IP Library Granted Patent US 12,377,455
Granted Patent B2
US 12,377,455 · App. 17/984,144 · Granted Aug 5, 2025

Functionally graded coatings and claddings

Inventors: Vineet V. Joshi (Richland, WA); Glenn J. Grant (Benton City, WA); Curt A. Lavender (Richland, WA); Scott A. Whalen (West Richland, WA); Saumyadeep Jana (Kennewick, WA); David Catalini (Hyattsville, MD); Jens T. Darsell (West Richland, WA)
Assignee: Battelle Memorial Institute
B21C23/002B21C23/04B21C23/217B21C23/218B21C23/22B21C25/02B21C27/02B21C29/003
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,377,455
App. No.
17/984,144
Granted
Aug 5, 2025
Kind
B2
Abstract

A shear assisted extrusion process for producing cladded materials wherein a cladding material and a material to be cladded are placed in sequence with the cladded material positioned to contact a rotating scroll face first and the material to be cladded second. The two materials are fed through a shear assisted extrusion device at a preselected feed rate and impacted by a rotating scroll face to generate a cladded extrusion product. This process allows for increased through wall strength and decreases the brittleness in formed structures as compared to the prior art.

Claims (29)

1. An extrusion process comprising:

simultaneously providing a rotational shearing force and an axial extrusion force between a spiral-scroll-faced extrusion die and one end of a billet positioned within a rotating container and in contact with a scroll face of the spiral-scroll-faced extrusion die, the scroll face comprising spiral scroll features to plasticize the one end of the billet;

wherein the spiral scroll features of the spiral-scroll-faced extrusion die are configured to convey plasticized billet material from an outer edge of the scroll face of the spiral-scroll-faced extrusion die through an orifice within the spiral scroll features of the spiral-scroll-faced extrusion die as the spiral-scroll-faced extrusion die is rotated to form an extrusion product.

2. The process of claim 1 wherein extrusion of the plasticized billet material is performed at a temperature less than 100° C.

3. The process of claim 1 wherein the axial extrusion force is at or below 100 MPa.

4. The process of claim 1 wherein the billet comprises the one end of the billet and a remainder of the billet, the remainder of the billet being at or below ambient temperature during the extrusion process.

5. The process of claim 1 wherein the billet is heated at the one end when providing the rotational shearing force and the axial extrusion force between the one end of the billet and the scroll face of the spiral-scroll faced extrusion die.

6. The process of claim 1 wherein the spiral scroll features of the spiral-scroll-faced extrusion die defines between 2 and 16 spiral starts.

7. The process of claim 1 wherein the orifice of the spiral-scroll-faced extrusion die is configured to receive a mandrel, the plasticized billet material being conveyed between an exterior of the mandrel and an interior of the orifice.

8. The process of claim 7 wherein the billet is configured with an opening configured to receive the mandrel.

9. The process of claim 8 wherein the mandrel is a chilled mandrel.

10. The process of claim 8 wherein the billet comprises at least two different materials.

11. The process of claim 1 wherein the billet is not heated prior to the extrusion.

12. The process of claim 1 wherein a size of microstructure grains of the extrusion product are less than a size of microstructure grains of the billet.

13. The process of claim 12 wherein the size of the microstructure grains of the extrusion product are approximately one-half the size of the microstructure grains of the billet prior to providing the rotational shearing force and the axial extrusion force.

14. A device for performing shear-assisted extrusion, the device comprising:

a die tool defining a scroll face, the scroll face comprising spiral scroll features and an orifice within the spiral scroll features;

a rotating container configured to hold and position a billet within the rotating container; and

at least one actuator to establish a rotational shearing force and an axial extrusion force between the die tool and an end of the billet positioned in the rotating container and in contact with the scroll face by establishing rotation of the rotating container relative to the die tool;

wherein the spiral scroll features are configured to plasticize the end of the billet as the die tool is rotated to allow the die tool to extrude plasticized billet material through the orifice to form an extrusion product.

15. The device of claim 14 , wherein the spiral scroll features are configured to convey the plasticized end of the billet from an outer edge of the scroll face of the die tool toward the orifice within the spiral scroll features of the die tool as the die tool is rotated.

16. The device of claim 15 , wherein the die tool is configured to move plasticized billet material through the orifice surrounded by the spiral scroll features.

17. An extrusion process comprising:

simultaneously providing a rotational shearing force and an axial extrusion force at an interface between a spiral-scroll-faced extrusion die and one end of a billet positioned within a rotating container and in contact with a scroll face of the spiral-scroll-faced extrusion die, the scroll face comprising spiral scroll features to plasticize the one end of the billet;

wherein the spiral scroll features of the spiral-scroll-faced extrusion die are configured to engage and move plasticized billet material toward an orifice at which the spiral scroll features terminate, from an outer edge of the scroll face of the spiral-scroll-faced extrusion die through the orifice as the spiral-scroll-faced extrusion die is rotated to form an extrusion product; and

wherein the billet is at or below ambient temperature prior to extrusion.

18. The extrusion process of claim 17 wherein a grain size of the extrusion product is relatively constant throughout a wall thickness of the extrusion product.

19. The extrusion process of claim 18 wherein a grain refinement of the extrusion product is from approximately 1 mm to approximately 4 microns.

20. The extrusion process of claim 18 wherein a texture throughout the wall thickness of the extrusion product is variable.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 9, 2023
From: JOSHI, VINEET V.; GRANT, GLENN J.; LAVENDER, CURT A.; WHALEN, SCOTT A.; JANA, SAUMYADEEP; CATALINI, DAVID; DARSELL, JENS T.
To: BATTELLE MEMORIAL INSTITUTE
Reel/Frame 064536/0643 →
Continuity (8)
Continuation 16916548 · Jun 30, 2020
Continuation 15898515 · Feb 17, 2018
Continuation In Part 15351201 · Nov 14, 2016
Continuation In Part 14222468 · Mar 21, 2014
Provisional Application 62460227 · Feb 17, 2017
Provisional Application 62313500 · Mar 25, 2016
Provisional Application 61804560 · Mar 22, 2013
Related Publication 20230088412A1 · Mar 23, 2023
References Cited (302)
US 3432369A · Naastepad · 1969 [cited by applicant]
US 3640657A · Rowe et al. · 1972 [cited by applicant]
US 3661726A · Denes · 1972 [cited by applicant]
US 3684593A · Benz et al. · 1972 [cited by applicant]
US 3884062A · Green · 1975 [cited by applicant]
US 3892603A · Reid · 1975 [cited by applicant]
US 3933536A · Doser et al. · 1976 [cited by applicant]
US 3977918A · Paladino et al. · 1976 [cited by applicant]
US 3989548A · Morris · 1976 [cited by applicant]
US 4287749A · Bachrach et al. · 1981 [cited by applicant]
US 4300378A · Thiruvarudchelvan · 1981 [cited by applicant]
US 4431467A · Staley et al. · 1984 [cited by applicant]
US 4585473A · Narasimhan et al. · 1986 [cited by applicant]
US 4778542A · Clemens · 1988 [cited by applicant]
US 4801340A · Inoue et al. · 1989 [cited by applicant]
US 4808224A · Anderson et al. · 1989 [cited by applicant]
US 4892596A · Chatterjee · 1990 [cited by applicant]
US 4985085A · Chatterjee · 1991 [cited by applicant]
US 5026438A · Young et al. · 1991 [cited by applicant]
US 5089060A · Bradley et al. · 1992 [cited by applicant]
US 5226989A · Sukonnik · 1993 [cited by applicant]
US 5242508A · McCallum et al. · 1993 [cited by applicant]
US 5262123A · Thomas et al. · 1993 [cited by applicant]
US 5283130A · Bradley et al. · 1994 [cited by applicant]
US 5437545A · Hirai · 1995 [cited by applicant]
US 5461898A · Lessen · 1995 [cited by applicant]
US 5470401A · McCallum et al. · 1995 [cited by applicant]
US 5492264A · Wadleigh · 1996 [cited by applicant]
US 5737959A · Korbel et al. · 1998 [cited by applicant]
US 5739498A · Sunamoto et al. · 1998 [cited by applicant]
US 5964117A · Holroyd et al. · 1999 [cited by applicant]
US 5988484A · Osborn et al. · 1999 [cited by applicant]
US 6022424A · Sellers et al. · 2000 [cited by applicant]
US 6036467A · Jameson · 2000 [cited by applicant]
US 6638462B2 · Davidson et al. · 2003 [cited by applicant]
US 6843405B2 · Okamoto et al. · 2005 [cited by applicant]
US 6940379B2 · Creighton · 2005 [cited by applicant]
US 7096705B2 · Segal · 2006 [cited by applicant]
US 7314670B2 · Bartsch et al. · 2008 [cited by applicant]
US 7322508B2 · Chang · 2008 [cited by applicant]
US 7954692B2 · Fukuda · 2011 [cited by applicant]
US 8016179B2 · Burford · 2011 [cited by applicant]
US 8240540B2 · Tanaka et al. · 2012 [cited by applicant]
US 8313692B2 · Somekawa et al. · 2012 [cited by applicant]
US 8695868B2 · Messer et al. · 2014 [cited by applicant]
US 10189063B2 · Lavender et al. · 2019 [cited by applicant]
US 10369748B2 · Whalen et al. · 2019 [cited by applicant]
US 10695811B2 · Joshi et al. · 2020 [cited by applicant]
US 10987754B1 · Eller et al. · 2021 [cited by applicant]
US 11045851B2 · Joshi et al. · 2021 [cited by applicant]
US 20020029601A1 · Kwok · 2002 [cited by applicant]
US 20040057782A1 · Okamoto et al. · 2004 [cited by applicant]
US 20040238501A1 · Kawazoe et al. · 2004 [cited by applicant]
US 20040265503A1 · Clayton et al. · 2004 [cited by applicant]
US 20050081594A1 · Segal · 2005 [cited by applicant]
US 20060005898A1 · Lui et al. · 2006 [cited by applicant]
US 20060027628A1 · Sutherlin et al. · 2006 [cited by applicant]
US 20080029581A1 · Kumagai et al. · 2008 [cited by applicant]
US 20080048005A1 · Forrest et al. · 2008 [cited by applicant]
US 20080202653A1 · Ignberg · 2008 [cited by applicant]
US 20080251571A1 · Burford · 2008 [cited by applicant]
US 20090072007A1 · Nagano · 2009 [cited by applicant]
US 20090269605A1 · Warke et al. · 2009 [cited by applicant]
US 20090291322A1 · Watanabe et al. · 2009 [cited by applicant]
US 20100059151A1 · Iwamura et al. · 2010 [cited by applicant]
US 20100089976A1 · Szymanski et al. · 2010 [cited by applicant]
US 20100132430A1 · Tsai et al. · 2010 [cited by applicant]
US 20110104515A1 · Kou et al. · 2011 [cited by applicant]
US 20110132970A1 · Nakagawa et al. · 2011 [cited by applicant]
US 20110309131A1 · Hovanski et al. · 2011 [cited by applicant]
US 20120006086A1 · Manchiraju et al. · 2012 [cited by applicant]
US 20120052322A1 · Hatakeyama et al. · 2012 [cited by applicant]
US 20120168045A1 · Ihara et al. · 2012 [cited by applicant]
US 20120223451A1 · Hulseman et al. · 2012 [cited by applicant]
US 20120258332A1 · Hatakeyama et al. · 2012 [cited by applicant]
US 20130075452A1 · Burford · 2013 [cited by applicant]
US 20130266467A1 · Manchiraju · 2013 [cited by examiner]
US 20140000332A1 · Wilson et al. · 2014 [cited by applicant]
US 20140002220A1 · Johnson et al. · 2014 [cited by applicant]
US 20140076957A1 · Sayama et al. · 2014 [cited by applicant]
US 20140102159A1 · Denison · 2014 [cited by applicant]
US 20140102161A1 · Stewart · 2014 [cited by applicant]
US 20140248508A1 · Ohhama et al. · 2014 [cited by applicant]
US 20140260489A1 · Funk et al. · 2014 [cited by applicant]
US 20140283574A1 · Lavender et al. · 2014 [cited by applicant]
US 20140291886A1 · Mark et al. · 2014 [cited by applicant]
US 20140328710A1 · Cui et al. · 2014 [cited by applicant]
US 20150075242A1 · Eller et al. · 2015 [cited by applicant]
US 20150115019A1 · Pascal et al. · 2015 [cited by applicant]
US 20150360317A1 · Kalvala et al. · 2015 [cited by applicant]
US 20160008918A1 · Burford · 2016 [cited by applicant]
US 20160151817A1 · Nayfeh et al. · 2016 [cited by applicant]
US 20160151818A1 · Shao · 2016 [cited by applicant]
US 20160167353A1 · Fan et al. · 2016 [cited by applicant]
US 20160175981A1 · Kandasamy · 2016 [cited by applicant]
US 20160175982A1 · Kandasamy et al. · 2016 [cited by applicant]
US 20160184922A1 · Kikyo · 2016 [cited by applicant]
US 20160228932A1 · Hayashi et al. · 2016 [cited by applicant]
US 20160354860A1 · Boettcher et al. · 2016 [cited by applicant]
US 20170008121A1 · Li · 2017 [cited by applicant]
US 20170056947A1 · Lavender et al. · 2017 [cited by applicant]
US 20170136686A1 · Ueno et al. · 2017 [cited by applicant]
US 20170163135A1 · Emberton et al. · 2017 [cited by applicant]
US 20170182587A1 · Tokoro et al. · 2017 [cited by applicant]
US 20170216961A1 · Utter et al. · 2017 [cited by applicant]
US 20170225265A1 · Ito et al. · 2017 [cited by applicant]
US 20170304933A1 · Miles et al. · 2017 [cited by applicant]
US 20170355003A1 · TenHouten et al. · 2017 [cited by applicant]
US 20180036840A1 · Hu et al. · 2018 [cited by applicant]
US 20180043467A1 · Huysmans · 2018 [cited by applicant]
US 20180050419A1 · Das et al. · 2018 [cited by applicant]
US 20180073532A1 · Whalen et al. · 2018 [cited by applicant]
US 20180311713A1 · Joshi et al. · 2018 [cited by applicant]
US 20180354231A1 · Iwase · 2018 [cited by applicant]
US 20180369889A1 · Zhang et al. · 2018 [cited by applicant]
US 20190267153A1 · Kappagantula et al. · 2019 [cited by applicant]
US 20190275608A1 · Das et al. · 2019 [cited by applicant]
US 20210053100A1 · Whalen et al. · 2021 [cited by applicant]
US 20210086291A1 · Okada et al. · 2021 [cited by applicant]
US 20210205918A1 · Fujii et al. · 2021 [cited by applicant]
US 20210252632A1 · Eller et al. · 2021 [cited by applicant]
US 20230081786A1 · Joshi et al. · 2023 [cited by applicant]
US 20230150022A1 · Whalen et al. · 2023 [cited by applicant]
US 20230234115A1 · Kappagantula et al. · 2023 [cited by applicant]
CN 106140847A · 2016 [cited by applicant]
CN 107282671A · 2017 [cited by applicant]
CN 105925846B · 2018 [cited by applicant]
CN 109295332B · 2020 [cited by applicant]
CN 112512710B · 2023 [cited by applicant]
EP 2990178 · 2014 [cited by applicant]
EP 2777837A1 · 2014 [cited by applicant]
GB 1258141 · 1971 [cited by applicant]
JP 2002361320A · 2002 [cited by applicant]
JP 2003275876 · 2003 [cited by applicant]
JP 2004174563 · 2004 [cited by applicant]
JP 2007222925 · 2007 [cited by applicant]
JP 2009090359A · 2009 [cited by applicant]
JP 2019115909A · 2019 [cited by applicant]
KR 101316989B1 · 2013 [cited by applicant]
WO 2019040730 · 2019 [cited by applicant]
WO 2020010331 · 2020 [cited by applicant]
WO 2020053168 · 2020 [cited by applicant]
WO WO2021062415A1 · 2021 [cited by applicant]
WO 2022043532 · 2022 [cited by applicant]
WO 2022056358 · 2022 [cited by applicant]
WO 2023015228 · 2023 [cited by applicant]
WO WO2023177693A1 · 2023 [cited by applicant]
“U.S. Appl. No. 17/033,854, Final Office Action mailed Jun. 7, 2023”, 11 pgs. [cited by applicant]
“U.S. Appl. No. 17/035,597, Final Office Action mailed May 10, 2023”, 13 pgs. [cited by applicant]
“U.S. Appl. No. 17/473,178, Non Final Office Action mailed Feb. 8, 2023”, 22 pgs. [cited by applicant]
“U.S. Appl. No. 17/826,054, Preliminary Amendment filed Jul. 13, 2023”, 9 pgs. [cited by applicant]
“International Application Serial No. PCT US2023 015228, International Search Report mailed Jun. 15, 2023”, 5 pgs. [cited by applicant]
“International Application Serial No. PCT US2023 015228, Written Opinion mailed Jun. 15, 2023”, 6 pgs. [cited by applicant]
“International Application Serial No. PCT US2021 050022, International Preliminary Report on Patentability mailed Dec. 1, 2022”, 18 pgs. [cited by applicant]
“U.S. Appl. No. 17/033,854, Response filed Aug. 7, 2023 to Final Office Action mailed Jun. 7, 2023”, 9 pgs. [cited by applicant]
“U.S. Appl. No. 17/033,854, Advisory Action mailed Aug. 16, 2023”, 4 pgs. [cited by applicant]
“U.S. Appl. No. 17/035,597, Non Final Office Action mailed Aug. 28, 2023”, 10 pgs. [cited by applicant]
“U.S. Appl. No. 17/242,166, Final Office Action mailed Aug. 30, 2023”, 7 pgs. [cited by applicant]
“European Application Serial No. 19745460.6, Response filed Sep. 18, 2023 to Communication Pursuant to Article 94(3) EPC mailed May 10, 2023”, 9 pgs. [cited by applicant]
“European Application Serial No. 19745460.6, Communication Pursuant to Article 94(3) EPC mailed May 10, 2023”, 6 pgs. [cited by applicant]
“CN 201980045070X Office Action mailed Sep. 6, 2022”, with English translation, 13 pages. [cited by applicant]
“CN 201980045070X Response mailed Apr. 11, 2023 to Office Action Sep. 6, 2022”, with English claims, 8 pages. [cited by applicant]
U.S. Appl. No. 14/222,468, filed Mar. 21, 2014, System and Process for Formation of Extrusion Structures. [cited by applicant]
U.S. Appl. No. 15/351,201 U.S. Pat. No. 10,189,063, filed Nov. 14, 2016, System and Process for Formation of Extrusion Products. [cited by applicant]
U.S. Appl. No. 62/460,227, filed Feb. 17, 2017, Functionally Graded Coatings and Claddings. [cited by applicant]
U.S. Appl. No. 15/898,515 U.S. Pat. No. 10,695,811, filed Feb. 17, 2018, Functionally Graded Coatings and Claddings. [cited by applicant]
U.S. Appl. No. 16/916,548 U.S. Pat. No. 11,517,952, filed Jun. 30, 2020, Shear Assisted Extrusion Process. [cited by applicant]
U.S. Appl. No. 16/028,173 U.S. Pat. No. 11,045,851, filed Jul. 5, 2018, Method for Forming Hollow Profile Non-Circular Extrusions Using Shear Assisted Processing and Extrusion (Shape). [cited by applicant]
U.S. Appl. No. 17/175,464 U.S. Pat. No. 11,534,811, filed Feb. 12, 2021, Method For Forming Hollow Profile Non-Circular Extrusions Using Shear Assisted Processing and Extrusion (Shape). [cited by applicant]
U.S. Appl. No. 16/562,314 U.S. Pat. No. 11,383,280, filed Sep. 5, 2019, Devices and Methods For Performing Shear-Assisted Extrusion, Extrusion Feedstocks, Extrusion Processes, and Methods For Preparing Metal Sheets. [cited by applicant]
U.S. Appl. No. 17/985,611, filed Nov. 11, 2022, Method For Forming Hollow Profile Non-Circular Extrusions Using Shear Assisted Processing and Extrusion (Shape). [cited by applicant]
U.S. Appl. No. 17/826,054, filed May 26, 2022, Devices and Methods For Performing Shear-Assisted Extrusion, Extrusion Feedstocks, Extrusion Processes, And Methods For Preparing Metal Sheets. [cited by applicant]
U.S. Appl. No. 17/665,433, U.S. Pat. No. 11,684,959, filed Feb. 4, 2022, Extrusion Processes For Forming Extrusions of a Desired Composition From a Feedstock. [cited by applicant]
U.S. Appl. No. 17/033,854, filed Sep. 27, 2020, Devices and Methods For Performing Shear-Assisted Extrusion and Extrusion Processes. [cited by applicant]
U.S. Appl. No. 17/874,140, filed Jul. 26, 2022, Devices and Methods For Performing Shear-Assisted Extrusion and Extrusion Processes. [cited by applicant]
U.S. Appl. No. 17/035,597, filed Sep. 28, 2020, Shape Processes, Feedstock Materials, Conductive Materials and/or Assemblies. [cited by applicant]
U.S. Appl. No. 17/242,166, filed Apr. 27, 2021, Devices and Methods For Performing Shear-Assisted Extrusion and Extrusion Processes. [cited by applicant]
U.S. Appl. No. 17/957,207, filed Sep. 30, 2022, Devices and Methods For Performing Shear-Assisted Extrusion and Extrusion Processes. [cited by applicant]
U.S. Appl. No. 17/473,178, filed Sep. 13, 2021, Devices and Methods For Performing Shear-Assisted Extrusion and Extrusion Processes. [cited by applicant]
U.S. Appl. No. 18/093,636, filed Jan. 5, 2023, Devices and Methods For Performing Shear-Assisted Extrusion and Extrusion Processes. [cited by applicant]
U.S. Appl. No. 18/121,563, filed Mar. 14, 2023, Extrusion Prcesses, Feedstock Materials, Conductive Materials and/or Assemblies. [cited by applicant]
WO PCT/US2023/015228 Search Rpt, Jun. 15, 2023, Battelle Memorial Institute. [cited by applicant]
WO PCT/US2023/015228 Written Opin, Jun. 15, 2023, Battelle Memorial Institute. [cited by applicant]
WO PCT/US22/43532 Search Rept, Jan. 12, 2023, Battelle Memorial Institute. [cited by applicant]
WO PCT/US22/43532 Written Opin, Jan. 12, 2023, Battelle Memorial Institute. [cited by applicant]
WO PCT/US2021/050022 IPRP, Dec. 1, 2022, Battelle Memorial Institute. [cited by applicant]
WO PCT/US2019/040730 IPRP, Jan. 5, 2021, Battelle Memorial Institute. [cited by applicant]
WO PCT/US2019/040730 SR, Oct. 21, 2019, Battelle Memorial Institute. [cited by applicant]
WO PCT/US2019/040730 WO, Oct. 21, 2019, Battelle Memorial Institute. [cited by applicant]
WO PCT/US2020/053168 IPRP, Apr. 7, 2022, Battelle Memorial Institute. [cited by applicant]
WO PCT/US2020/053168 Search Rpt, Feb. 8, 2021, Battelle Memorial Institute. [cited by applicant]
WO PCT/US2020/053168 Written Opin, Feb. 8, 2021, Battelle Memorial Institute. [cited by applicant]
WO PCT/US2021/050022 Search Rpt, Feb. 3, 2022, Battelle Memorial Institute. [cited by applicant]
WO PCT/US2021/050022 Written Opin, Feb. 3, 2022, Battelle Memorial Institute. [cited by applicant]
Abu-Farha, “A Preliminary Study on the Feasibility of Friction Stir Back Extrusion”, Scripta Materials, 66, 2012, United States, 615-618. [cited by applicant]
Amancio-Filho et al., “Joining of Polymers and Polymer-Metal Hybrid Structures: Recent Developments and Trends”, Polymer Engineering & Science, 2009, United States, pp. 1461-1476. [cited by applicant]
Bozzi et al., “Intermetallic Compounds in Al 6016/IF-Steel Friction Stir Spot Welds”, Materials Science and Engineering, 2010, Netherlands, pp. 4505-4509. [cited by applicant]
Cole et al., “Lightweight materials for Automotive Applications”, Materials Characterization, 35, 1995, United States, pp. 3-9. [cited by applicant]
Evans et al., “Friction Stir Extrusion: A new process for joining dissimilar materials”, Manufacturing Letters, 5, 2015, United States, pp. 25-28. [cited by applicant]
Gann, J.A., “Magnesium Industry's Lightest Structural Metal”, SAE Transactions, vol. 25-26, 1930-1931, United States, pp. 620-634, 641. [cited by applicant]
Hammond et al., “Equal-Channel Angular Extrusion of a Low-Density High-Entropy Alloy Produced by High-Energy Cryogenic Mechanical Alloying”, JOM. vol. 66, No. 10, United States, 2014, pp. 2021-2029. [cited by applicant]
Kaiser et al., “Anisotropic Properties of Magnesium Sheet AZ31”, Materials Science Forum, vols. 419-422, Switzerland, 2003, pp. 315-320. [cited by applicant]
Kuo et al., “Fabrication of High Performance Magnesium/Carbon-Fiber/PEEK/Laminated Composites”, Materials Transactions, vol. 44, No. 8 (2003), Japan, pp. 1613-1619. [cited by applicant]
Leitao et al., “Aluminum-steel lap joining by multipass friction stir welding”, Materials and Design, 106, 2016, United States, pp. 153-160. [cited by applicant]
Liu et al., “A Review of Dissimilar Welding Techniques for Magnesium Alloys to Aluminum Alloys”, Materials, 7, 2014, United States, pp. 3735-3757. [cited by applicant]
Liu et al., “Microstructure and mechanical properties of equimolar FeCoCrNi high entropy alloy prepared via powder extrusion”, Intermetallics 75 (2016) , United States, pp. 25-30. [cited by applicant]
Luo, Alan, “Magnesium: Current and Potential Automotive Applications”, JOM, 54(2), 2002, United States, pp. 42-48. [cited by applicant]
Martinsen et al., “Joining of Dissimilar Materials”, CIRP Annals - Manufacturing Technology, 2015, United States, 21 pages. [cited by applicant]
Nakamura et al., “Tool Temperature and Process Modeling of Friction Stir Welding”, (2018) Modern Mechanical Engineering, 8, 78-94. [cited by applicant]
Office Action for U.S. Appl. No. 14/222,468, filed Mar. 21, 2014, First named inventor Curtis A. Lavender, Notification date Nov. 6, 2015, 10 pages. [cited by applicant]
Office Action for U.S. Appl. No. 14/222,468, filed Mar. 21, 2014, First named inventor Curtis A. Lavender, Notification date Apr. 1, 2016, 10 pages. [cited by applicant]
Office Action for U.S. Appl. No. 14/222,468, filed Mar. 21, 2014, First named inventor Curtis A. Lavender, Notification date May 20, 2016, 3 pages. [cited by applicant]
Office Action for U.S. Appl. No. 14/222,468, filed Mar. 21, 2014, First named inventor Curtis A. Lavender, Notification date Jan. 26, 2017, 9 pages. [cited by applicant]
Office Action for U.S. Appl. No. 14/268,220, filed May 2, 2014, First Named Inventor Jun Cui, Notification date Dec. 1, 2015, 7 pages. [cited by applicant]
Pickens, “Aluminum Powder Metallurgy Technology for High-Strength Applications”, Journal of Materials Science 16 (1981) 1437-1457, United Kingdom, 21 pages. [cited by applicant]
Rodewald et al. “Top Nd—Fe—B Magnets with Greater Than 56 MGOe Energy Density and 9.8 kOe Coercivity”, IEEE Transactions on Magnetics, vol. 38, No. 5, 2002, United States, pp. 2955-2957. [cited by applicant]
Saha, “Aluminum Extrusion Technology, Chapter 1, Fundamentals of Extrusion”, The Materials Information Society, ASM International, 2000, United States, pp. 1-29. [cited by applicant]
Thomasnet.com, https:/www.thomasnet.com/articles/custom-manufacturing-fabricating/friction-stir-welding/ Feb. 10, 2011 (Year: 2011). [cited by applicant]
Trang et al., “Designing a Magnesium Alloy with High Strength and High Formability”, Nature Communications, 2018, United Kingdom, 6 pages. [cited by applicant]
Whalen et al., “High Ductility Aluminum Alloy Made from Powder by Friction Extrusion”, Materalia 6 (2019) 100260, Netherlands, 6 pages. [cited by applicant]
Whalen et al., U.S. Appl. No. 15/694,565, filed Sep. 1, 2017, titled “System and Process for Joining Dissimilar Materials and Solid-State Interocking Joint with Intermetallic Interface Formed Thereby”, 69 pages. [cited by applicant]
Zhang et al., “Numerical Studies on Effect of Axial Pressure in Friction Stir Welding”, (2007) Science and Technology of Welding and Joining, vol. 12, No. 3, United Kingdom, pp. 226-248. [cited by applicant]
“European Application Serial No. 21867741.7, Response to Communication Pursuant to Rules 161 and 162 EPC filed Oct. 16, 2023”, 15 pgs. [cited by applicant]
“U.S. Appl. No. 17/473,178, Final Office Action mailed Oct. 20, 2023”, 9 pgs. [cited by applicant]
“U.S. Appl. No. 17/473,178, Response filed Dec. 20, 2023 to Final Office Action mailed Oct. 20, 2023”, 11 pgs. [cited by applicant]
“U.S. Appl. No. 17/473,178, Response filed Jul. 10, 2023 to Non Final Office Action mailed Feb. 8, 2023”, 13 pgs. [cited by applicant]
“U.S. Appl. No. 18/093,636, Restriction Requirement mailed Dec. 20, 2023”, 6 pgs. [cited by applicant]
“U.S. Appl. No. 17/473,178, Advisory Action mailed Jan. 3, 2024”, 3 pgs. [cited by applicant]
“U.S. Appl. No. 17/473,178, Non Final Office Action mailed Jan. 3, 2024”, 10 pgs. [cited by applicant]
“Chinese Application Serial No. 202311192831.9, Response filed Dec. 28, 2023 to Notification to Make Rectification issued Nov. 1, 2023”, with English claims, 21 pages. [cited by applicant]
“European Application Serial No. 19745460.6, Summons to attend oral proceedings pursuant to Rule 115(1) EPC mailed Jan. 4, 2024”, 6 pgs. [cited by applicant]
“Canadian Application Serial No. 3,105,375 Examiners Rule 86 2 Requisition mailed Dec. 28, 2023”, 7 pgs. [cited by applicant]
“Chinese Application Serial No. 202180062766.0, Voluntary Amendment filed Nov. 13, 2023”, with English claims, 91 pages. [cited by applicant]
“Canadian Application Serial No. 3,192,375, Voluntary Amendment filed Dec. 28, 2023”, 59 pgs. [cited by applicant]
“U.S. Appl. No. 17/035,597, Response filed Feb. 28, 2024 to Non Final Office Action mailed Aug. 28, 2023”, 10 pgs. [cited by applicant]
“U.S. Appl. No. 17/033,854, Non Final Office Action mailed Oct. 4, 2023”, 11 pgs. [cited by applicant]
“U.S. Appl. No. 17/033,854, Response filed Mar. 7, 2024 to Non Final Office Action mailed Oct. 4, 2023”, 10 pgs. [cited by applicant]
“U.S. Appl. No. 17/826,054, Non Final Office Action mailed Mar. 8, 2024”, 13 pgs. [cited by applicant]
“U.S. Appl. No. 17/874,140, Non Final Office Action mailed Mar. 20, 2024”, 10 pgs. [cited by applicant]
“U.S. Appl. No. 14/222,468, Non-Final Office Action mailed Nov. 6, 2015”, 10 pgs. [cited by applicant]
“U.S. Appl. No. 17/033,854, Advisory Action mailed Jun. 5, 2024”, 4 pgs. [cited by applicant]
“U.S. Appl. No. 17/033,854, Examiner Interview Summary mailed Jul. 30, 2024”, 3 pgs. [cited by applicant]
“U.S. Appl. No. 17/033,854, Final Office Action mailed Mar. 28, 2024”, 12 pgs. [cited by applicant]
“U.S. Appl. No. 17/033,854, Response filed May 28, 2024 to Final Office Action mailed Mar. 28, 2024”, 13 pgs. [cited by applicant]
“U.S. Appl. No. 17/033,854, Response filed Aug. 23, 2024 to Advisory Action mailed Jun. 5, 2024”, 17 pgs. [cited by applicant]
“U.S. Appl. No. 17/035,597, Examiner Interview Summary mailed Aug. 22, 2024”, 3 pgs. [cited by applicant]
“U.S. Appl. No. 17/035,597, Final Office Action mailed Apr. 17, 2024”, 23 pgs. [cited by applicant]
“U.S. Appl. No. 17/035,597, Non Final Office Action mailed Sep. 6, 2024”, 19 pgs. [cited by applicant]
“U.S. Appl. No. 17/035,597, Response filed Aug. 19, 2024 to Final Office Action mailed Apr. 17, 2024”, 17 pgs. [cited by applicant]
“U.S. Appl. No. 17/035,597, Response filed Sep. 11, 2023 to Non Final Office Action mailed Aug. 28, 2023”, 61 pgs. [cited by applicant]
“U.S. Appl. No. 17/473,178, Final Office Action mailed Jun. 14, 2024”, 21 pgs. [cited by applicant]
“U.S. Appl. No. 17/473,178, Non Final Office Action mailed Feb. 28, 2024”, 19 pgs. [cited by applicant]
“U.S. Appl. No. 17/473,178, Response filed Apr. 11, 2024 to Non Final Office Action mailed Jan. 3, 2024”, 8 pgs. [cited by applicant]
“U.S. Appl. No. 17/473,178, Response filed May 28, 2024 to Non Final Office Action mailed Feb. 28, 2024”, 10 pgs. [cited by applicant]
“U.S. Appl. No. 17/826,054, Examiner Interview Summary mailed Jul. 30, 2024”, 3 pgs. [cited by applicant]
“U.S. Appl. No. 17/826,054, Response filed Aug. 8, 2024 to Non Final Office Action mailed Mar. 8, 2024”, 13 pgs. [cited by applicant]
“U.S. Appl. No. 17/957,207, Final Office Action mailed Jun. 12, 2024”, 13 pgs. [cited by applicant]
“U.S. Appl. No. 17/985,611, Non Final Office Action mailed Mar. 27, 2024”, 10 pgs. [cited by applicant]
“U.S. Appl. No. 18/093,636, Non Final Office Action mailed Jun. 14, 2024”, 14 pgs. [cited by applicant]
“U.S. Appl. No. 18/093,636, Response filed Apr. 5, 2024 to Restriction Requirement mailed Dec. 20, 2023”, 6 pgs. [cited by applicant]
“Canadian Application No. 3155420, Examiners Rule 862 Requisition Report Consolidated Correspondence Jul. 20, 2023”, 5 pgs. [cited by applicant]
“Canadian Application No. 3155420, Examiners Rule mailed May 11, 2023”, 4 pgs. [cited by applicant]
“Canadian Application Serial No. 3,105,375, Response filed Apr. 26, 2024 to Examiners Rule 86 2 Requisition mailed Dec. 28, 2023”, 27 pgs. [cited by applicant]
“Canadian Application Serial No. 3,155,420, Examiners Rule 862 Requisition Report Apr. 18, 2024”, 3 pgs. [cited by applicant]
“European Application Serial No. 19745460.6, Response filed Jun. 20, 2024 to Summons to attend oral proceedings pursuant to Rule 115(1) EPC mailed Jan. 4, 2024”, 12 pgs. [cited by applicant]
“European Application Serial No. 20869757, Extended European Search Report mailed Sep. 19, 2023”, 10 pgs. [cited by applicant]
“European Application Serial No. 20869757, Response filed Apr. 12, 2024 to Extended European Search Report mailed Sep. 19, 2023”, 13 pgs. [cited by applicant]
“European Application Serial No. 20869757.3, Communication Pursuant to Article 94(3) EPC mailed Sep. 4, 2024”, 6 pgs. [cited by applicant]
“European Application Serial No. 21867741.7, Extended European Search Report mailed Aug. 12, 2024”, 8 pgs. [cited by applicant]
“International Application Serial No. PCT/US2019/040730, International Preliminary Report on Patentability mailed Jan. 5, 2021”, 8 pgs. [cited by applicant]
“International Application Serial No. PCT/US2019/040730, International Search Report mailed Oct. 21, 2019”, 4 pgs. [cited by applicant]
“International Application Serial No. PCT/US2019/040730, Written Opinion mailed Oct. 21, 2019”, 7 pgs. [cited by applicant]
“International Application Serial No. PCT/US2020/05168 International Search Report mailed Feb. 8, 2021”, 5 pgs. [cited by applicant]
“International Application Serial No. PCT/US2020/05168 Written Opinion mailed Feb. 8, 2021”, 6 pgs. [cited by applicant]
“International Application Serial No. PCT/US2020/053168, International Preliminary Report on Patentability mailed Apr. 7, 2022”, 8 pgs. [cited by applicant]
“International Application Serial No. PCT/US2021/050022, International Preliminary Report on Patentability mailed Dec. 1, 2022”, 17 pgs. [cited by applicant]
“International Application Serial No. PCT/US2021/050022, International Search Report mailed Feb. 3, 2022”, 5 pgs. [cited by applicant]
“International Application Serial No. PCT/US2021/050022, Written Opinion mailed Feb. 3, 2022”, 6 pgs. [cited by applicant]
“U.S. Appl. No. 17/033,854, Notice of Allowance mailed Sep. 20, 2024”, 16 pgs. [cited by applicant]
“U.S. Appl. No. 17/874,140, Response filed Sep. 16, 2024 to Non Final Office Action mailed Mar. 20, 2024”, 15 pgs. [cited by applicant]
“U.S. Appl. No. 17/985,611, Response filed Sep. 17, 2024 to Non Final Office Action mailed Mar. 27, 2024”, 12 pgs. [cited by applicant]
“Canadian Application Serial No. 3,155,420, Response filed Aug. 13, 2024 to Examiners Rule 862 Requisition Report Apr. 18, 2024”, 10 pages. [cited by applicant]
“Application Serial No. PCT US2023 015228, IPRP mailed Sep. 26, 2024”, 11 pages. [cited by applicant]
“U.S. Appl. No. 17/957,207, Response filed Oct. 14, 2024 to Final Office Action mailed Jun. 12, 2024”, 14 pages. [cited by applicant]
“U.S. Appl. No. 17/473,178, Response filed Oct. 14, 2024 to Final Office Action mailed Jun. 14, 2024”, 14 pages. [cited by applicant]
“U.S. Appl. No. 18/093,636, Response filed Oct. 14, 2024 to Non Final Office Action mailed Jun. 14, 2024”, 14 pages. [cited by applicant]
“U.S. Appl. No. 17/473,178, Examiner Interview Summary mailed Oct. 16, 2024”, 3 pages. [cited by applicant]
“U.S. Appl. No. 17/826,054, Final Office Action mailed Oct. 18, 2024”, 14 pages. [cited by applicant]
U.S. Appl. No. 18/426,042, filed Jan. 29, 2024, Devices and Methods For Performing Shear-Assisted Extrusion and Extrusion Processes. [cited by applicant]
“U.S. Appl. No. 17/957,207, Response filed Nov. 8, 2024 to Advisory Action mailed Oct. 31, 2024 and Final Office Action mailed Jun. 12, 2024”, 16 pages. [cited by applicant]
“U.S. Appl. No. 17/957,207, Advisory Action mailed Oct. 31, 2024”, 3 pages. [cited by applicant]
“U.S. Appl. No. 17/473,178, Advisory Action mailed Oct. 31, 2024”, 3 pages. [cited by applicant]
“U.S. Appl. No. 17/473,178, Response filed Nov. 8, 2024 to Advisory Action mailed Oct. 31, 2024 and Final Office Action Jun. 14, 2024”, 14 pages. [cited by applicant]
“Canadian Application Serial No. 3,105,375, Examiners Rule 86(2) Report mailed Nov. 6, 2024”, 9 pages. [cited by applicant]
“U.S. Appl. No. 17/874,140, Final Office Action mailed Nov. 15, 2024”, 11 pages. [cited by applicant]
“U.S. Appl. No. 17/035,597, Response filed Feb. 6, 2025 to Non Final Office Action mailed Sep. 6, 2024”, 8 pgs. [cited by applicant]
“U.S. Appl. No. 17/826,054, Response filed Jan. 6, 2025 to Final Office Action mailed Oct. 18, 2024”, 9 pgs. [cited by applicant]
“U.S. Appl. No. 17/985,611, Final Office Action mailed Dec. 5, 2024”, 15 pgs. [cited by applicant]
“U.S. Appl. No. 18/093,636, Final Office Action mailed Jan. 13, 2025”, 12 pgs. [cited by applicant]
“European Application Serial No. 20869757.3, Response filed Jan. 3, 2025 to Communication Pursuant to Article 94(3) EPC mailed Sep. 4, 2024”, 10 pgs. [cited by applicant]
“JP-2002361320-A Translation provided by FIT database”, Retrieved from Patent Center, (Year: 2025), 8 pages. [cited by applicant]
X, Li, et al., “CN-105925846-B translation provided by FIT database (Year: 2024)”, (Feb. 23, 2018), 12 pgs. [cited by applicant]