Electronic device
The present disclosure provides an electronic device including a first substrate, a second substrate, a first demultiplexer unit, an integrated circuit chip, a sensor unit and a second demultiplexer unit. The second substrate is overlapped with the first substrate. The first demultiplexer unit is disposed on the first substrate. The integrated circuit chip is disposed on the first substrate and electrically connected to the first demultiplexer unit. The sensor unit is disposed on the second substrate. The second demultiplexer unit is disposed on the second substrate and electrically connected to the sensor unit.
1. An electronic device, comprising:
a first substrate;
a second substrate overlapped with the first substrate along a direction;
a first demultiplexer unit disposed on the first substrate;
an integrated circuit chip disposed on the first substrate and electrically connected to the first demultiplexer unit, wherein the integrated circuit chip is overlapped with the second substrate along the direction;
a sensor unit; and
a second demultiplexer unit electrically connected to the sensor unit,
wherein the first demultiplexer unit and the second demultiplexer unit are respectively corresponded to opposite sides of the second substrate, the second substrate is disposed between the first demultiplexer unit and second demultiplexer unit along the direction, and the integrated circuit chip and the sensor unit are respectively corresponded to opposite sides of the second substrate.
2. The electronic device according to claim 1 , further comprising a display unit disposed on the first substrate.
3. The electronic device according to claim 2 , wherein the display unit is electrically connected to the first demultiplexer unit.
4. The electronic device according to claim 2 , further comprising M1 data lines electrically connected between the display unit and the first demultiplexer unit, wherein M1 is a natural number.
5. The electronic device according to claim 4 , wherein the M1 data lines are disposed on the first substrate.
6. The electronic device according to claim 4 , further comprising N1 signal lines electrically connected between the integrated circuit chip and the first demultiplexer unit, wherein N1 is a natural number.
7. The electronic device according to claim 6 , wherein M1 is greater than N1.
8. The electronic device according to claim 6 , wherein the M1 data lines and the N1 signal lines are disposed on the first substrate.
9. The electronic device according to claim 4 , further comprising M2 sensing lines electrically connected between the sensor unit and the second demultiplexer unit, wherein M2 is a natural number.
10. The electronic device according to claim 9 , wherein M1 is greater than M2.
11. The electronic device according to claim 2 , wherein the display unit comprises a plurality of organic light-emitting diode display units.
12. The electronic device according to claim 2 , wherein an area of the sensor unit is less than an area of the display unit.
13. The electronic device according to claim 1 , wherein the sensor unit comprises a plurality of optical sensors.
14. The electronic device according to claim 1 , further comprising an active region, wherein the first demultiplexer unit and the second demultiplexer unit are disposed on a same side of the active region.
15. The electronic device according to claim 1 , further comprising a liquid crystal layer disposed between the first substrate and the second substrate.