Biocompatible electromechanical connection for ceramic substrate electronics for biomedical implant

1. A biocompatible electrical connector, comprising:

a substrate comprising a ceramic material;

a ferrule comprising a concentric flange at a first end of the ferrule;

a first adhesive; and

a second adhesive,

wherein:

the first adhesive adheres a first surface of the concentric flange of the ferrule to a surface of the substrate,

the second adhesive fills an annular space between a hole in the substrate and the ferrule, and

the first adhesive or the second adhesive forms a conductive path on the surface of the substrate between the ferrule and a circuit pattern formed directly on the substrate.

2. The biocompatible electrical connector of claim 1 , wherein the first adhesive and the second adhesive comprise one of a platinum-gold ink or a gold ink or a combination thereof.

3. The biocompatible electrical connector of claim 1 , wherein the conductive path is screen-printed on the surface of the substrate.

4. The biocompatible electrical connector of claim 1 , wherein the ferrule comprises one of a platinum-iridium (Pt—Ir) material or an implant grade stainless steel.

5. A method for forming a biocompatible electrical connection, the method comprising:

applying a first adhesive on a surface of a substrate around a circumference of a hole in the substrate, wherein the substrate comprises a ceramic material;

inserting a ferrule comprising a concentric flange at a first end into the hole, wherein the first adhesive adheres a first surface of the concentric flange to the surface of the substrate;

filling an annular space between the hole and the ferrule with a second adhesive; and

forming a conductive path between the ferrule and a circuit pattern formed directly on the surface of the substrate using the first adhesive or the second adhesive.

6. The method of claim 5 , wherein the first adhesive and the second adhesive comprise one of a platinum-gold ink or a gold ink or a combination thereof.

7. The method of claim 5 , further comprising screen-printing the conductive path on the surface of the substrate.

8. The method of claim 5 , wherein the ferrule comprises one of a platinum-iridium (Pt—Ir) material or an implant grade stainless steel.

9. A biocompatible device, comprising:

electronic circuitry enclosed in a conductive biocompatible housing;

a biocompatible antenna disposed external to the conductive biocompatible housing and electrically connected to the electronic circuitry; and

a biocompatible electrical connector configured to electrically connect the biocompatible antenna to the electronic circuitry,

wherein the biocompatible electrical connector comprises:

a ferrule having a concentric flange at a first end of the ferrule;

a first adhesive;

a second adhesive; and

a substrate comprising a ceramic material,

wherein the first adhesive adheres a first surface of the concentric flange of the ferrule to a surface of the substrate,

wherein the second adhesive fills an annular space between a hole in the substrate and the ferrule, and

the first adhesive or the second adhesive forms a conductive path on the surface of the substrate between the ferrule and a circuit pattern formed directly on the substrate.

10. The biocompatible device of claim 9 , wherein the first adhesive and the second adhesive comprise one of a platinum-gold ink or a gold ink or a combination thereof.

11. The biocompatible device of claim 9 , wherein the conductive path is screen-printed on the surface of the substrate.

12. The biocompatible device of claim 9 , wherein the ferrule comprises one of a platinum-iridium (Pt—Ir) material or an implant grade stainless steel.