprising:
forming a first dye-doped liquid crystal layer between the first substrate and the third substrate; and
forming a second dye-doped liquid crystal layer between the third substrate and the second substrate, wherein the first dye-doped liquid crystal layer and the second dye-doped liquid crystal layer respectively comprise at least a dichroic dye.
6. A method for forming an electronic device, comprising:
providing a first liquid crystal cell comprising a first substrate and a third substrate with a third conductive layer and a fourth conductive layer disposed on opposite surfaces of the third substrate;
performing a pre-cutting step to form at least a pre-cutting mark on the third substrate;
forming a second liquid crystal cell by disposing a second substrate to the third substrate;
performing a cutting step to cut off portions of the first substrate and the second substrate and concurrently removing a portion of the third substrate along the pre-cutting mark to expose a sidewall of the third substrate, and;
forming a second conductive adhesive covering a part of the sidewall of the third substrate and directly contacting the third conductive layer and the fourth conductive layer.
7. The method according to claim 6 , wherein the first liquid crystal cell further comprises:
a first sealant sealing a first space between the first substrate and the third substrate; and
a first dummy sealant between the first substrate and the third substrate and outside the first space; and the method further comprises:
forming the pre-cutting mark between the first sealant and the first dummy sealant.
8. The method according to claim 6 , further comprising:
forming a second sealant on the third substrate; and
disposing the second substrate to the third substrate by the second sealant to seal a second space of the second liquid crystal cell between the second substrate and the third substrate, wherein the pre-cutting mark is outside the second space.
9. The method according to claim 8 , further comprising:
forming a second dummy sealant on the third substrate and at a side of the pre-cutting mark opposite to the second sealant; and
disposing the second substrate to the third substrate by the second sealant and the second dummy sealant.
10. The method according to claim 6 , further comprising:
forming a first dye-doped liquid crystal layer between the first substrate and the third substrate; and
forming a second dye-doped liquid crystal layer between the third substrate and the second substrate, wherein the first dye-doped liquid crystal layer and the second dye-doped liquid crystal layer respectively comprise at least a dichroic dye.