Vapor chamber, housing assembly and electronic device
A vapor chamber includes: a body, including an accommodating cavity; a wick structure layer, located in the accommodating cavity; and a wick structure channel, located in the accommodating cavity. The wick structure channel is at least partially located outside the wick structure layer; or, the wick structure channel is located in the wick structure layer, and fluid resistance of the wick structure channel is smaller than fluid resistance of the wick structure layer.
1 . A vapor chamber, comprising:
a body comprising an accommodating cavity;
a wick structure layer located in the accommodating cavity; and
a wick structure channel located in the accommodating cavity;
wherein the wick structure channel is located in the wick structure layer, and fluid resistance of the wick structure channel is smaller than fluid resistance of the wick structure layer, and the wick structure layer has an accommodating region for accommodating the wick structure channel;
wherein the accommodating cavity has a second inner wall surface, the wick structure layer is attached to the second inner wall surface, the wick structure channel is constructed as a grooved wick structure located in the second inner wall surface, and the accommodating region is defined by a groove recessed within the wick structure layer, wherein the groove runs through the wick structure layer along a thickness direction of the wick structure layer, the wick structure channel is inserted into the groove, and a thickness of the wick structure channel is equal to a thickness of the wick structure layer.
2 . The vapor chamber according to claim 1 , wherein the wick structure layer comprises an evaporation region, and the wick structure channel extends from the evaporation region in a direction away from the evaporation region.
3 . The vapor chamber according to claim 2 , wherein the wick structure layer comprises a condensation region, the wick structure channel extends from the evaporation region to the condensation region, a first fluid space extending from the evaporation region to the condensation region is located in the wick structure layer, and the first fluid space is at least used for circulation of a gaseous medium.
4 . The vapor chamber according to claim 3 , wherein a plurality of the first fluid spaces is arranged at intervals;
wherein the plurality of the first fluid spaces are located between two of the wick structure channels.
5 . The vapor chamber according to claim 1 , wherein the accommodating cavity has a first inner wall surface and the second inner wall surface opposite to each other, a second fluid space at least used for circulation of a gaseous medium is located between the wick structure layer and the first inner wall surface, and a side, facing away from the second fluid space, of the wick structure layer is attached to the second inner wall surface.
6 . The vapor chamber according to claim 5 , wherein the wick structure channel is located on the first inner wall surface, and a side, facing away from the first inner wall surface, of the wick structure channel is attached to the wick structure layer or penetrates through the wick structure layer.
7 . The vapor chamber according to claim 6 , wherein
the wick structure channel is constructed the same as a wick structure of the wick structure layer.
8 . The vapor chamber according to claim 1 , wherein the accommodating cavity has a first inner wall surface and the second inner wall surface opposite to each other, two opposite sides of the wick structure layer are attached to the first inner wall surface and the second inner wall surface respectively.
9 . A housing assembly, comprising:
a vapor chamber, comprising:
a body comprising an accommodating cavity;
a wick structure layer located in the accommodating cavity;
a wick structure channel located in the accommodating cavity;
wherein the wick structure channel is located in the wick structure layer, and fluid resistance of the wick structure channel is smaller than fluid resistance of the wick structure layer, and the wick structure layer has an accommodating region for accommodating the wick structure channel, the accommodating cavity has a second inner wall surface, the wick structure layer is attached to the second inner wall surface, the wick structure channel is constructed as a grooved wick structure located in the second inner wall surface, and the accommodating region is defined by a groove recessed within the wick structure layer, the wick structure channel is inserted into the groove; and
a housing body comprising a mounting groove, wherein the vapor chamber is at least partially located in the mounting groove.
10 . The housing assembly according to claim 9 , wherein the wick structure layer comprises an evaporation region, and the wick structure channel extends from the evaporation region in a direction away from the evaporation region.
11 . The housing assembly according to claim 10 , wherein the wick structure layer comprises a condensation region, the wick structure channel extends from the evaporation region to the condensation region, a first fluid space extending from the evaporation region to the condensation region is located in the wick structure layer, and the first fluid space is at least used for circulation of a gaseous medium.
12 . The housing assembly according to claim 9 , wherein the accommodating cavity has a first inner wall surface and the second inner wall surface opposite to each other, a second fluid space at least used for circulation of a gaseous medium is located between the wick structure layer and the first inner wall surface, and a side, facing away from the second fluid space, of the wick structure layer is attached to the second inner wall surface.
13 . The housing assembly according to claim 12 , wherein the wick structure channel is located on the first inner wall surface, and a side, facing away from the first inner wall surface, of the wick structure channel is attached to the wick structure layer or penetrates through the wick structure layer; or,
the wick structure channel is constructed the same as a wick structure of the wick structure layer.
14 . The housing assembly according to claim 9 , wherein the accommodating cavity has a first inner wall surface and the second inner wall surface opposite to each other, two opposite sides of the wick structure layer are attached to the first inner wall surface and the second inner wall surface respectively.
15 . The housing assembly according to claim 9 , wherein the housing body comprises a middle frame, a first side of the middle frame is used for disposing a heat source element, and the mounting groove is located in a second side, opposite to the first side, of the middle frame.
16 . The housing assembly according to claim 9 , wherein the housing body comprises a rear cover, and the mounting groove is disposed in an inner wall surface of the rear cover.
17 . An electronic device, comprising a housing assembly, wherein the housing assembly comprises:
a vapor chamber, comprising:
a body comprising an accommodating cavity;
a wick structure layer located in the accommodating cavity;
a wick structure channel located in the accommodating cavity;
wherein the wick structure channel is located in the wick structure layer, and fluid resistance of the wick structure channel is smaller than fluid resistance of the wick structure layer, and the wick structure layer has an accommodating region for accommodating the wick structure channel, the accommodating cavity has a second inner wall surface, the wick structure layer is attached to the second inner wall surface, the wick structure channel is constructed as a grooved wick structure located in the second inner wall surface, and the accommodating region is defined by a groove recessed within the wick structure layer, the wick structure channel is inserted into the groove; and
a housing body comprising a mounting groove, wherein the vapor chamber is at least partially located in the mounting groove.