IP Library › Granted Patent US 12,191,585
Granted Patent B2
US 12,191,585 · App. 17/981,580 · Granted Jan 7, 2025

Antenna package and image display device including the same

Inventors: Byung Jin Choi (Incheon, KR); Ho Dong Yoon (Gyeonggido, KR); Won Hee Lee (Incheon, KR); Won Bin Hong (Seoul, KR)
Assignees: DONGWOO FINE-CHEM CO., LTD.; POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION
H01Q9/045H01Q1/243H01Q1/48H01Q21/08
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Quick Facts
Patent No.
US 12,191,585
App. No.
17/981,580
Granted
Jan 7, 2025
Kind
B2
Abstract

An antenna package according to an embodiment includes an antenna unit, and a circuit board electrically connected to the antenna unit. The circuit board may include a core layer, a signal transmission wiring disposed on one surface of the core layer, the signal transmission wiring having one end portion connected to the antenna unit, a ground layer disposed on an opposite surface facing the one surface of the core layer, and a first via structure formed through the core layer and arranged around the one end portion of the signal transmission wiring to be in contact with the ground layer.

Claims (26)

1. An antenna package, comprising:

an antenna unit; and

a circuit board electrically connected to the antenna unit, the circuit board comprising:

a core layer;

a signal transmission wiring disposed on one surface of the core layer, the signal transmission wiring having one end portion connected to the antenna unit;

a ground layer disposed on an opposite surface facing the one surface of the core layer;

a first via structure formed through the core layer and arranged around the one end portion of the signal transmission wiring to be in contact with the ground layer; and

a ground pattern disposed around an opposite end portion of the signal transmission wiring on the one surface of the core layer.

2. The antenna package of claim 1 , wherein the circuit board further comprises a bonding pattern disposed around the one end portion of the signal transmission wiring on the one surface of the core layer.

3. The antenna package of claim 2 , wherein the first via structure contacts the bonding pattern and the ground layer.

4. The antenna package of claim 2 , wherein the antenna unit comprises a plurality of antenna units arranged in a width direction, and the signal transmission wiring comprises a plurality of signal transmission wirings, each of which is connected to each of the antenna units.

5. The antenna package of claim 4 , wherein the bonding pattern comprises a plurality of bonding patterns arranged along the width direction to be spaced apart from the signal transmission wirings; and

the first via structure comprises a plurality of first via structures in contact with the bonding patterns, and the plurality of first via structures are arranged along the width direction to form a first via row.

6. The antenna package of claim 2 , wherein the antenna unit comprises a radiator, a transmission line extending from the radiator, a signal pad formed at a terminal end of the transmission line, and an antenna ground pad disposed around the signal pad; and

the signal transmission wiring is electrically connected to the signal pad, and the bonding pattern is electrically connected to the antenna ground pad.

7. The antenna package of claim 1 , wherein the circuit board further comprises second via structures arranged around the signal transmission wiring, and the second via structures are formed through the core layer to be in contact with the ground layer.

8. The antenna package of claim 7 , wherein the second via structures are arranged along an extension direction of the signal transmission wiring to form second via columns, and

wherein the signal transmission wiring comprises a plurality of signal transmission wirings and the second via columns are disposed between the plurality of signal transmission wirings.

9. The antenna package of claim 1 , wherein the circuit board further comprises a third via structure formed through the core layer to be in contact with the ground pattern and the ground layer.

10. The antenna package of claim 9 , wherein the third via structure comprises a plurality of third via structures arranged along an extension direction of the signal transmission wiring or the ground pattern to form a third via column.

11. The antenna package of claim 10 , wherein the third via column comprises a plurality of third via columns, and the signal transmission wiring comprises a plurality of signal transmission wirings; and

the plurality of third via columns are disposed between the plurality of signal transmission wirings.

12. The antenna package of claim 1 , further comprising an antenna driving integrated circuit chip electrically connected to an opposite end portion of the signal transmission wiring.

13. The antenna package of claim 12 , further comprising an intermediate circuit board disposed between the opposite end portion of the signal transmission wiring and the antenna driving integrated circuit chip.

14. The antenna package of claim 13 , wherein the circuit board includes a flexible printed circuit board, and the intermediate circuit board includes a rigid printed circuit board.

15. An image display device comprising the antenna package of claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2022
From: CHOI, BYUNG JIN; YOON, HO DONG; LEE, WON HEE; HONG, WON BIN
To: DONGWOO FINE-CHEM CO., LTD.; POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION
Reel/Frame 061672/0288 →
Priority Claims (1)
KR 10-2020-0054546 · May 7, 2020 · national
Continuity (2)
Continuation PCTKR2021005637 · May 6, 2021
Related Publication 20230058014A1 · Feb 23, 2023
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