Liquid immersion cooling tank with variable flow for high density computer server equipment
An immersion cooling system includes an electronic component, a thermally conductive dielectric liquid, and a tank defining a tank interior configured to receive the electronic component and the thermally conductive dielectric liquid for cooling the electronic component. The immersion cooling system also includes a wall positioned external to the tank to coordinate with the tank to define an overflow gap extending between the tank and the wall. The overflow gap is configured to receive an overflow of the thermally conductive dielectric liquid from the tank interior.
1. A method of cooling an electronic component via an immersion cooling system, comprising:
receiving, via a controller and from at least one sensor, sensor data indicative of at least one ambient or operating condition associated with the immersion cooling system;
controlling, via the controller and based on the sensor data, a fan speed of a fan of a heat exchanger configured to receive a thermally conductive dielectric liquid, cool the thermally conductive dielectric liquid, and output the thermally conductive dielectric liquid;
distributing the thermally conductive dielectric liquid to a tank interior of a tank;
cooling the electronic component inside of the tank interior with the thermally conductive dielectric liquid; and
passing an overflow of the thermally conductive dielectric liquid over an edge of an upper side of the tank opposing a bottom side of the tank and into an overflow gap positioned between the tank and a wall disposed external to the tank.
2. The method of claim 1 , comprising cooling the electronic component inside of the tank interior with the thermally conductive dielectric liquid, such that the thermally conductive dielectric liquid is heated by the electronic component and flows through the tank interior in an upwards direction relative to a gravity vector; and
passing the overflow of the thermally conductive dielectric liquid over the edge of the upper side of the tank opposing the bottom side of the tank and into the overflow gap positioned between the tank and the wall disposed external to the tank, such that the thermally conductive dielectric liquid flows through the overflow gap in a downwards direction relative to the gravity vector, the downwards direction opposing the upwards direction.
3. The method of claim 1 , wherein the sensor data indicative of the at least one ambient or operating condition associated with the immersion cooling system comprises data indicative of an ambient temperature.
4. The method of claim 1 , wherein the sensor data indicative of the at least one ambient or operating condition associated with the immersion cooling system comprises data indicative of a temperature of the thermally conductive dielectric liquid.
5. The method of claim 1 , wherein the sensor data indicative of the at least one ambient or operating condition associated with the immersion cooling system comprises data indicative of a liquid level of the thermally conductive dielectric liquid within the tank interior or the overflow gap.
6. The method of claim 1 , wherein the sensor data indicative of the at least one ambient or operating condition associated with the immersion cooling system comprises data indicative of a fluid pressure or a flow rate of the thermally conductive dielectric) liquid.
7. The method of claim 1 , comprising:
determining, via the controller and based on additional sensor data indicative of at least one additional ambient or operating condition associated with the immersion cooling system, that circulation of the thermally conductive dielectric liquid through the immersion cooling system can be enabled via natural convection; and
disabling, via the controller, a pump configured to circulate the thermally conductive dielectric liquid through the immersion cooling system in response to determining that the circulation of the thermally conductive dielectric liquid through the immersion cooling system can be enabled via the natural convection.
8. The method of claim 1 , comprising controlling, via the controller and based on the sensor data, a speed of a pump configured to circulate the thermally conductive dielectric liquid through the immersion cooling system.
9. The method of claim 1 , wherein the sensor data indicative of the at least one ambient or operating condition associated with the immersion cooling system comprises data indicative of a plurality of conditions, the plurality of conditions comprising;
an ambient temperature;
a temperature of the thermally conductive dielectric liquid;
a fluid pressure or flow rate of the thermally conductive dielectric liquid;
a first liquid level of the thermally conductive dielectric liquid within the tank interior; and
a second liquid level of the thermally conductive dielectric liquid within the overflow gap.
10. A method of cooling an electronic component via an immersion cooling system, comprising:
receiving, via a controller and from at least one sensor, sensor data indicative of at least one ambient or operating condition associated with the immersion cooling system;
controlling, via the controller and based on the sensor data, a fan speed of a fan of a heat exchanger configured to receive a thermally conductive dielectric liquid, cool the thermally conductive dielectric liquid, and output the thermally conductive dielectric liquid;
distributing the thermally conductive dielectric liquid through perforations of a perforated plate and into a tank interior of a tank; and
cooling the electronic component inside of the tank interior with the thermally conductive dielectric liquid.
11. The method of claim 10 , comprising controlling, via the controller and based on the sensor data, a speed of a pump configured to circulate the the thermally conductive dielectric liquid through the immersion cooling system.
12. The method of claim 10 , wherein the sensor data indicative of the at least one ambient or operating condition associated with the immersion cooling system comprises data indicative of a plurality of conditions, the plurality of conditions comprising:
an ambient temperature;
a temperature of the thermally conductive dielectric liquid;
a flow rate or a fluid pressure of the thermally conductive dielectric liquid;
a first liquid level of the thermally conductive dielectric liquid in the tank interior; and
a second liquid level of the thermally conductive dielectric liquid in an overflow gap configured to receive an overflow of the thermally conductive dielectric liquid from the tank interior.
13. The method of claim 10 , wherein the sensor data indicative of the at least one ambient or operating condition comprises data indicative of an ambient temperature.
14. A method of cooling an electronic component via an immersion cooling system, comprising:
receiving, via a controller and from at least one sensor, sensor data indicative of at least one ambient or operating condition associated with the immersion cooling system;
changing, via the controller and based on the sensor data, a fan speed of a fan of a heat exchanger configured to receive a thermally conductive dielectric liquid, cool the thermally conductive dielectric liquid, and output the thermally conductive dielectric liquid from a first speed to a second speed;
distributing the thermally conductive dielectric liquid through perforations of a perforated plate and into a tank interior of a tank;
cooling the electronic component inside of the tank interior with the thermally conductive dielectric liquid; and
passing an overflow of the thermally conductive dielectric liquid over an edge of an upper side of the tank and into an overflow gap positioned between the tank and a wall disposed external to the tank.
15. The method of claim 14 , comprising controlling, via the controller and based on the sensor data, a speed of a pump configured to circulate the thermally conductive dielectric liquid through the immersion cooling system.
16. The method of claim 14 , wherein the sensor data indicative of the at least one ambient or operating condition associated with the immersion cooling system comprises data indicative of a plurality of conditions, the plurality of conditions comprising:
an ambient temperature;
a temperature of the thermally conductive dielectric liquid;
a flow rate or a fluid pressure of the thermally conductive dielectric liquid;
a first liquid level of the thermally conductive dielectric liquid in the tank interior; and
a second liquid level of the thermally conductive dielectric liquid in the overflow gap.
17. The method of claim 14 , wherein the sensor data indicative of the at least one ambient or operating condition associated with the immersion cooling system comprises data indicative of an ambient temperature.
18. The method of claim 14 , wherein the sensor data indicative of the at least one ambient or operating condition associated with the immersion cooling system comprises data indicative of a temperature of the thermally conductive dielectric liquid.
19. The method of claim 14 , wherein the sensor data indicative of the at least one ambient or operating condition associated with the immersion cooling system comprises data indicative of a flow rate or a fluid pressure of the thermally conductive dielectric liquid.
20. The method of claim 14 , wherein the sensor data indicative of the at least one ambient or operating condition associated with the immersion cooling system comprises data indicative of a liquid level of the thermally conductive dielectric liquid in the tank interior or the overflow gap.