Semiconductor device having a three-dimensional structure and method for fabricating the same
A method for fabricating a semiconductor device includes: forming a stack body by alternately stacking a plurality of semiconductor layers and a plurality of etch stopper layers over a substrate; forming a plurality of steps by etching a first portion of the stack body to stop at the etch stopper layer; forming a slit by etching a second portion of the stack body; replacing the etch stoppers of the steps with sacrificial dielectric layers through the slit; replacing the sacrificial dielectric layers with word lines; and forming contact plugs coupled to the word lines.
1 . A method for fabricating a semiconductor device, the method comprising:
forming a stack body comprising a plurality of semiconductor layers and a plurality of etch stopper layers over a substrate;
forming a plurality of steps by etching a first portion of the stack body to stop at the etch stopper layers;
forming a slit by etching a second portion of the stack body;
replacing the etch stopper layers of the steps with sacrificial dielectric layers through the slit;
replacing the sacrificial dielectric layers with word lines; and
forming contact plugs coupled to the word lines,
wherein each of the semiconductor layers includes a silicon layer, and each of the etch stopper layers includes a silicon germanium layer.
2 . The method of claim 1 , wherein the sacrificial dielectric layers include silicon nitride.
3 . The method of claim 1 , wherein the semiconductor layers are formed to be thicker than the etch stopper layers.
4 . The method of claim 1 ,
wherein the semiconductor layers include first semiconductor layers and second semiconductor layers that are thicker than the first semiconductor layers, and
wherein the etch stopper layers are disposed between the first semiconductor layers and the second semiconductor layers.
5 . The method of claim 4 , wherein the first semiconductor layers are formed to have a greater thickness than the second semiconductor layers.
6 . The method of claim 4 , wherein the second semiconductor layers are formed to be thicker than the etch stopper layers.
7 . The method of claim 4 , further comprising:
forming a bit line commonly coupled to first ends of the first semiconductor layers and oriented perpendicular to a surface of the substrate; and
forming a capacitor including storage nodes respectively coupled to second ends of the first semiconductor layers.
8 . A method for fabricating a semiconductor device, the method comprising:
forming a stack body by alternately stacking a plurality of silicon germanium layers and a plurality of silicon layers over a lower structure;
forming a plurality of steps by etching a first portion of the stack body;
forming a slit by etching a second portion of the stack body;
replacing the silicon germanium layers of the steps with sacrificial dielectric layers through the slit;
replacing the sacrificial dielectric layers with word lines; and
forming contact plugs that are coupled to the word lines.
9 . The method of claim 8 , wherein each of the silicon layers and the silicon germanium layers is formed by epitaxial growth.
10 . The method of claim 8 ,
wherein the silicon germanium layers and the silicon layers are stacked in an order of a first silicon germanium layer, a first monocrystalline silicon layer, a second silicon germanium layer, and a second monocrystalline silicon layer, and
wherein the first portion of the stack body is etched to stop at the first silicon germanium layer.
11 . The method of claim 8 , wherein each of the steps is stacked in an order of a first monocrystalline silicon layer, a first silicon germanium layer, a second monocrystalline silicon layer, and a second silicon germanium layer, and
the second silicon germanium layer is disposed at an uppermost level of each of the steps.
12 . The method of claim 8 , wherein the silicon layers include a monocrystalline silicon layer.
13 . The method of claim 8 , wherein the silicon layers are formed thicker than the silicon germanium layers.
14 . The method of claim 8 , wherein in the stack body,
the silicon layers include first silicon layers and second silicon layers which are thicker than the first silicon layers, and
the silicon germanium layers are disposed between the first silicon layers and the second silicon layers.
15 . The method of claim 14 , wherein the first silicon layers are formed to be thicker than the second silicon layers.
16 . The method of claim 14 , wherein the second silicon layers are formed to be thicker than the silicon germanium layers.
17 . The method of claim 8 , further comprising:
forming a bit line that is commonly coupled to first ends of the silicon layers and oriented perpendicular to a surface of the substrate; and
forming a capacitor including storage nodes that are respectively coupled to second ends of the silicon layers.
18 . The method of claim 8 , wherein the replacing of the silicon germanium layers of the steps with the sacrificial dielectric layers through the slit includes:
removing the silicon germanium layers to form initial lateral recesses;
selectively recessing the silicon layers through the initial lateral recesses to form thin-body active layers and a lateral recess between the thin-body active layers;
forming the sacrificial dielectric layers inside the lateral recess; and
forming a cell isolation dielectric layer between the sacrificial dielectric layers inside the lateral recess.
19 . The method of claim 18 ,
wherein the sacrificial dielectric layers include silicon nitride, and
wherein the cell isolation dielectric layers include silicon oxide.