Cooling system for electronic modules
A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant. The first cooling circulatory arrangement and the second cooling circulatory arrangement are thermally coupled at least via the heat exchanger, such that heat is transferred from the first liquid coolant to the second liquid coolant via the heat exchanger.
1. A system for cooling a plurality of electronic devices housed in a housing of an electronic module, the system comprising:
a first cooling circulatory arrangement, configured to circulate a first coolant from a first coolant supply between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first coolant such that heat is transferred from the first electronic device to the first coolant; and
a second cooling circulatory arrangement, configured to circulate a second coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second coolant such that heat is transferred from the second electronic device to the second coolant;
wherein the first cooling circulatory arrangement and the second cooling circulatory arrangement are thermally coupled at least via the heat exchanger, such that heat is transferred from the first coolant to the second coolant via the heat exchanger; and
wherein the second cooling circulatory arrangement is connected to a second coolant supply, wherein the second cooling circulatory arrangement is configured to circulate the second coolant received from the second coolant supply between the second electronic device of the plurality of electronic devices and the heat exchanger, and to be returned to the second coolant supply.
2. The system of claim 1 , wherein the second cooling circulatory arrangement further comprises a cooling system, wherein the second cooling circulatory arrangement is configured to circulate the second coolant between the second electronic device of the plurality of electronic devices, the heat exchanger and the cooling system, wherein heat is removed from the second coolant by the cooling system.
3. The system of claim 1 , wherein the heat exchanger comprises at least a first and a second chamber separated by a thermal interface, wherein the heat exchanger is configured for flow of the first coolant through at least the first chamber, and flow of the second coolant through at least the second chamber, such that heat is transferred from the first coolant to the second coolant through the thermal interface.
4. The system of claim 1 wherein the heat exchanger is arranged within the housing of the electronic module.
5. The system of claim 1 , wherein the housing of the electronic module contains the first coolant, and wherein the first electronic device is at least partially immersed in the first coolant.
6. The system of claim 1 , wherein the first cooling circulatory arrangement further comprises:
a pump configured to circulate the first coolant around the first cooling circulatory arrangement.
7. The system of claim 1 , the second cooling circulatory arrangement further comprising a cooling module configured to thermally couple the second electronic device to the second coolant.
8. The system of claim 7 , wherein the cooling module comprises a cold plate, the cold plate comprising:
a cold plate housing, a surface of the cold plate housing being arranged to provide a thermal interface for cooling the second electronic device which is thermally coupled thereto; and
at least one channel within the cold plate housing and proximate to the surface of the cold plate housing, the at least one channel arranged for the second coolant to flow therethough such that heat received from the second electronic device through the surface of the cold plate housing is transferred to the second coolant.
9. The system of claim 8 , the second cooling circulatory arrangement further comprising a plurality of conduits arranged to transport the second coolant between the cold plate, the heat exchanger and the cooling system.
10. A method for cooling a plurality of electronic devices housed in a housing of an electronic module, the method comprising:
circulating a first coolant around a first cooling circulatory arrangement, comprising circulating the first coolant from a first coolant supply between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first coolant such that heat is transferred from the first electronic device to the first coolant; and
circulating a second coolant around a second cooling circulatory arrangement, comprising circulating a second coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second coolant such that heat is transferred from the second electronic device to the second coolant;
wherein the first cooling circulatory arrangement and the second cooling circulatory arrangement are thermally coupled at least via the heat exchanger, such that heat is transferred from the first coolant to the second coolant via the heat exchanger; and
wherein the second cooling circulatory arrangement further comprises a second coolant supply, wherein the circulating the second coolant around the second cooling circulatory arrangement comprises receiving the second coolant from the second coolant supply, circulating the second coolant between the second electronic device of the plurality of electronic devices and the heat exchanger and to be returned to the second coolant supply.
11. The method of claim 10 , wherein the second cooling circulatory arrangement further comprises a cooling system, wherein the circulating the second coolant around the second cooling circulatory arrangement comprises circulating the second coolant between the second electronic device of the plurality of electronic devices, the heat exchanger and the cooling system, where heat is removed from the second coolant by the cooling system.
12. The method of claim 10 , wherein the heat exchanger comprises at least a first and a second chamber separated by a thermal interface, wherein the heat exchanger is configured for flow of the first coolant through at least the first chamber, and flow of the second coolant through at least the second chamber, such that heat is transferred from the first coolant to the second coolant through the thermal interface.
13. The method of claim 10 , wherein the heat exchanger is arranged within the housing of the electronic module.
14. The method of claim 10 , wherein the housing of the electronic module contains the first coolant, and wherein the first electronic device is at least partially immersed in the first coolant.
15. The method of claim 10 , wherein the second cooling circulatory arrangement further comprises a cooling module, configured to thermally couple the second electronic device to the second coolant.
16. The method of claim 10 , wherein the cooling module comprises a cold plate, the cold plate comprising:
a cold plate housing, a surface of the cold plate housing being arranged to provide a thermal interface for cooling the second electronic device which is thermally coupled thereto; and
at least one channel within the cold plate housing and proximate to the surface of the cold plate housing, the at least one channel arranged for the second coolant to flow therethough such that heat received from the second electronic device through the surface of the cold plate housing is transferred to the second coolant.