RECORDING COMPONENT DATA
Data associated with an electronics component within a placement process performed by a placement machine is recorded by using the camera to image a machine-readable code located on the component tape which expresses data associated with an electronics component to be picked up by the placement head. The camera could be located within the feeder or the placement head.
1 . A feeder for a placement machine, the feeder adapted to feed a component tape housing electronics components to a presentation area of the feeder, the placement machine being operative to pick electronics components from the component tape in the vicinity of the presentation area and place the picked components onto a workpiece, wherein the feeder comprises a camera for imaging machine-readable codes located on the component tape.
2 . The feeder of claim 1 , wherein the component tape is stored on a component tape reel, and the feeder comprises a tape guide for guiding the component tape from the component tape reel to the presentation area.
3 . The feeder of claim 2 , comprising a reel mount for receiving the component tape reel.
4 . The feeder of claim 2 , comprising an interface for connection to a cartridge in use, the cartridge comprising a reel mount for receiving the component tape reel.
5 . The feeder of claim 2 , wherein the camera is located in the feeder to image machine-readable codes located on the component tape adjacent the tape guide.
6 . The feeder of claim 1 , comprising an illumination device for illuminating the machine-readable codes during imaging.
7 . The feeder of claim 1 , wherein the camera comprises a nano camera sensor.
8 . A placement machine fitted with the feeder of claim 1 .
9 . A placement head for a placement machine, the placement machine being operative to pick electronics components with the placement head from a component tape in the vicinity of a presentation area of a feeder and place the picked components onto a workpiece, wherein the placement head comprises a camera for imaging machine-readable codes located on the component tape.
10 . The placement head of claim 9 , wherein the camera is disposed in a downwardly-pointing orientation so as to image the machine-readable codes from above.
11 . The placement head of claim 10 , comprising a component holding tool adapted to selectively hold an electronics component, and wherein the camera is horizontally spaced from the component holding tool.
12 . The placement head of claim 11 , wherein the camera is horizontally spaced from the component holding tool such that, during a pick-up operation in which the component holding tool picks up an electronics component from a pocket of the component tape, the camera is positioned directly above a machine-readable code associated with the electronics component being picked up by the component holding tool.
13 . The placement head of claim 9 , wherein the camera comprises a nano camera sensor.
14 . A placement machine fitted with the placement head of claim 9 .
15 . A method of recording data associated with an electronics component within a placement process performed by a placement machine, comprising the steps of:
providing a feeder adapted to feed a component tape which houses electronics components to a presentation area of the feeder,
providing a placement head within the placement machine, the placement head being operative to pick up electronics components from the component tape in the vicinity of the presentation area,
providing a camera within the placement machine, and
using the camera to image a machine-readable code located on the component tape which expresses data associated with an electronics component to be picked up by the placement head.
16 . The method of claim 15 , wherein the camera is located on the feeder.
17 . The method of claim 15 , wherein the camera is located on the placement head.