Thermal interface sandwich
A thermal interface sandwich is disclosed, including: a thermally conductive solid with a first surface and a second surface; a first thermal interface that is applied to the first surface of the thermally conductive solid; and a second thermal interface that is applied to the second surface of the thermally conductive solid.
1. A thermally conductive assembly, comprising:
a thermally conductive solid with a first surface and a second surface;
a first thermal interface that is applied to the first surface of the thermally conductive solid; and
a second thermal interface that is applied to the second surface of the thermally conductive solid;
wherein the thermally conductive solid and the second thermal interface are surrounded by a cavity in a heat sink;
wherein a set of heat generating components are pinned against the first thermal interface by a gantry assembly, wherein the gantry assembly is fastened into the heat sink, wherein the gantry assembly extends over the set of heat generating components, and wherein the gantry assembly pushes a pin against a top surface of a respective heat generating component such that a bottom surface of the respective heat generating component is pushed against the first thermal interface.
2. The thermally conductive assembly of claim 1 , wherein the first thermal interface is adhered to the first surface of the thermally conductive solid.
3. The thermally conductive assembly of claim 1 , wherein the first thermal interface is silk screened to the first surface of the thermally conductive solid.
4. The thermally conductive assembly of claim 1 , wherein the first thermal interface is a thermal paste.
5. The thermally conductive assembly of claim 1 , wherein the first thermal interface is a phase-change material.
6. The thermally conductive assembly of claim 1 , wherein the thermally conductive solid comprises aluminum nitride.
7. The thermally conductive assembly of claim 1 , wherein the thermally conductive solid comprises diamond.
8. The thermally conductive assembly of claim 1 , wherein the thermally conductive solid comprises aluminum beryllium oxide.
9. The thermally conductive assembly of claim 1 , wherein the second thermal interface is configured to be in direct contact with the heat sink.
10. The thermally conductive assembly of claim 9 , wherein the heat sink is made of metal.
11. The thermally conductive assembly of claim 1 , wherein the first thermal interface is configured to be in contact with the bottom surface of the respective heat generating component.
12. The thermally conductive assembly of claim 10 , wherein the metal is aluminum.