IP Library › Granted Patent US 11,988,418
Granted Patent B2
US 11,988,418 · App. 17/944,534 · Granted May 21, 2024

Vapor compression cycle with direct pumped two-phase cooling

Inventors: Joseph E. Turney (Amston, CT); Raphael Mandel (West Hartford, CT); Ram Ranjan (West Hartford, CT)
Assignee: HAMILTON SUNDSTRAND CORPORATION
F25B25/005F25B39/00H05K7/20936B64D2013/0614B64D2013/0618F25B2400/23
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Quick Facts
Patent No.
US 11,988,418
App. No.
17/944,534
Granted
May 21, 2024
Kind
B2
Abstract

Cooling systems include a cold sink thermally coupled to a heat load, a separator configured to separate liquid and vapor portions of a working fluid, and a cooling cycle having a vapor loop and a liquid loop, the cooling cycle having the working fluid configured to pass through both the vapor loop and the liquid loop. The vapor loop includes the separator, a compressor, a condenser, and a valve. A vapor form of the working fluid flows from the separator into the compressor, and the working fluid then flows to the condenser, and then through the valve, and returned to the separator. The liquid loop includes the cold sink, the separator, and a pump. A liquid form of the working fluid flows from the separator into the pump and the working fluid is increased in pressure and supplied to the cold sink and then returned to the separator.

Claims (41)

1. A cooling system comprising:

a cold sink thermally coupled to a heat load;

a separator configured to separate liquid and vapor portions of a working fluid; and

a cooling cycle having a vapor loop and a liquid loop, the cooling cycle having the working fluid configured to pass through both the vapor loop and the liquid loop,

wherein the vapor loop comprises the separator, a compressor, a condenser, and a valve, wherein a vapor form of the working fluid flows from the separator into the compressor, and the working fluid then flows to the condenser, and then through the valve, and returned to the separator; and

wherein the liquid loop comprises the cold sink, the separator, and a pump, wherein a liquid form of the working fluid flows from the separator into the pump and the working fluid is increased in pressure and supplied to the cold sink and then returned to the separator,

wherein the separator is arranged downstream from the cold sink as a downstream separator; and

an upstream separator is arranged upstream from the cold sink and configured to separate liquid and vapor portions of the working fluid, wherein a liquid portion of the working fluid is sourced from the upstream separator and directed into the cold sink.

2. The cooling system of claim 1 , wherein the working fluid is 1,1,1,2-Tetrafluoroethane (R-134a) or 2,3,3,3-Tetrafluoropropene (R-1234yf).

3. The cooling system of claim 1 , wherein the heat load is a power electronics component of an aircraft.

4. The cooling system of claim 1 , wherein the vapor portion and the liquid portion of the working fluid are separated by gravity in the separator.

5. The cooling system of claim 1 , wherein the condenser is fluidically coupled to a ram air duct of an aircraft.

6. The cooling system of claim 1 , further comprising a bypass to direct the vapor portion of the working fluid from the upstream separator to the downstream separator and bypassing the cold sink.

7. The cooling system of claim 6 , further comprising a valve arranged along the bypass.

8. The cooling system of claim 1 , further comprising a heat exchanger configured to receive a portion of the working fluid from the vapor loop output from the condenser as a first fluid and a mixture of fluid from the vapor loop and the liquid loop as a second fluid, wherein the second fluid is cooled to a liquid state as it exits the heat exchanger and enters the cold sink.

9. The cooling system of claim 8 , further comprising a second valve arranged between the condenser and the heat exchanger to change the first fluid from a liquid to a two-phase fluid prior to entering the heat exchanger.

10. The cooling system of claim 8 , wherein the first fluid is changed to a vapor state as it exits the heat exchanger, and wherein the first fluid in vapor form is directed to the separator.

11. The cooling system of claim 8 , further comprising an additional valve arranged between the cold sink and the separator.

12. The cooling system of claim 1 , further comprising a thermal energy storage device arranged along the liquid loop between the cold sink and the separator.

13. The cooling system of claim 12 , further comprising an additional valve arranged between the thermal energy storage device and the separator.

14. An aircraft cooling system comprising:

a heat load; and

a cooling system comprising:

a cold sink thermally coupled to the heat load;

a separator configured to separate liquid and vapor portions of a working fluid; and

a cooling cycle having a vapor loop and a liquid loop, the cooling cycle having the working fluid configured to pass through both the vapor loop and the liquid loop, wherein the vapor loop comprises the separator, a compressor, a condenser, and a valve, wherein a vapor form of the working fluid flows from the separator into the compressor, and the working fluid then flows to the condenser, and then through the valve, and returned to the separator; and

wherein the liquid loop comprises the cold sink, the separator, and a pump, wherein a liquid form of the working fluid flows from the separator into the pump and the working fluid is increased in pressure and supplied to the cold sink and then returned to the separator,

further comprising at least one of:

a thermal energy storage device arranged along the liquid loop between the cold sink and the separator; and

an upstream separator arranged upstream from the cold sink and configured to separate liquid and vapor portions of the working fluid, wherein a liquid portion of the working fluid is sourced from the upstream separator and directed into the cold sink.

15. The aircraft cooling system of claim 14 , wherein the heat load comprises at least one power electronics component of an aircraft.

16. The aircraft cooling system of claim 14 , further comprising a heat exchanger configured to receive a portion of the working fluid from the vapor loop output from the condenser as a first fluid and a mixture of fluid from the vapor loop and the liquid loop as a second fluid, wherein the second fluid is cooled to a liquid state as it exits the heat exchanger and enters the cold sink.

17. The aircraft cooling system of claim 14 , wherein the condenser is fluidically coupled to a ram air duct of an aircraft.

18. The aircraft cooling system of claim 14 , further comprising a bypass to direct the vapor portion of the working fluid from the upstream separator to the downstream separator and bypassing the cold sink.

19. A cooling system comprising:

a cold sink thermally coupled to a heat load;

a separator configured to separate liquid and vapor portions of a working fluid; and

a cooling cycle having a vapor loop and a liquid loop, the cooling cycle having the working fluid configured to pass through both the vapor loop and the liquid loop,

wherein the vapor loop comprises the separator, a compressor, a condenser, and a valve, wherein a vapor form of the working fluid flows from the separator into the compressor, and the working fluid then flows to the condenser, and then through the valve, and returned to the separator; and

wherein the liquid loop comprises the cold sink, the separator, a thermal energy storage device, and a pump, wherein a liquid form of the working fluid flows from the separator into the pump and the working fluid is increased in pressure and supplied to the thermal energy storage device, to cold sink, and then returned to the separator.

20. The cooling system of claim 19 , further comprising an additional valve arranged between the thermal energy storage device and the separator.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 20, 2023
From: RAYTHEON TECHNOLOGIES CORPORATION
To: HAMILTON SUNDSTRAND CORPORATION
Reel/Frame 062439/0513 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2022
From: TURNEY, JOSEPH E.; MANDEL, RAPHAEL; RANJAN, RAM
To: RAYTHEON TECHNOLOGIES CORPORATION
Reel/Frame 061093/0800 →
Continuity (1)
Related Publication 20240085068A1 · Mar 14, 2024
Cited By (2)
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